JPS6331550U - - Google Patents

Info

Publication number
JPS6331550U
JPS6331550U JP1986125599U JP12559986U JPS6331550U JP S6331550 U JPS6331550 U JP S6331550U JP 1986125599 U JP1986125599 U JP 1986125599U JP 12559986 U JP12559986 U JP 12559986U JP S6331550 U JPS6331550 U JP S6331550U
Authority
JP
Japan
Prior art keywords
integrated circuit
light
line sensor
substrate
receiving elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986125599U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986125599U priority Critical patent/JPS6331550U/ja
Publication of JPS6331550U publication Critical patent/JPS6331550U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図および第３図は本考案実施例で
作成したラインセンサーの概略を示す断面図、一
部切りかき部を含む側面図および平面図であり、
第４図および第５図は従来のラインセンサーの概
略を示す断面図および平面図である。 FIGS. 1, 2, and 3 are a cross-sectional view, a side view including a partially cut portion, and a plan view schematically showing a line sensor made according to an embodiment of the present invention,
FIGS. 4 and 5 are a cross-sectional view and a plan view schematically showing a conventional line sensor.

Claims (1)

【実用新案登録請求の範囲】 (1) 直線状にならんだ薄膜半導体受光素子と該
受光素子の情報を読み取る集積回路が同一基板上
に設けられたラインセンサーにおいて、該直線状
受光素子を基板の端面に設けると共に該集積回路
を基板の上面に設けたことを特徴とするラインセ
ンサー。 (2) 集積回路から受光素子への接続が基板上に
設けられた薄膜電極を用いて行なわれている実用
新案登録請求の範囲第１項記載のラインセンサー
。[Claims for Utility Model Registration] (1) In a line sensor in which linear thin-film semiconductor light-receiving elements and an integrated circuit for reading information from the light-receiving elements are provided on the same substrate, the linear light-receiving elements are arranged on the same substrate. A line sensor characterized in that the integrated circuit is provided on an end surface and the integrated circuit is provided on an upper surface of a substrate. (2) The line sensor according to claim 1, wherein the integrated circuit is connected to the light receiving element using a thin film electrode provided on the substrate.
JP1986125599U 1986-08-18 1986-08-18 Pending JPS6331550U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986125599U JPS6331550U (en) 1986-08-18 1986-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986125599U JPS6331550U (en) 1986-08-18 1986-08-18

Publications (1)

Publication Number Publication Date
JPS6331550U true JPS6331550U (en) 1988-03-01

Family

ID=31018633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986125599U Pending JPS6331550U (en) 1986-08-18 1986-08-18

Country Status (1)

Country Link
JP (1) JPS6331550U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648183A (en) * 1979-09-26 1981-05-01 Ricoh Co Ltd Photosensor
JPS60119165A (en) * 1983-12-01 1985-06-26 Ricoh Co Ltd Production of one-dimensional image sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648183A (en) * 1979-09-26 1981-05-01 Ricoh Co Ltd Photosensor
JPS60119165A (en) * 1983-12-01 1985-06-26 Ricoh Co Ltd Production of one-dimensional image sensor

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