JPS6242703B2 - - Google Patents
Info
- Publication number
- JPS6242703B2 JPS6242703B2 JP54083512A JP8351279A JPS6242703B2 JP S6242703 B2 JPS6242703 B2 JP S6242703B2 JP 54083512 A JP54083512 A JP 54083512A JP 8351279 A JP8351279 A JP 8351279A JP S6242703 B2 JPS6242703 B2 JP S6242703B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- base material
- shell
- binder
- discharge port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011230 binding agent Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 37
- 239000011248 coating agent Substances 0.000 claims description 27
- 239000004576 sand Substances 0.000 claims description 22
- 239000000843 powder Substances 0.000 claims description 15
- 238000007599 discharging Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 3
- 238000007786 electrostatic charging Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 22
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000005266 casting Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229940098458 powder spray Drugs 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010112 shell-mould casting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Casting Devices For Molds (AREA)
Description
【発明の詳細な説明】
この出願の発明は鋳造に用いられるシエルモー
ルド鋳型の造形方法及び装置に関するものであ
り、特に、粉末粘結剤及び基材に静電気を帯電さ
せて金型表面に静電吸着させた後にシエル砂をバ
ツクアツプさせて焼結する様にしたシエルモール
ド鋳型造型方法及び装置に係るものである。DETAILED DESCRIPTION OF THE INVENTION The invention of this application relates to a method and apparatus for forming a shell mold used for casting, and in particular, static electricity is charged to a powder binder and a base material to prevent static electricity from forming on the surface of the mold. This invention relates to a shell mold mold making method and apparatus in which shell sand is backed up and sintered after being adsorbed.
従来、シエルモールド鋳型造型時における塗型
方法としては、金型表面に単一の塗型剤を一回だ
け塗布し、その後シエル砂をバツクアツプさせて
焼結する方法が行なわれていた。 Conventionally, the mold coating method used when making shell mold molds has been to apply a single mold coating agent to the surface of the mold only once, and then to back up shell sand and sinter it.
而して、上記塗型剤の塗布に関しては、まず金
型に対する塗布時には塗型剤の均一塗着が必要と
され、又、その後のシエル砂バツクアツプ時には
焼結されたシエル砂との一体化が必要とされ、そ
の後に金型との離反性とが必要とされるものであ
つた。この様に、金型に対する均一塗着性及び離
反性の相反する性質を必要とされる為に、塗型剤
の成分配合の調整、材料の選択が困難であり、製
造コストの低減、品質の維持が行ない難い欠点が
あるのみならず、塗型剤の金型への塗布作業に熟
練を必要とし作業効率が劣化する等の不都合さを
有していた。 Therefore, regarding the application of the above-mentioned mold coating agent, it is first necessary to uniformly apply the mold coating agent when applying it to the mold, and also, when backing up the shell sand afterwards, it is necessary to integrate it with the sintered shell sand. After that, releasability from the mold was required. In this way, because contradictory properties are required, such as uniform adhesion to the mold and releasability, it is difficult to adjust the composition of the mold coating agent and select materials, reducing manufacturing costs and improving quality. This method not only has the drawback of being difficult to maintain, but also requires skill in applying the coating agent to the mold, resulting in a reduction in work efficiency.
この出願の発明の目的は上記従来技術に基づく
シエルモールド鋳造に於ける塗型剤塗布手段の問
題点に鑑み、金型への塗型剤塗布手段として、そ
の成分となるべき粘結剤と基材とを調配合せずに
別個に用い、各々の粉状粒に静電気を帯電させて
金型表面に段階層状して静電吸着させ、而して、
終段にシエル砂をバツクアツプさせ、焼結するこ
とによつて上記粘結剤及び基材をシエル砂に一体
密着させ、金型表面からの離反が行なわれる様に
することにより、塗型剤の均一塗着性を良好にし
て上記欠点を除去し不都合さを無くした優れたシ
エルモールド鋳型造型方法及び装置を提供せんと
するものである。 The purpose of the invention of this application is to provide a means for applying a coating agent to a mold in view of the problems with the coating agent application method in shell mold casting based on the above-mentioned prior art. The powder particles are used separately without being mixed, and each powder particle is electrostatically charged and electrostatically adsorbed on the mold surface in a stepwise layer.
In the final step, the shell sand is backed up and sintered to make the binder and base material adhere to the shell sand, and the mold coating agent is released from the mold surface. It is an object of the present invention to provide an excellent method and apparatus for making a shell mold mold, which improves uniform coating properties, eliminates the above-mentioned drawbacks, and eliminates inconveniences.
次に、上記目的に沿うこの出願の発明の実施例
を図面に基づいて説明すれば以下の通りである。 Next, embodiments of the invention of this application that meet the above object will be described below based on the drawings.
第1〜3図に示す1はこの出願の発明のシエル
モールド鋳型造型装置であり、金型2はテーブル
3上に適宜セツトされてアース4されている。 Reference numeral 1 shown in FIGS. 1 to 3 is a shell mold mold making apparatus according to the invention of this application, and a mold 2 is suitably set on a table 3 and grounded 4.
又、5は塗型剤吐出装置であり、ノズルベース
6は非導電性の樹脂成形製であり、アース7を介
して移送コンベア8に吊下されて上記テーブル3
上を自動移行出来る様にされている。 Further, 5 is a coating agent discharging device, and a nozzle base 6 is made of non-conductive resin molding, and is suspended from a transfer conveyor 8 via a ground 7.
The above can be automatically migrated.
而して、上記ノズルベース6は第2,3図に詳
示される如く断面矩形々状とされており、内部に
は縦方向に3つの穴9が穿設され、該穴9の中央
部には導電金属製のアースリング10が嵌合され
ており、該アースリング10は適宜アース11さ
れている。 The nozzle base 6 has a rectangular cross section, as shown in detail in FIGS. A ground ring 10 made of conductive metal is fitted, and the ground ring 10 is appropriately grounded 11.
又、12はコロナ放電ピンであり各穴9の内壁
に植設され先端は上記アースリング10内に臨ま
され、又、各コロナ放電ピン12は各々配線され
てノズルベース6外に設けられた高電圧発生装置
13に接続されている。 Further, 12 is a corona discharge pin, which is implanted in the inner wall of each hole 9, with its tip facing inside the earth ring 10, and each corona discharge pin 12 is wired to a height provided outside the nozzle base 6. It is connected to the voltage generator 13.
更に、上記ノズルベース6には各穴9に連通す
る如く非導電性の樹脂材質によるパイプが連設さ
れており、該ノズルベース6の上面に付設された
ものは左右14及び15が粘結剤供給パイプとさ
れて各々粘結剤送給装置であるインジエクシヨン
フイーダ16、及び17に接続されている。尚、
該インジエクシヨンフイーダ16,17は各々の
ホツパー18,18′を有しており、その内部に
はフエノール樹脂等の粉体粘結剤が貯留されてい
る。 Further, the nozzle base 6 is connected with a pipe made of a non-conductive resin material so as to communicate with each hole 9, and the pipes attached to the upper surface of the nozzle base 6 have the left and right portions 14 and 15 filled with a binder. They are used as supply pipes and are connected to injection feeders 16 and 17, which are binder feeding devices, respectively. still,
The injection feeders 16, 17 each have a hopper 18, 18', in which a powder binder such as phenolic resin is stored.
又、ノズルベース6の中央穴9の上部に接続さ
れているパイプ19は基材供給パイプとされてお
り、基材送給装置としてのインジエクシヨンフイ
ーダ20に接続されている。尚、該インジエクシ
ヨンフイーダ20のホツパー21にはアルミナ、
ジルコン、硅石等の粉体基材が貯留されている。 Further, a pipe 19 connected to the upper part of the center hole 9 of the nozzle base 6 is used as a base material supply pipe, and is connected to an injection feeder 20 as a base material feeding device. Incidentally, the hopper 21 of the injection extension feeder 20 is filled with alumina,
Powder base materials such as zircon and silica are stored.
又、上記ノズルベース6の下面の両側に下延し
て設けられたパイプ22,23は前記粘結剤供給
パイプ14,15と穴9を介して各々連通されて
粘結剤吐出口を形成し、中央に下延して設けられ
たパイプ24は前記基材供給パイプ19と中央の
穴9を介して連通されて基材吐出口を形成してい
る。 Further, pipes 22 and 23 extending downwardly from both sides of the lower surface of the nozzle base 6 are connected to the binder supply pipes 14 and 15 through holes 9 to form binder discharge ports. A pipe 24 extending downward from the center communicates with the base material supply pipe 19 through the central hole 9 to form a base material discharge port.
尚、25はシエル砂吐出装置であつて、塗型剤
吐出装置5の後段に配されて該塗型剤吐出装置5
と共にテーブル3上を自動移行する様にされたも
のであり、図示しないシエル砂送給装置に連結さ
れている。 In addition, 25 is a shell sand discharging device, which is disposed after the coating agent discharging device 5 and is connected to the coating agent discharging device 5.
It is configured to automatically move on the table 3 along with the shell sand, and is connected to a shell sand feeding device (not shown).
次に、上記構成の装置1によるシエルモールド
鋳型造型方法の実施例を第4a〜4f図に従つて
説明する。 Next, an embodiment of a shell mold mold manufacturing method using the apparatus 1 having the above configuration will be described with reference to FIGS. 4a to 4f.
まず金型2をテーブル3上にセツトして所定温
度に予熱すると共に、第4a図に示す如く表面に
シリコーン系液状の離型剤26を吹付けておく。 First, the mold 2 is set on the table 3 and preheated to a predetermined temperature, and a silicone liquid mold release agent 26 is sprayed onto the surface as shown in FIG. 4a.
次に、移送コンベア8を始動して塗型剤吐出装
置5及びシエル砂吐出装置25を金型2上に通過
せしめると共に、インジエクシヨンフイーダ1
6,17,20及び図示しないシエル砂送給装置
を稼動させ、更に高電圧発生装置13の始動によ
つてノズルベース6内のコロナ放電ピン12とア
ースリング10との間の放電を開始させる。 Next, the transfer conveyor 8 is started to cause the coating agent discharge device 5 and the shell sand discharge device 25 to pass over the mold 2, and the injection feeder 1 is caused to pass over the mold 2.
6, 17, 20 and a shell sand feeding device (not shown) are operated, and the high voltage generator 13 is started to start discharging between the corona discharge pin 12 in the nozzle base 6 and the earth ring 10.
その結果、ホツパー18内の粘結剤27はイン
ジエクシヨンフイーダ16によつて粘結剤供給パ
イプ14からノズルベース6の穴9内に送給され
コロナ放電ピン12によつて静電帯電された後パ
イプ22から金型2上に吹付けられ、その静電吸
着作用によつて第4b図に示す如く離型剤被膜2
6上に均一に付着される。 As a result, the binder 27 in the hopper 18 is fed from the binder supply pipe 14 into the hole 9 of the nozzle base 6 by the injection feeder 16, and is electrostatically charged by the corona discharge pin 12. After that, it is sprayed onto the mold 2 from the pipe 22, and due to its electrostatic attraction, the mold release agent coating 2 is formed as shown in FIG. 4b.
It is evenly deposited on 6.
次に、インジエクシヨンフイーダ20から基材
送給パイプ19に送給される基材28もコロナ放
電ピン12によつて静電帯電されて金型2上に吹
付けられ第4c図に示す如く粘結剤被膜27上に
基材被膜28が形成される。即ち、該粘結剤27
は金型2の表面で溶融し上記基材28同士を粘結
させ、その結果、シエル鋳造の鋳肌を良好にする
様に作用するものである。 Next, the base material 28 fed from the injection feeder 20 to the base material feed pipe 19 is also electrostatically charged by the corona discharge pin 12 and sprayed onto the mold 2 as shown in FIG. 4c. A base film 28 is thus formed on the binder film 27. That is, the binder 27
melts on the surface of the mold 2 and binds the base materials 28 together, thereby improving the casting surface of shell casting.
更に、パイプ23からも粘結剤が吐出され第4
d図に示す如く基材被膜28上に再度粘結剤被膜
29が形成される。 Furthermore, the binder is discharged from the pipe 23 and the fourth
As shown in Figure d, a binder film 29 is again formed on the base film 28.
そして、上記粘結剤29は上記基材被膜28上
で溶融して該基材被膜28内に浸透し基材同士を
粘結させ、後段のシエル砂バツクアツプ時にシエ
ル砂と基材とを粘結させる様に作用するものであ
る。よつて、粘結剤27より粘結剤29の方が比
較的材質選定条件が厳しく、粘結剤29は、接着
性が高く流動性が高く(溶融時に流れ易く)、溶
融時間の比較的長い樹脂が必要とされ、例えばエ
ポキシ樹脂系のものが最適である。 Then, the binder 29 melts on the base film 28, penetrates into the base film 28, binds the base materials together, and binds the shell sand and the base material during backing up of the shell sand in the subsequent stage. It acts in such a way as to cause Therefore, the material selection conditions for binder 29 are relatively stricter than for binder 27, and binder 29 has high adhesiveness and fluidity (flows easily when melted), and has a relatively long melting time. A resin is required, for example an epoxy resin type is most suitable.
而して、塗型剤吐出装置の通過により上記各被
膜が形成された後にシエル砂吐出装置25が通過
しシエル砂30が第4e図の如くバツクアツプさ
れ金型2の保有熱によつてシエル砂30の焼結が
行なわれると共に上記粘結剤及び基材の各被膜は
特に上記粘結剤29の作用により該シエル砂30
と一体化し密着する。 After each coating is formed by passing through the coating agent discharging device, the shell sand discharging device 25 passes through, and the shell sand 30 is backed up as shown in FIG. As the sintering of the shell sand 30 is carried out, each film of the binder and the base material becomes sintered by the action of the binder 29.
It is integrated with and adheres closely to.
尚、上記粉体基材28と各粘結剤27,28の
吹付量の割合は粉体基材28の粒度、その他必要
鋳肌荒さ等によつて異なるが、例えば基材28の
粒度が300メツシユ前後であれば基材28の割合
100に対して粘結剤27が10、粘結剤29が20の
割合程度でよい。勿論この割合以外であつても上
述の塗型剤としての働きをすることは出来る。 The ratio of the amount of spraying of the powder base material 28 and each of the binders 27 and 28 varies depending on the grain size of the powder base material 28 and other required casting surface roughness, but for example, if the grain size of the base material 28 is 300. If it is before or after meshing, the ratio of base material is 28
The ratio of binder 27 and binder 29 to 100 parts may be approximately 10 parts and 20 parts, respectively. Of course, even if the ratio is other than this, it can function as the above-mentioned mold coating agent.
従つて、第4f図の如く焼結シエル鋳型31を
金型2から離反させると各被膜剤の焼結効果特に
上記粘結剤27の働きによつて該シエル鋳型31
の金型に接した面は円滑に仕上げられる。 Therefore, when the sintered shell mold 31 is separated from the mold 2 as shown in FIG.
The surface in contact with the mold is finished smoothly.
特に、第1図に示す装置1によつてこのシエル
モールド鋳型造型方法を実施すると粘結剤、基材
は各パイプ22,24,23から連続的に且つ短
時間隔で吐出されるので金型2上での焼結時に該
粘結剤及び基材の一体混合が均一に行なわれ易い
のでシエル砂との密着性が高められる。よつて塗
型剤吐出装置として一般の静電粉体吹付ガンを使
用したものに比べてシエル鋳型の仕上がりが向上
される。 Particularly, when this shell mold mold making method is carried out using the apparatus 1 shown in FIG. Since the binder and the base material are easily mixed uniformly during sintering on the shell sand, the adhesion to the shell sand is improved. Therefore, the finish of the shell mold is improved compared to the case where a general electrostatic powder spray gun is used as the coating agent discharging device.
尚、この出願の発明の実施例は上記のものに限
られるものではなく、例えば、シエル鋳型の鋳肌
円滑精度をさ程必要としない場合には第4b図に
示す第一回目の粘結剤塗布プロセスを省略しても
よいことは勿論である。又、パイプ22,23,
24を充分接近させ、基材28、及び粘結剤2
7,29がその噴出直後に噴流がオーバラツプし
空中で混合する様にしても良い。 Note that the embodiments of the invention of this application are not limited to those described above; for example, when the smoothness of the casting surface of the shell mold is not so required, the first binder shown in FIG. 4b may be used. Of course, the coating process may be omitted. Also, the pipes 22, 23,
24 are brought sufficiently close to each other, and the base material 28 and the binder 2 are
Immediately after the jets 7 and 29 are ejected, the jets may overlap and mix in the air.
上記の様に、この出願の発明によれば、シエル
モールド鋳型造型方法において、粉末粘結剤及び
基材を静電気荷電状態で金型表面に独立して吹付
けるようにしたことにより、粘結剤及び基材は金
型表面に静電吸着され均一な塗着膜が形成される
ので、造型されたシエル鋳造の表面は極めて均
一、且つ滑らかに仕上げることのできる効果があ
る。 As described above, according to the invention of this application, in the shell mold mold making method, the powder binder and the base material are separately sprayed onto the mold surface in an electrostatically charged state, so that the binder Since the base material is electrostatically attracted to the mold surface and a uniform coating film is formed, the surface of the molded shell casting can be finished extremely uniformly and smoothly.
又、静電吸着にした為に粉末粘結剤及び基材を
調合することなく別々の状態で使用できるので、
塗型剤の調合作業を省くことが出来、又、塗型剤
の品質管理が容易になり作業効率の向上が図るこ
とも出来る。 In addition, because it uses electrostatic adsorption, the powder binder and base material can be used separately without having to mix them.
It is possible to omit the work of preparing the mold coating agent, and it is also possible to easily control the quality of the mold coating agent, thereby improving work efficiency.
更に、この出願の発明のシエルモールド鋳型造
型装置において、塗型剤吐出装置を粘結剤吐出口
と基材吐出口とで構成したので粘結剤と基材とが
別個供給系路とされ、よつて特に両剤の混合機構
が不要となり装置小型化が図れ、コストを下げる
ことのできる効果がある。 Furthermore, in the shell mold mold making apparatus of the invention of this application, since the coating agent discharging device is configured with a binder discharge port and a base material discharge port, the binder and the base material are provided through separate supply paths, This eliminates the need for a mixing mechanism for both agents, allowing for a smaller device and lower costs.
更に又、粘結剤吐出口と基材吐出口とを近接し
て設ければ吐出される粘結剤及び基材のすみやか
な均一融合が行なわれ塗型剤品質の向上が図るこ
とができる点も利点である。 Furthermore, if the binder discharge port and the base material discharge port are provided close to each other, the discharged binder and the base material can be quickly and uniformly fused, and the quality of the mold coating agent can be improved. is also an advantage.
図面はこの出願の発明の実施例を示すものであ
り、第1図は装置全体図、第2図は第1図の部分
横断面図、第3図は同じく縦断面図である。又第
4a〜4f図は方法を示す説明図である。
2……金型、27,29……粘結剤、30……
シエル砂、31……シエルモールド鋳型、5……
塗型剤吐出装置、25……シエル砂吐出装置、1
8……粘結剤送給装置、20……基材送給装置、
22,23……粘結剤吐出口、24……基材吐出
口、10,12,13……静電気荷電装置、A…
…シエルモールド鋳型造型装置。
The drawings show an embodiment of the invention of this application, and FIG. 1 is an overall view of the device, FIG. 2 is a partial cross-sectional view of FIG. 1, and FIG. 3 is a longitudinal sectional view. 4a to 4f are explanatory diagrams showing the method. 2... Mold, 27, 29... Binder, 30...
Ciel sand, 31... Ciel mold mold, 5...
Coating agent discharging device, 25... Shell sand discharging device, 1
8...Binder feeding device, 20...Base material feeding device,
22, 23... Binder discharge port, 24... Base material discharge port, 10, 12, 13... Electrostatic charging device, A...
...Ciel mold mold making equipment.
Claims (1)
塗布した後にシエル砂をバツクアツプさせて焼結
しシエルモールド鋳型を造型する方法において、
上記粉末粘結剤及び基材を各々独立に静電気帯電
させて金型表面に静電吸着させ複合された塗型剤
被膜を得る様にしたことを特徴とするシエルモー
ルド鋳型造型方法。 2 金型表面に対設される塗型剤吐出装置とその
後段に配されるシエル砂吐出装置とから成るシエ
ルモールド鋳型造型装置において、上記塗型剤吐
出装置が粉末粘結剤送給装置に連結された粉末粘
結剤吐出口と基材送給装置に連結された基材吐出
口とから成り、上記粉末粘結剤吐出口と基材吐出
口とが静電気荷電装置を有していることを特徴と
するシエルモールド鋳型造型装置。[Scope of Claims] 1. A method of forming a shell mold mold by applying a powder binder and a base material to the surface of a preheated mold, then backing up shell sand and sintering it, comprising:
A method for making a shell mold mold, characterized in that the powder binder and the base material are each independently electrostatically charged and electrostatically adsorbed onto the mold surface to obtain a composite mold coating. 2. In a shell mold mold making device consisting of a coating agent discharging device installed opposite to the mold surface and a shell sand discharging device disposed at the subsequent stage, the coating agent discharging device is connected to a powder binder feeding device. The powder binder discharge port and the base material discharge port are connected to a powder binder discharge port and a base material discharge port connected to a base material feeding device, and the powder binder discharge port and the base material discharge port have an electrostatic charging device. A shell mold mold making device featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8351279A JPS569043A (en) | 1979-07-03 | 1979-07-03 | Method and device for molding shell mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8351279A JPS569043A (en) | 1979-07-03 | 1979-07-03 | Method and device for molding shell mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS569043A JPS569043A (en) | 1981-01-29 |
JPS6242703B2 true JPS6242703B2 (en) | 1987-09-09 |
Family
ID=13804530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8351279A Granted JPS569043A (en) | 1979-07-03 | 1979-07-03 | Method and device for molding shell mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS569043A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6399425B1 (en) | 1998-09-02 | 2002-06-04 | Micron Technology, Inc. | Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices |
GB0314832D0 (en) * | 2003-06-25 | 2003-07-30 | Phoqus Pharmaceuticals Ltd | Production of capsule shells and capsules |
-
1979
- 1979-07-03 JP JP8351279A patent/JPS569043A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS569043A (en) | 1981-01-29 |
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