JPS62200797A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS62200797A JPS62200797A JP4347586A JP4347586A JPS62200797A JP S62200797 A JPS62200797 A JP S62200797A JP 4347586 A JP4347586 A JP 4347586A JP 4347586 A JP4347586 A JP 4347586A JP S62200797 A JPS62200797 A JP S62200797A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- holes
- board
- paste
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 230000001846 repelling effect Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板の両面に回路パターンが形成され、スル
ホールを通じて基板両面の回路パターン間を導通させる
プリント配線基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a printed wiring board, in which circuit patterns are formed on both sides of the board, and electrical conduction is established between the circuit patterns on both sides of the board through through holes.
従来のプリント配線基板の製造方法では、両面に回路パ
ターンが形成された基板のスルホールへ導電性ペースト
を付着させて、基板両面の回路パターン間を導通さ−せ
る方法として、第４図ないし第６図に示す方法が用いら
れていた。第４図に示すように、両面に導体にてスルホ
ールランド部１２ａ・１２ｂ等の回路パターンが基板１
３に形成されたプリント板１７には、スルホール１５が
スルホールランド部１２ａ・１２ｂに貫通孔として穿設
されている。そして、このプリント板１７を、容器に満
たされたＡｇペースト１４の上方にて水平に固定し、そ
こから、ピン１６をスルホール１５へ貫入して、Ａｇペ
ースト１４中に適当な位置まで没入させる。次に、第５
図に示すように、ピン１６を上方へ引き上げると、Ａｇ
ペースト１４はピン１６に付着した状態でピン１６に追
従して引き上げられる。そして、第６図に示すように、
スルホールランド部１２ａ・１２ｂは、ピン１６がスル
ホール１５を通過する時に、導電性ペースト１４をスル
ホール１５の内面、及びスルホールラフｆ４１（１２ａ
・１２ｂに付着させるために、導電可能となる。In the conventional method for manufacturing printed wiring boards, a conductive paste is applied to the through-holes of a board on which circuit patterns are formed on both sides, and electrical continuity is established between the circuit patterns on both sides of the board, as shown in Figures 4 to 6. The method shown in the figure was used. As shown in FIG. 4, circuit patterns such as through-hole lands 12a and 12b are formed on both sides of the board 1 using conductors.
In the printed board 17 formed in 3, through holes 15 are bored as through holes in the through hole land portions 12a and 12b. Then, this printed board 17 is fixed horizontally above the Ag paste 14 filled in the container, and from there, the pin 16 is inserted into the through hole 15 and immersed in the Ag paste 14 to an appropriate position. Next, the fifth
As shown in the figure, when the pin 16 is pulled upward, Ag
The paste 14 adheres to the pin 16 and is pulled up following the pin 16. Then, as shown in Figure 6,
Through-hole land portions 12a and 12b apply conductive paste 14 to the inner surface of through-hole 15 and through-hole rough f41 (12a) when pin 16 passes through hole 15.
- Since it is attached to 12b, it becomes conductive.
ところが、上記従来の方法では、Ａｇペーストを使用し
ていたが、これではＡｇマイグレーション（ペースト中
のＡｇ原子移行現象）のため、時間が経過するにしたが
って、そのスルホール１５の４通信頼性が低下するとい
う問題がある。上記Ａｇペーストの代替として、例えば
Ｃｕペーストを用いた場合には、上記の方法ではＣｕペ
ーストが有する物性のためにスルホール１５及びスルホ
ールランド部１２ａ・１２ｂに十分な量のＣｕペースト
を付着させることができない。このため、スルホール１
５の導通抵抗が過大になるという問題点があった。また
、スルホール１５の孔径は、通常０．７〜０．８龍と小
径であるために、ピン１６の位置調整や、ピン１６を用
いる治具の製作が複雑なものとなる等の欠点を有してい
た。However, in the above conventional method, Ag paste is used, but with this, the reliability of the through holes 15 deteriorates as time passes due to Ag migration (Ag atom transfer phenomenon in the paste). There is a problem with doing so. For example, when Cu paste is used as a substitute for the Ag paste, it is difficult to attach a sufficient amount of Cu paste to the through holes 15 and the through hole lands 12a and 12b due to the physical properties of the Cu paste in the above method. Can not. For this reason, through hole 1
There was a problem that the conduction resistance of No. 5 was excessive. In addition, since the diameter of the through hole 15 is usually small, 0.7 to 0.8 mm, it has disadvantages such as complicating the position adjustment of the pin 16 and the manufacture of a jig using the pin 16. Was.
〔発明の目的］
本発明は、上記従来の問題点を考慮してなされたもので
あって、両面に回路パターンが形成されたプリント板の
スルホールに導電性ペーストを付着した際に、上記スル
ホールの導通が断線状態になったり、或いは上記スルホ
ールの導通抵抗が過大になることを防止し得るプリント
配線基板の製造方法の提供を目的とするものである。[Object of the Invention] The present invention has been made in consideration of the above-mentioned problems of the conventional art. It is an object of the present invention to provide a method for manufacturing a printed wiring board that can prevent conduction from becoming disconnected or from increasing the conduction resistance of the through-holes to an excessive extent.
本発明のプリント配線基板の製造方法は、上記目的を達
成するために、両面に回路パターンが形成されたプ１）
ント板両面の回路パターン間を導通。In order to achieve the above object, the method for manufacturing a printed wiring board of the present invention provides a printed circuit board (1) in which a circuit pattern is formed on both sides.
Continuity between circuit patterns on both sides of the control board.
させる゛ための、上記プリント板のスルホールに導電性
ペーストを付着させるプリント配線基板の製造方法にお
いて、上記スルホールに対応して貫通孔が穿設された冶
具板を上記プリント板上に、上記スルホールと貫通孔と
が連通ずるように密着させ、上記貫通孔を通じて導電性
ペーストを上記スルホールに注入し、下方からはこの導
電性ペーストを吸引してスルホールに付着させる。この
ようにして上記プリント板両面の回路パターン間を導通
させることにより、上記プリント板のスルホールにおけ
る導通を確実なものとし、かつ、上記プリント板のスル
ホールに導電性ペーストを容易に付着させ得るように構
成したことを特徴とするものである。In the method for manufacturing a printed wiring board in which a conductive paste is attached to the through-holes of the printed circuit board for the purpose of A conductive paste is injected into the through hole through the through hole, and the conductive paste is sucked from below and adhered to the through hole. By establishing conduction between the circuit patterns on both sides of the printed board in this way, the conductivity in the through holes of the printed board is ensured, and the conductive paste can be easily attached to the through holes of the printed board. It is characterized by the following structure.
本発明の一実施例を第１図ないし第３図に基づいて説明
すれば、以下の通りである。An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.
第１図に示すように、両面に導体にてスルホールランド
部５ａ・５ｂ等の回路パターンが基板６に形成されたプ
リント板６１には、スルホール８がスルホールランド５
ａ・５ｂに貫通孔として穿設されている。冶具板３１は
、金属板３とＣｕペースト２を弾く性質を有するペース
ト排斥層４とを重層したものであり、プリント板６１の
スルホール８と対応するように貫通孔１０を穿設したも
のである。貫通孔１０のペースト排斥層４側の開口端部
ば、面取りを施して、円すい状に削り取られた形状にな
っている。ステージ７は、治具板３１同様にプリント板
６１のスルホール８に対応して穿設された貫通孔９を有
している。なお、貫通孔９の孔径はスルホール８の孔径
より大きなもの、となっている。そして、プリント板６
１はステージ７に密着した状態にて載置され、治具板３
１はペースト排斥層がプリント板６１との接触面となる
ようにプリント板６１に密着し°た状態にて載置されて
いる。この状態において、治具Ｆｉ３１、プリント板６
１、ステージ７は、貫通孔１０、スルホール８、貫通孔
９がそれぞれ連通ずるように固定されている。As shown in FIG. 1, a printed circuit board 61 has circuit patterns such as through-hole lands 5a and 5b formed on both sides using conductors, and a through-hole 8 is connected to the through-hole land 5.
Through holes are bored in a and 5b. The jig plate 31 is made up of a metal plate 3 and a paste repelling layer 4 having a property of repelling the Cu paste 2, and has through holes 10 formed therein to correspond to the through holes 8 of the printed board 61. . The opening end of the through hole 10 on the side of the paste repelling layer 4 is chamfered to have a conical shape. Like the jig plate 31, the stage 7 has a through hole 9 bored corresponding to the through hole 8 of the printed board 61. Note that the diameter of the through hole 9 is larger than that of the through hole 8. And printed board 6
1 is placed in close contact with the stage 7, and the jig plate 3
1 is placed in close contact with the printed board 61 so that the paste repelling layer becomes the contact surface with the printed board 61. In this state, the jig Fi31, the printed board 6
1. The stage 7 is fixed so that the through hole 10, the through hole 8, and the through hole 9 are in communication with each other.
次に、スルホール８及びスルホールランド部５ａ・５ｂ
にＣｕペースト２を付着させる方法について説明する。Next, through hole 8 and through hole land portions 5a and 5b
A method for attaching Cu paste 2 to the substrate will be explained.
まず、第１図に示すように、Ｃｕペースト２を冶具板３
１上に載せ、スキージ１を治具板３１上に摺動させるこ
とにより、Ｃｕペースト２は、貫通孔１０に押し込まれ
、この貫通孔１０を通じてスルホール８に付着する。こ
の付着作業時に、ステージ７の貫通孔９を通じて空気を
吸引することにより、第２図に示すように、ＣＬＩペー
スト２は、スルホール８の内面とスルホールランド面５
ａ・５ｂとに付着する。これにより、スルホールランド
部５ａ・５ｂ間は、６育実に導通状態になる。次に、第
３図に示すように、スルホール８及びスルホールランド
部５ａ・５ｂにＣｕペースト２が付着したのち、プリン
ト板６１に密着させていた治具板３１を取り外してこの
作業が完了する。このとき、治具板３１にはペースト排
斥層４が形成されているので、スルホール８及びスルホ
ールランド部５ａ・５ｂに付着させたＣｕペースト２は
、治具板３１側に付着することなく、治具板３１をプリ
ント板６１から取り外すことができる。First, as shown in Fig. 1, Cu paste 2 is applied to the jig plate 3.
By placing the squeegee 1 on the jig plate 31 and sliding the squeegee 1 onto the jig plate 31, the Cu paste 2 is pushed into the through hole 10 and adheres to the through hole 8 through the through hole 10. During this adhesion work, by suctioning air through the through hole 9 of the stage 7, the CLI paste 2 is applied to the inner surface of the through hole 8 and the through hole land surface 5, as shown in FIG.
It adheres to a and 5b. As a result, the through-hole land portions 5a and 5b become electrically conductive. Next, as shown in FIG. 3, after the Cu paste 2 has adhered to the through holes 8 and the through hole lands 5a and 5b, the jig plate 31 that was in close contact with the printed board 61 is removed to complete this work. At this time, since the paste repelling layer 4 is formed on the jig plate 31, the Cu paste 2 attached to the through holes 8 and the through hole lands 5a and 5b does not adhere to the jig plate 31 side and can be cured. The tool board 31 can be removed from the printed board 61.
本発明のプリント配線基板の製造方法は、以上のように
、両面に回路パターンが形成されたプリント板両面の回
路パターン間を導通させるための上記プリント板のスル
ホールに導電性ペーストを付着させるプリント配線基板
の製造方法において、上記スルホールに対応して貫通孔
が穿設された冶具板を上記プリント板上に、上記スルホ
ールと貫通孔とが連通ずるように密着させ、上記貫通孔
を通じて導電性ペーストを上記スルホールに注入し、下
方からはこの導電性ペーストを吸引して、上記プリント
板両面の回路パターン間を導通させる構成である。これ
により、上記プリント配線基板のスルホールにおける導
通が断線状態になったり、或いは、上記スルホールの導
通抵抗が過大になるのを確実に防止し得る。更に、上記
スルホールに導電性ペーストを付着させるのに複雑な治
具を必要としないので、導電性ペーストの付着作業が簡
易なものとなる等の効果を奏する。As described above, the method for manufacturing a printed wiring board of the present invention includes a printed wiring board in which a conductive paste is attached to the through-holes of the printed board for establishing continuity between the circuit patterns on both sides of the printed board having circuit patterns formed on both sides. In the method for manufacturing a board, a jig plate having through holes formed corresponding to the through holes is closely attached to the printed board so that the through holes and the through holes are in communication with each other, and a conductive paste is applied through the through holes. The conductive paste is injected into the through hole and sucked from below to establish electrical continuity between the circuit patterns on both sides of the printed board. Thereby, it is possible to reliably prevent the conduction in the through-holes of the printed wiring board from becoming disconnected or the conduction resistance of the through-holes becoming excessive. Furthermore, since no complicated jig is required to attach the conductive paste to the through-holes, the work of attaching the conductive paste becomes simple.
第１図ないし第３図はそれぞれ本発明の一実施例を示す
縦断説明図、第４図ないし第６図は従来例を示す縦断説
明図である。
１はスキージ、２はＣｕペースト、３は金属板、４はペ
ースト排斥層、５ａ・５ｂはスルホールランド部、６は
基板、７はステージ、８はスルホール、３１は治具板、
６１はプリント板である。FIGS. 1 to 3 are longitudinal sectional views showing an embodiment of the present invention, and FIGS. 4 to 6 are longitudinal sectional views showing a conventional example. 1 is a squeegee, 2 is a Cu paste, 3 is a metal plate, 4 is a paste exclusion layer, 5a and 5b are through-hole lands, 6 is a substrate, 7 is a stage, 8 is a through-hole, 31 is a jig plate,
61 is a printed board.
Claims (1)
回路パターン間を導通させるための上記プリント板のス
ルホールに導電性ペーストを付着させるプリント配線基
板の製造方法において、上記スルホールに対応して貫通
孔が穿設された治具板を上記プリント板上に、上記スル
ホールと貫通孔とが連通するように密着させ、上記貫通
孔を通じて導電性ペーストを上記スルホールに注入し、
下方からはこの導電性ペーストを吸引してスルホールに
付着させ、上記プリント板両面の回路パターン間を導通
させることを特徴とするプリント配線基板の製造方法。1. A printed wiring board manufacturing method in which a conductive paste is attached to the through-holes of the printed board for establishing continuity between the circuit patterns on both sides of the printed board, in which through-holes are formed corresponding to the through-holes. A jig plate having a hole formed therein is closely attached to the printed board so that the through hole and the through hole communicate with each other, and a conductive paste is injected into the through hole through the through hole,
A method for manufacturing a printed wiring board, characterized in that the conductive paste is sucked from below and adhered to the through holes to create electrical continuity between the circuit patterns on both sides of the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4347586A JPS62200797A (en) | 1986-02-27 | 1986-02-27 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4347586A JPS62200797A (en) | 1986-02-27 | 1986-02-27 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62200797A true JPS62200797A (en) | 1987-09-04 |
Family
ID=12664744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4347586A Pending JPS62200797A (en) | 1986-02-27 | 1986-02-27 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62200797A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01319994A (en) * | 1988-06-22 | 1989-12-26 | Matsushita Electric Ind Co Ltd | Manufacture of printed wiring board |
-
1986
- 1986-02-27 JP JP4347586A patent/JPS62200797A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01319994A (en) * | 1988-06-22 | 1989-12-26 | Matsushita Electric Ind Co Ltd | Manufacture of printed wiring board |
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