JPS63176443A - High-strength copper alloy for lead frame and its production - Google Patents
High-strength copper alloy for lead frame and its productionInfo
- Publication number
- JPS63176443A JPS63176443A JP659087A JP659087A JPS63176443A JP S63176443 A JPS63176443 A JP S63176443A JP 659087 A JP659087 A JP 659087A JP 659087 A JP659087 A JP 659087A JP S63176443 A JPS63176443 A JP S63176443A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- rolled
- alloy
- copper
- cold rolling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 8
- 238000011282 treatment Methods 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 15
- 230000032683 aging Effects 0.000 claims abstract description 14
- 238000005097 cold rolling Methods 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 6
- 229910045601 alloy Inorganic materials 0.000 abstract description 25
- 239000000956 alloy Substances 0.000 abstract description 25
- 239000000463 material Substances 0.000 abstract description 24
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 9
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 abstract description 7
- 229910001000 nickel titanium Inorganic materials 0.000 abstract description 7
- 239000011159 matrix material Substances 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 3
- 238000009749 continuous casting Methods 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 26
- 238000007747 plating Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000002244 precipitate Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 229910004353 Ti-Cu Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は８半導体集積回路などに使用されるリードフレ
ーム材として好適な高強度高伝導型銅基台金に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high-strength, high-conductivity copper base metal suitable as a lead frame material used in 8 semiconductor integrated circuits and the like.
半導体素子の高集積化技術の飛Ｙｒａ的な進展から１Ｍ
ビットＤＲＡＭや２５６にビットＳＲＡＭなどノＶＬＳ
Ｉが現実のものとなりつつある。このようなＶＬＳＩの
開発に伴って、使用されるリードフレーム材に要求され
る性能も一段と厳しくなっており、従来のリードフレー
ム材ではこの要求に対応しきれなくなってきたのが実情
である。1M due to rapid progress in high integration technology of semiconductor devices
VLS such as bit DRAM, 256 bit SRAM, etc.
I is becoming a reality. With the development of such VLSI, the performance required of the lead frame materials used has become even more severe, and the reality is that conventional lead frame materials are no longer able to meet these demands.
例えば高集積化により熱の発生が大量となるのでそのリ
ードフレーム材は高い熱伝導性および熱放散性が必要と
なる。また、リードフレームのり−ドピンも５例えば従
来の厚さ０．２５ｍｍ、 ピン間隔２．５ｍｍから、
厚さ０．１５ｍｍ、 ビン間隔１．２５ｍｍへと。For example, higher integration generates a large amount of heat, so the lead frame material needs to have high thermal conductivity and heat dissipation. In addition, the lead frame glued pins have changed from the conventional thickness of 0.25 mm and pin spacing of 2.5 mm, for example.
Thickness is 0.15mm and bottle spacing is 1.25mm.
より薄く且つより狭いものへと変わってくるであろうが
、それにつれて１強度、スティフ不ス、繰り返し曲げ性
および折り曲げ性などに対する信耕性が重要となってく
る。更に、リードフレームは必要に応じて恨メッキや半
田メッキが施されるので、メッキ性が良好で且つ加熱時
および曲げ加工時にそのメッキが剥離しないことが必要
である。As materials become thinner and narrower, reliability in terms of strength, stiffness resistance, repeated bendability, bendability, etc. will become important. Furthermore, since the lead frame is coated with heat plating or solder plating as necessary, it is necessary that the plating properties are good and that the plating does not peel off during heating and bending.
また、リードフレームはチップ装着時や封止時に加熱工
程を経るので軟化温度の高い材料であることも要求され
る。Furthermore, since the lead frame undergoes a heating process during chip mounting and sealing, it is also required to be made of a material with a high softening temperature.
従来より各種のリードフレーム材が捷案されているが５
強度を高めると伝導性が不足したり、伝導性を高めると
強度や軟化温度の点で不足したりして、この様な高集積
化の要求に満足に応じられる大きく諸特性を併せて具備
する材料を得ることには種々の問題があった。Various lead frame materials have been devised in the past, but 5
If the strength is increased, the conductivity may be insufficient, and if the conductivity is increased, the strength or softening temperature may be insufficient, so it is necessary to have a variety of characteristics that can satisfactorily meet the demands for high integration. There were various problems in obtaining the materials.
本発明は、最近のＶＬＳＩの進歩に伴なってリードフレ
ーム材に要求される諸特性を兼備したリードフレーム材
の開発を目的としたものであり、より具体的には１強度
と伝導性が共に良好で、折り曲げ性、半田付は性、耐熱
性（軟化温度）、硬さなどの特性に優れた高強度高伝導
型のリードフレーム用高強度銅合金の提供を目的とした
ものである。The purpose of the present invention is to develop a lead frame material that has both the characteristics required for lead frame materials in line with the recent progress in VLSI, and more specifically, to develop lead frame materials that have both strength and conductivity. The purpose of the present invention is to provide a high-strength, high-conductivity type high-strength copper alloy for lead frames that has excellent properties such as good bendability, solderability, heat resistance (softening temperature), and hardness.
前記の目的を達成せんとする本発明の要旨とするところ
は２重量％において、Ｎｉ：１．０〜４．０％。The gist of the present invention, which aims to achieve the above object, is that Ni: 1.0 to 4.0% at 2% by weight.
Ｔｉ；０．５〜２．０％、ただし、Ｎｉ／Ｔｉの重量百
分率の比率が１．２〜３．３の範囲、 Ｚ ｒ ：
０．０１〜０．５％。Ti; 0.5 to 2.0%, provided that the Ni/Ti weight percentage ratio is in the range of 1.2 to 3.3, Z r :
0.01-0.5%.
０□含有量が３０ｐｐｍ以下、残部がＣｕおよび不可避
的不純物からなるリードフレーム用高強度銅合金に存す
る。 ゛
本発明の！ｌｉ４基合金の基本的な特徴は、Ｎｉおよび
Ｔｉの適量の添加によってＮｉ−Ｔｉ系金属間化合物を
均一微細にＣｕマトリックス中に析出させた＆ｆｌ織と
し、これによって前記の目的を達成した点にある。この
リードフレーム用高強度銅合金を有利に製造する方法と
して、さらに本発明は。The content of 0□ is 30 ppm or less, and the balance is Cu and inevitable impurities in a high-strength copper alloy for lead frames.゛This invention! The basic feature of the Li4-based alloy is that it has a &fl texture in which Ni-Ti intermetallic compounds are uniformly and finely precipitated in a Cu matrix by adding appropriate amounts of Ni and Ti, and this achieves the above purpose. be. The present invention further provides a method for advantageously manufacturing this high-strength copper alloy for lead frames.
重量％において、Ｎｉ：１．０〜４．０％、Ｔｉ；０．
５〜２．０％、ただし、Ｎｉ／Ｔｉの重量百分率の比率
が１．２〜３．３の範囲、 Ｚｒ ： ０．０１〜０
．５％、０□含有量が３０ｐｐｍ以下、残部がＣｕおよ
び不可避的不純物からなる銅合金の板素材を製造し、こ
れを９００℃−以上の温度で溶体化処理し、最終板厚ま
で冷間圧延したあと９次いで４００〜６００℃の温度で
５〜７２０分間の時効処理を行なうことを特徴とするリ
ードフレーム用高強度銅合金の製造法を提供するもので
ある。In weight%, Ni: 1.0 to 4.0%, Ti: 0.
5 to 2.0%, provided that the Ni/Ti weight percentage ratio is in the range of 1.2 to 3.3, Zr: 0.01 to 0
．． 5%, 0□ content is 30 ppm or less, and the balance is Cu and unavoidable impurities.The material is solution-treated at a temperature of 900℃ or higher, and then cold-rolled to the final thickness. The present invention provides a method for producing a high-strength copper alloy for a lead frame, which is characterized in that after that, an aging treatment is performed at a temperature of 400 to 600° C. for 5 to 720 minutes.
以下に１本発明合金の添加元素の含有量の範囲選定理由
、更には製造法の製造条件について個別に説明する。Below, the reason for selecting the content range of the additive element of the alloy of the present invention and the manufacturing conditions of the manufacturing method will be individually explained.
本発明の銅基合金はＮｉ−Ｔｉ系金属間化合物による析
出強化および分散強化を図った点に基本的な特徴があり
、このためにＮｉとＴｉは本発明合金において不可欠の
元素である。The basic feature of the copper-based alloy of the present invention is that precipitation strengthening and dispersion strengthening are achieved by Ni--Ti intermetallic compounds, and for this purpose Ni and Ti are essential elements in the alloy of the present invention.
Ｔｉ含有量は０．５％（重量％、以下同じ）未満ではＮ
ｉとの共存下でも強度、耐熱性の向上効果が少ない、一
方、Ｔｉ含有量が２．０％を超えると析出物が過度に多
くなって合金の延性、折り曲げ性、メッキ性を低下させ
る。したがって３本発明合金のＴｉ含有量は０．５〜２
．０％の範囲とする。If the Ti content is less than 0.5% (wt%, the same applies hereinafter), N
Even in the presence of Ti, the effect of improving strength and heat resistance is small. On the other hand, if the Ti content exceeds 2.0%, the amount of precipitates increases excessively, reducing the ductility, bendability, and plating properties of the alloy. Therefore, the Ti content of the three invention alloys is 0.5 to 2.
．． The range is 0%.
Ｎｉは＋Ｔｉと化合物を形成し１強度および耐熱性の向
上に寄与する元素である。また、鋳造組織および熱間組
織を微細にし且つ溶体化処理時の結晶粒粗大化を防止す
る効果がある。このような効果を発揮するには、１．０
％以上の含有が必要であるが、４．０％を超えて含有す
ると、電気および熱の伝導性の低下が顕著となる。した
がってＮｉ含有量は１．０〜４．０％の範囲とする。Ni is an element that forms a compound with +Ti and contributes to improving strength and heat resistance. It also has the effect of making the casting structure and hot structure finer and preventing grain coarsening during solution treatment. To achieve this effect, 1.0
% or more, but if the content exceeds 4.0%, the electrical and thermal conductivity decreases significantly. Therefore, the Ni content is in the range of 1.0 to 4.0%.
また、ＮｉとＴｉはＮｉ−Ｔｉ系金属間化合物として析
出するときに本発明の目的が達成される。このＮ１−Ｔ
ｉ系金属間化合物の析出による強化を十分に発揮するに
は、Ｎｉ／Ｔｉの重量百分率による比率を１．２〜３．
３の範囲にすることが必要であることがわかった。Ｎｉ
／Ｔｉ比が１．２より小さい場合にはＴｉとＣｕとの化
合物であるＴｉ−Ｃｕ系金属間化合物が時効析出する。Further, the object of the present invention is achieved when Ni and Ti are precipitated as a Ni-Ti intermetallic compound. This N1-T
In order to fully exhibit the strengthening effect due to the precipitation of i-based intermetallic compounds, the Ni/Ti weight percentage ratio should be 1.2 to 3.
It was found that it was necessary to set the value within the range of 3. Ni
When the /Ti ratio is less than 1.2, a Ti-Cu intermetallic compound, which is a compound of Ti and Cu, precipitates with aging.
このＴｉ−Ｃｕ系金属間化合物が析出しても電気および
熱の伝導性の向上は少ない。また、溶体化処理時に結晶
粒が粗大化し易く１従って曲げ加工時に表面肌荒れを生
じ易くなる。このようなことからＮ ｉ／ Ｔ ｉ比は
１．２以上とする必要がある。他方、Ｎｉ／Ｔｉ比が３
．３より大・きい場合には、マトリックスに残留するＮ
ｉ量が多くなって電気および熱の伝導性を低下させる。Even if this Ti-Cu based intermetallic compound precipitates, there is little improvement in electrical and thermal conductivity. In addition, crystal grains tend to become coarse during solution treatment, 1 and therefore surface roughness tends to occur during bending. For this reason, the N i/T i ratio needs to be 1.2 or more. On the other hand, when the Ni/Ti ratio is 3
．． If it is greater than 3, the N remaining in the matrix
The amount of i increases, reducing electrical and thermal conductivity.
このような理由から本発明合金の特性を十分に発揮する
にはＮｉ／Ｔｉ比を１．２〜３．３の範囲にすることが
必要である。For these reasons, it is necessary to keep the Ni/Ti ratio in the range of 1.2 to 3.3 in order to fully exhibit the characteristics of the alloy of the present invention.
Ｚｒは１本発明合金の溶製時において脱酸剤として機能
し１合金中の０．含有量を低下させると共に、添加元素
のＮｉやＴｉの酸化防止作用も供する。また９時効処理
のさいの過時効の抑制効果を有するので１時効処理条件
に幅を持たせることができるという本発明合金の製造に
とって有益な役割を果たす。このような効果を発揮する
ためには０．０１％以上の含有が必要であるが、０．５
％を超えて含有すると導電率および加工性が低下してく
る。Zr functions as a deoxidizing agent during melting of the alloy of the present invention, and contains 0. In addition to lowering the content, it also provides an anti-oxidation effect for the additional elements Ni and Ti. Moreover, since it has the effect of suppressing over-aging during the 9-aging treatment, it plays a beneficial role in the production of the alloy of the present invention in that the 1-aging treatment conditions can be varied. In order to exhibit such an effect, it is necessary to contain 0.01% or more, but 0.5% or more is required.
If the content exceeds %, the conductivity and processability will decrease.
従ってＺｒ含有量は、 ０．０１〜０．５％の範囲とす
る。Therefore, the Zr content should be in the range of 0.01 to 0.5%.
０２含有量については、 ３０ｐｐｎより多量に合金中
に含有すると、析出したＮｉ−Ｔｉ系金属間化合物が○
と三元の化合物を作ってＮ ｉ−Ｔ ｉ−０系の化合物
となり、メッキ信幀性をはじめ、特性の劣下を招くこと
になる。したがって、０□含有量は３０ｐｐｍ以下の範
囲とする。Regarding the 02 content, if it is contained in the alloy in an amount greater than 30 ppn, the precipitated Ni-Ti intermetallic compound will be
A ternary compound is formed and becomes a N i-T i-0 system compound, which leads to deterioration of properties including plating reliability. Therefore, the 0□ content is in the range of 30 ppm or less.
このような成分組成に調整した本発明の銅基合金はＮ
ｉ−Ｔ ｉ基金属間化合物を均一微細に分散析出させる
ことによって高集積化の要求に満足する諸特性を具備し
たリードフレーム材とすることができる。このような諸
特性は特に熱処理条件を適切にコントロールした製造法
によって有利に発現させることができる。以下にその製
造法の詳細を説明する。The copper-based alloy of the present invention adjusted to such a component composition contains N
By uniformly and finely dispersing and precipitating the i-T i-based intermetallic compound, a lead frame material having various characteristics satisfying the demands for high integration can be obtained. These various properties can be advantageously exhibited particularly by a manufacturing method in which heat treatment conditions are appropriately controlled. The details of the manufacturing method will be explained below.
まず、 Ｎｉ：１．Ｏ〜４．０％、Ｔｉ；０．５〜２
．０％。First, Ni:1. O~4.0%, Ti; 0.5~2
．． 0%.
ただし、Ｎｉ／Ｔｉの重量百分率の比率が１．２〜３．
３の範囲、 Ｚ ｒ ： ０．０１〜０．５％、ｏ２
含有量が３０ｐｐｍ以下。However, the weight percentage ratio of Ni/Ti is 1.2 to 3.
Range of 3, Zr: 0.01-0.5%, o2
Content is 30ppm or less.
残部がＣｕおよび不可避的不純物からなる鋳片を溶解鋳
造によって製造する。この熔解鋳造は不活性ガスあるい
は還元ガス雰囲気中で行なうのが望ましい。次いで鋳片
（鋳塊）を熱間圧延して熱延板を製造し、脱スケールを
行なう。A cast slab, the remainder of which consists of Cu and unavoidable impurities, is produced by melting and casting. This melt casting is preferably carried out in an inert gas or reducing gas atmosphere. Next, the slab (ingot) is hot-rolled to produce a hot-rolled plate, and descaling is performed.
次いで、必要に応じて中間焼鈍を挟んだ冷間圧延によっ
て所望の板厚まで板厚減少を行なうのであるが、この冷
間圧延の途中または後において溶体化処理を行い、最終
冷延のあとに時効処理を行なう。なお、この時効処理の
あとの材料にさらに冷間圧延を行ってもよい。この場合
には最終工程で再び時効処理してもよいが、時効処理を
行わない場合には低温焼鈍を行って局部的な残留応力を
除去した方がよい。Next, the plate thickness is reduced to the desired plate thickness by cold rolling with intermediate annealing as necessary, but solution treatment is performed during or after this cold rolling, and after the final cold rolling. Perform aging treatment. Note that the material after this aging treatment may be further cold rolled. In this case, aging treatment may be performed again in the final step, but if aging treatment is not performed, it is better to perform low-temperature annealing to remove local residual stress.
溶体化処理については９００℃以上で行なうのがよい。The solution treatment is preferably carried out at 900°C or higher.
９００℃未満の温度では十分に溶体化せず。It is not sufficiently solutionized at temperatures below 900°C.
したがって、熱延および焼鈍の工程で生じた粗大な析出
物が十分に消失しないので特性の向上が図れない。また
、９００℃未満の温度では結晶粒の調整も難しい。この
溶体化処理の時期については。Therefore, the coarse precipitates generated during the hot rolling and annealing steps are not sufficiently eliminated, making it impossible to improve the properties. Furthermore, it is difficult to adjust crystal grains at temperatures below 900°C. Regarding the timing of this solution treatment.
最終冷間圧延（仕上冷間圧延）の後に行ってもよいが、
実際には、溶体化処理によって生じることもある板のう
ねり等を消去し且つ適度の加工硬化を付与する意味で、
仕上冷間圧延をその後に実施するのが好ましく、シたが
って、溶体化処理は最終冷間圧延の前に実施するのがよ
いが、前述のように時効処理後に冷間圧延を行なう場合
にはこの限りではない。It may be performed after the final cold rolling (finish cold rolling), but
In reality, it is meant to eliminate the waviness of the plate that may occur due to solution treatment and to impart appropriate work hardening.
It is preferable to carry out finish cold rolling after that, and therefore it is better to carry out solution treatment before final cold rolling, but as mentioned above, when cold rolling is carried out after aging treatment, This is not the limit.
時効処理は、好ましくは板材製造の最終工程として実施
するのであるが、これは４００〜６００℃の温度で５〜
７２０分間の条件で実施する。６００℃を超える温度で
は析出するＮｉ−Ｔｉ系金属間化合物が凝集粗大化して
特性の向上が期待できなくなり。Aging treatment is preferably carried out as the final step in the production of plate materials, and is carried out at a temperature of 400 to 600°C for 5 to 50 minutes.
It is carried out under conditions of 720 minutes. At temperatures exceeding 600° C., the precipitated Ni-Ti intermetallic compounds become aggregated and coarse, making it impossible to expect improvements in properties.
また４００℃未満の温度では析出するに要する時間が長
くなり過ぎるので好ましくない、したがって時効温度は
４００〜６００℃の範囲とする。時効時間については５
分未満では析出物の形成が不十分であり、７２０分を超
えるような長時間では析出物の成長のうえからもまた経
済性のうえがらも好ましくない。Further, a temperature lower than 400°C is not preferable because the time required for precipitation is too long; therefore, the aging temperature is set in the range of 400 to 600°C. Regarding the statute of limitations, 5.
If it is less than 720 minutes, the formation of precipitates will be insufficient, and if it is longer than 720 minutes, it is not preferable from the viewpoint of the growth of precipitates and from the viewpoint of economy.
以上の熱処理を経ることによって、Ｎｉ−Ｔｉ系金属間
化合物がＣｕマトリックス中に微細且つ均一に分散析出
した組織の銅基合金の薄板が製造でき、これは、後記の
実施例に示すように高強度。Through the above heat treatment, a thin plate of a copper-based alloy with a structure in which Ni-Ti intermetallic compounds are finely and uniformly dispersed and precipitated in a Cu matrix can be manufactured, and this has a high Strength.
高弾性、高伝導性を兼備し、且つ耐熱性、メッキ信転性
２曲げ加工性等に優れるので１近年の半導体集積回路の
高実装密度化を可能にするリードフ。Leadoff has both high elasticity and high conductivity, as well as excellent heat resistance, plating reliability, 2 bending workability, etc.1, making it possible to increase the packaging density of semiconductor integrated circuits in recent years.
レーム用材料として好適なものである。It is suitable as a frame material.
実施例
第１表にその化学成分値（重量％）を示す銅基合金１ｍ
１−ＮｌＢを高周波溶解炉を用いて溶製し。Example 1m of copper-based alloy whose chemical composition values (wt%) are shown in Table 1
1-NlB was melted using a high frequency melting furnace.
４０ＩＩｌｌ×４０ＩＩ輪Ｘ １４０ｍ−の鋳塊に鋳造
した。ただし。It was cast into an ingot of 40IIll x 40II wheels x 140m. however.
１１ｋｌ−Ｉｌ＆１７の合金については溶解鋳造雰囲気
を完全に不活性ガスでシールドして行ない、阻８の合金
は大気雰囲気下で溶解鋳造した。各鋳塊を４０ｓ＋ｍ×
４０ｆｆｉ嗜Ｘ １０ｍｍの大きさに切断し、この鋳片
を９００℃で熱間圧延し、厚さ３ｍｍの熱延板を得た。Alloys No. 11kl-Il & No. 17 were melted and cast in a completely shielded atmosphere with an inert gas, and Alloy No. 8 was melted and cast in an air atmosphere. 40s+m×each ingot
The slab was cut into a size of 40 mm x 10 mm, and the slab was hot rolled at 900° C. to obtain a hot rolled plate with a thickness of 3 mm.
これを固剤したあと、１ｍｍまで冷延し、９００℃の温
度で６０分間焼鈍した。その後、Ｗ、さ０．５ｍｍまで
冷延したうえ、９５０℃で６０分間の溶体化処理を行っ
た。After solidifying this, it was cold rolled to a thickness of 1 mm and annealed at a temperature of 900° C. for 60 minutes. Thereafter, it was cold rolled to a W diameter of 0.5 mm and then subjected to solution treatment at 950° C. for 60 minutes.
これを水急冷、酸洗したあと、厚さ０．２５ｍ−まで最
終冷延し、５００℃の温度で６０分間の時効処理を施し
、この処理を終えた材料を試験材とした。なお、前述の
各熱処理についてはその雰囲気を不活性ガスまたは還元
性ガス雰囲気として材料表面および内部の酸化をできる
だけ抑制した。After quenching with water and pickling, the material was finally cold-rolled to a thickness of 0.25 m and subjected to an aging treatment at a temperature of 500° C. for 60 minutes, and the material after this treatment was used as a test material. In each of the heat treatments described above, the atmosphere was an inert gas or reducing gas atmosphere to suppress oxidation on the surface and inside of the material as much as possible.
得られた試験材を用いて、硬度、引張強さ、ばね限界値
、導電率、耐熱性、折り曲げ性、半田密着性を調べた結
果を第１表に併記した。Using the obtained test materials, hardness, tensile strength, spring limit value, electrical conductivity, heat resistance, bendability, and solder adhesion were investigated. The results are also listed in Table 1.
硬度、引張強さ、ばね限界値および導電率の測定はそれ
ぞれＪｒＳＺ２２４４． ＪＴＳＺ２２４１． ＪｒＳ
Ｒ３１３０およびＪＩＳ１１０５０５に従って行った。Hardness, tensile strength, spring limit value and conductivity measurements were made using JrSZ2244. JTSZ2241. Jr.S.
It was carried out in accordance with R3130 and JIS110505.
また耐熱性は６００℃の温度で３０分間の加熱保持後の
硬度が初期硬度の８０％以上であれば０．８０％より小
さくなった場合にはＸとして評価した。折り曲げ性は９
０’−曲げ試験（ＣＢＳ−ＭＯＯＯ２−６，ｌ？・０．
４ｍｍ）を行い、中央郡山表面が良好なものを０１割れ
が発生したものを×として評価した。半田密着性は、半
田メッキ （ディップ： Ｓ ｎ−４０ｗｔ、χＰｂ、
２３０℃±５℃５弱活性ロジンフラックス使用）をし
た後、１ｓＯ℃の温度で５００時間加熱保持後、密着面
げし、セロハンテープにてピーリングテストし、メッキ
が＠離しないものを○、ＩＩ離したものを×として評価
した。Moreover, heat resistance was evaluated as X if the hardness after heating and holding at a temperature of 600° C. for 30 minutes was 80% or more of the initial hardness, and if it became smaller than 0.80%. Bendability is 9
0'-bending test (CBS-MOOO2-6, l?・0.
4 mm), and those with a good Chuo Koriyama surface were rated as "x" and those with 01 cracks were evaluated as "x". Solder adhesion is determined by solder plating (dip: S n-40wt, χPb,
After heating at 230℃±5℃ (using slightly activated rosin flux) and holding at a temperature of 1sO℃ for 500 hours, peeling test was carried out using cellophane tape. Those that were released were evaluated as ×.
第１表の結果から次のことが明らかである。The following is clear from the results in Table 1.
本発明による隘１〜寛４の合金は、硬度、引張強さ、ば
ね限界値、導電率のバランスが優れ、且つ耐熱性、折り
曲げ性および半田密着性も良好である。したがってリー
ドフレーム用高強度銅合金として非常に優れた特性を有
する合金であることがわかる。The alloys No. 1 to No. 4 according to the present invention have an excellent balance of hardness, tensile strength, spring limit value, and electrical conductivity, and also have good heat resistance, bendability, and solder adhesion. Therefore, it can be seen that this alloy has very excellent properties as a high-strength copper alloy for lead frames.
これに対し、Ｎｉが本発明で規定する量より少ない比較
合金ＮＱ５．およびＮｉ、Ｔｉが本発明で規定する範囲
であってもＮｉ／Ｔｉ比が１．２より小さい比較合金階
６は、導電率が低い。On the other hand, comparative alloy NQ5. has a lower amount of Ni than the amount specified in the present invention. Even if Ni and Ti are within the range specified by the present invention, comparative alloy grade 6 with a Ni/Ti ratio of less than 1.2 has low electrical conductivity.
また、Ｎｉ、Ｔｉ量が本発明で規定する範囲であっても
Ｚｒを含有していない比較合金Ｎ１７は、 Ｚｒ添加
合金に比べて耐熱性に劣る。これはＺｒの添加が過時効
を遅らせる効果があることを示すものであり、したがっ
てＺｒは時効条件に幅を持たせることができることの裏
付けとなる。Furthermore, even if the Ni and Ti amounts are within the range specified by the present invention, the comparative alloy N17, which does not contain Zr, is inferior in heat resistance to the Zr-added alloy. This shows that the addition of Zr has the effect of delaying overaging, and therefore supports the fact that Zr can vary the aging conditions.
０２含有量が本発明で規定する量より多く含有する比較
合金患８は＋ Ｎ ｉ ＋ Ｔ ｉ ＋ Ｎ ｉ／
Ｔ ｉ比、 Ｚｒが本発明で規定する範囲であっても
、半田密着性が悪い。Comparative alloy No. 8 containing more 02 than the amount specified in the present invention is +N i + T i + N i/
Even if the Ti ratio and Zr are within the ranges specified in the present invention, the solder adhesion is poor.
また、Ｔｉが本発明で規定する量より多い比較合金１１
ｋＬ９は曲げ加工性に劣っている。Comparative alloy 11 in which the amount of Ti is greater than the amount specified in the present invention
kL9 has poor bending workability.
以上のように１本発明はＮｉ−Ｔｉ系金属間化合物の適
切な分散析出によって高強度、高弾性、高伝導性を有し
、且つ耐熱性、折り曲げ性、メッキ信幀性に優れたリー
ドフレーム用高強度銅合金を得たものであり、近年の半
導体集積回路の高密度化に十分に対応できるリードフレ
ーム材を提供するものである。As described above, the present invention provides a lead frame that has high strength, high elasticity, and high conductivity through appropriate dispersion and precipitation of Ni-Ti based intermetallic compounds, and has excellent heat resistance, bendability, and plating reliability. The purpose is to provide a lead frame material that can sufficiently respond to the recent increase in the density of semiconductor integrated circuits.
Claims (2)
：０．５〜２．０％、ただし、Ｎｉ／Ｔｉの重量百分率
の比率が１．２〜３．３の範囲、Ｚｒ：０．０１〜０．
５％、Ｏ＿２含有量が３０ｐｐｍ以下、残部がＣｕおよ
び不可避的不純物からなるリードフレーム用高強度銅合
金。(1) In weight%, Ni: 1.0 to 4.0%, Ti
: 0.5 to 2.0%, provided that the Ni/Ti weight percentage ratio is in the range of 1.2 to 3.3, Zr: 0.01 to 0.
5%, O_2 content is 30 ppm or less, and the balance is Cu and unavoidable impurities.
：０．５〜２．０％、ただし、Ｎｉ／Ｔｉの重量百分率
の比率が１．２〜３．３の範囲、Ｚｒ：０．０１〜０．
５％、Ｏ＿２含有量が３０ｐｐｍ以下、残部がＣｕおよ
び不可避的不純物からなる銅合金の板素材を製造し、こ
れを９００℃以上の温度で溶体化処理し、最終板厚まで
冷間圧延したあと、次いで４００〜６００℃の温度で５
〜７２０分間の時効処理を行なうことを特徴とするリー
ドフレーム用高強度銅合金の製造法。(2) In weight%, Ni: 1.0 to 4.0%, Ti
: 0.5 to 2.0%, provided that the Ni/Ti weight percentage ratio is in the range of 1.2 to 3.3, Zr: 0.01 to 0.
5%, O_2 content is 30 ppm or less, and the balance is Cu and unavoidable impurities. After solution treatment at a temperature of 900°C or higher and cold rolling to the final thickness. , then at a temperature of 400-600°C for 5
A method for producing a high-strength copper alloy for lead frames, characterized by performing an aging treatment for ~720 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP659087A JPS63176443A (en) | 1987-01-14 | 1987-01-14 | High-strength copper alloy for lead frame and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP659087A JPS63176443A (en) | 1987-01-14 | 1987-01-14 | High-strength copper alloy for lead frame and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63176443A true JPS63176443A (en) | 1988-07-20 |
| JPH0250183B2 JPH0250183B2 (en) | 1990-11-01 |
Family
ID=11642545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP659087A Granted JPS63176443A (en) | 1987-01-14 | 1987-01-14 | High-strength copper alloy for lead frame and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63176443A (en) |
-
1987
- 1987-01-14 JP JP659087A patent/JPS63176443A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0250183B2 (en) | 1990-11-01 |
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