JPS63149561U - - Google Patents
Info
- Publication number
- JPS63149561U JPS63149561U JP4335887U JP4335887U JPS63149561U JP S63149561 U JPS63149561 U JP S63149561U JP 4335887 U JP4335887 U JP 4335887U JP 4335887 U JP4335887 U JP 4335887U JP S63149561 U JPS63149561 U JP S63149561U
- Authority
- JP
- Japan
- Prior art keywords
- bent part
- wiring board
- copper foil
- plating layer
- flexible composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案に係るフレキシブル複合配線板
の具体例の縦断面図である。
１……ベース絶縁フイルム、２……ベース接着
剤層、３……ベース回路導体、４……カバーレイ
接着剤層、５……カバーレイフイルム、６……裏
面接着剤層、７……内層回路、８……内層用接着
剤層、９……外層絶縁フイルム、１０……外層用
接着剤層、１１……外層回路、１２……ソルダー
レジスト、１３……スルーホールメツキ、Ａ……
屈曲部、Ｂ……非屈曲部。
FIG. 1 is a vertical sectional view of a specific example of a flexible composite wiring board according to the present invention. DESCRIPTION OF SYMBOLS 1...Base insulating film, 2...Base adhesive layer, 3...Base circuit conductor, 4...Coverlay adhesive layer, 5...Coverlay film, 6...Back adhesive layer, 7...Inner layer Circuit, 8...Inner layer adhesive layer, 9...Outer layer insulating film, 10...Outer layer adhesive layer, 11...Outer layer circuit, 12...Solder resist, 13...Through hole plating, A...
Bent part, B... non-bent part.
Claims (1)
合配線板において、上記屈曲部は導体回線がスル
ーホールメツキ層を施こしていない圧延銅箔で形
成されており、非屈曲部は少くとも２層以上の圧
延銅箔がスルーホールメツキ層により電気的に接
続されており、前記屈曲部と非屈曲部のトータル
厚さの比が少くとも１：２以上であつて、かつ非
屈曲部から屈曲部へなめらかな勾配をもつて移行
していることを特徴とするフレキシブル複合配線
板。 (2) 勾配は屈曲部の厚さ１に対して非屈曲部ま
での距離が５０倍以上であることを特徴とする実
用新案登録請求の範囲第１項記載のフレキシブル
複合配線板。[Claims for Utility Model Registration] (1) A flexible composite wiring board having a bent part and a non-bent part, in which the conductor line is formed of rolled copper foil without a through-hole plating layer, In the non-bent part, at least two or more layers of rolled copper foil are electrically connected by a through-hole plating layer, and the ratio of the total thickness of the bent part and the non-bend part is at least 1:2 or more. , and a transition from the non-bent part to the bent part with a smooth slope. (2) The flexible composite wiring board according to claim 1, wherein the gradient is 50 times or more the distance from the non-bent part to the thickness 1 of the bent part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043358U JPH0412702Y2 (en) | 1987-03-23 | 1987-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043358U JPH0412702Y2 (en) | 1987-03-23 | 1987-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63149561U true JPS63149561U (en) | 1988-10-03 |
| JPH0412702Y2 JPH0412702Y2 (en) | 1992-03-26 |
Family
ID=30860138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987043358U Expired JPH0412702Y2 (en) | 1987-03-23 | 1987-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412702Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130468U (en) * | 1991-05-23 | 1992-11-30 | 藤一 竹林 | Wired circuit board |
| JP2008085099A (en) * | 2006-09-28 | 2008-04-10 | Sumitomo Bakelite Co Ltd | Rigid flex circuit board |
| WO2014132778A1 (en) * | 2013-02-28 | 2014-09-04 | 株式会社村田製作所 | Flexible multilayer substrate |
| JP2016054313A (en) * | 2011-04-26 | 2016-04-14 | 株式会社村田製作所 | Rigid flexible substrate and method for manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4745014B2 (en) * | 2005-10-11 | 2011-08-10 | 日本メクトロン株式会社 | Method for manufacturing printed circuit board having cable portion |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388157A (en) * | 1977-01-13 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS5654607U (en) * | 1979-10-01 | 1981-05-13 |
-
1987
- 1987-03-23 JP JP1987043358U patent/JPH0412702Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388157A (en) * | 1977-01-13 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS5654607U (en) * | 1979-10-01 | 1981-05-13 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130468U (en) * | 1991-05-23 | 1992-11-30 | 藤一 竹林 | Wired circuit board |
| JP2008085099A (en) * | 2006-09-28 | 2008-04-10 | Sumitomo Bakelite Co Ltd | Rigid flex circuit board |
| JP2016054313A (en) * | 2011-04-26 | 2016-04-14 | 株式会社村田製作所 | Rigid flexible substrate and method for manufacturing the same |
| US9402307B2 (en) | 2011-04-26 | 2016-07-26 | Murata Manufacturing Co., Ltd. | Rigid-flexible substrate and method for manufacturing the same |
| WO2014132778A1 (en) * | 2013-02-28 | 2014-09-04 | 株式会社村田製作所 | Flexible multilayer substrate |
| JP5999249B2 (en) * | 2013-02-28 | 2016-09-28 | 株式会社村田製作所 | Flexible multilayer board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412702Y2 (en) | 1992-03-26 |