JPS61280628A - Semiconductor lead inspection device - Google Patents
Semiconductor lead inspection deviceInfo
- Publication number
- JPS61280628A JPS61280628A JP60123004A JP12300485A JPS61280628A JP S61280628 A JPS61280628 A JP S61280628A JP 60123004 A JP60123004 A JP 60123004A JP 12300485 A JP12300485 A JP 12300485A JP S61280628 A JPS61280628 A JP S61280628A
- Authority
- JP
- Japan
- Prior art keywords
- image
- lead terminal
- light
- lead
- terminal part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、半導体集積回路などの多数のリード端子を有
する半導体装置についてリード端子の外観検査を行なう
ための半導体リード検査装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor lead inspection device for visually inspecting lead terminals of a semiconductor device having a large number of lead terminals, such as a semiconductor integrated circuit.
半導体装置の製造に際しての最終検査工程において半導
体リードの外観検査を行なう場合、従来は検査員がリー
ド端子を直接にあるいは拡大レンズで拡大して目視によ
夛観察していた。When conducting an external appearance inspection of a semiconductor lead in the final inspection process during the manufacture of a semiconductor device, an inspector has conventionally visually inspected the lead terminals either directly or by enlarging them with a magnifying lens.
このように細かい部分を目視によシ観察することは、正
確に検査することが困難であり、検査効率も低い。また
、通常は半導体装置をレール状の台に載置すると共に照
明を施した状態で検査しているが、載置台による照明光
の乱反射によって観察が困難になる。It is difficult to visually observe such fine parts to accurately inspect them, and the inspection efficiency is also low. Further, although semiconductor devices are usually inspected while being placed on a rail-shaped stand and illuminated, observation becomes difficult due to diffuse reflection of illumination light by the mounting stand.
本発明は上記の事情に鑑みてなされたもので、半導体装
置のリード端子部を、背景と明確に区別されてはりきシ
とした輪郭を有すると共にほぼ均一の光度を有する入力
画像として捉えて観測可能であり、正確かつ効率良く前
記リート争端子部の外観を検査し得る半導体リード検査
装置を提供するものである。The present invention has been made in view of the above circumstances, and the lead terminal portion of a semiconductor device is captured and observed as an input image that has a sharp outline that is clearly distinguished from the background and has a substantially uniform luminous intensity. The present invention provides a semiconductor lead inspection device capable of accurately and efficiently inspecting the external appearance of the lead terminal portion.
即ち、本発明の半導体リード検査装置は、暗い色の非鏡
面表面を有する載置台の上に検査対象である半導体装置
を載せ、そのリード端子部を光源により平均的に照射し
たときの反射光像をテレピッ、ン撮像して得られた画像
信号に基いて自動的に前記リード端子部の外観の検査を
行なうようにしてなることを特徴とするものである。That is, the semiconductor lead inspection device of the present invention places a semiconductor device to be inspected on a mounting table having a dark non-specular surface, and detects a reflected light image when the lead terminal portion is irradiated evenly with a light source. The present invention is characterized in that the external appearance of the lead terminal portion is automatically inspected based on an image signal obtained by telephonically imaging the lead terminal portion.
したがって、テレピノ、ン撮俄のためのリード端子部の
入力光像は、リード端子部が背景と明確に区別されたは
りきシとして輪郭を有し、且つリード端子部全体がほぼ
均一の光度を有するようになるので、画像信号に基〈リ
ード端子部の外観検査を正確且つ効率良く行なうことが
可能になる。Therefore, the input light image of the lead terminal part for telephoto shooting is such that the lead terminal part has a sharp outline that is clearly distinguished from the background, and the entire lead terminal part has a substantially uniform luminous intensity. Therefore, it is possible to accurately and efficiently inspect the appearance of the lead terminal portion based on the image signal.
以下、図面を参照して本発明の一実施例を詳細に説明す
る。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
図において、１は検査対象となる半導体装置であシ、た
とえばＤＩＰ （７″ユアルインライン型）９ツケーゾ
）聾の樹脂モールド型の集積回路である。２は上記集積
回路１を載置するためのレール状の載置台であシ、表面
は非鏡面であって微少な凹凸部を有し、且つたとえば黒
色に着色されることによって暗い色を有している。３は
上記載置台２に載置された集積回路１のリード端子１亀
群に対向する位置に配設されたリング状の光源であり、
集積回路１のリード端子１３群に全体的にたとえば白色
光を照射するものである。４は上記光源３の中心部空間
を通して前記リード端子１３群からの反射光を受けてテ
レピノ、ン撮像を行なう監視用テレビカメラを備えた撮
像装置である。５は上記撮像装置４に前記光源３からの
光が直接に入ることを防止すると共に前記リード端子１
凰部に装置周辺からの光が入射することを防止するため
に光源近傍に設けられた遮光フードである。６は前記撮
像装置４の出力画像信号を受けて画像表示を行なうビデ
オモニタ等の画像表示器であシ、７は同じく上記出力画
像信号を受けて画像認識・分析処理を行ない、リード端
子像の状態について良。In the figure, 1 is a semiconductor device to be inspected, for example, a DIP (7" personal in-line type), a resin molded integrated circuit. 2 is a place for mounting the above-mentioned integrated circuit 1. 3 is a rail-shaped mounting table, the surface of which is non-mirrored, has minute irregularities, and has a dark color, for example, by being colored black. It is a ring-shaped light source disposed at a position facing the group of lead terminals 1 of the integrated circuit 1,
The entire group of lead terminals 13 of the integrated circuit 1 is irradiated with, for example, white light. Reference numeral 4 denotes an imaging device equipped with a monitoring television camera that receives reflected light from the group of lead terminals 13 through the central space of the light source 3 and performs telephoto imaging. 5 prevents the light from the light source 3 from directly entering the imaging device 4, and also connects the lead terminal 1.
This is a light-shielding hood provided near the light source to prevent light from entering the hood from the surroundings of the device. 6 is an image display device such as a video monitor that receives the output image signal from the imaging device 4 and displays the image; 7 also receives the output image signal and performs image recognition and analysis processing to display the image of the lead terminal. Good condition.
不良等の判定処理を自動的に行なってリード端子部の外
観検査を行なう画像処理装置である。This is an image processing device that automatically performs defective judgment processing and performs an external appearance inspection of a lead terminal portion.
上記半導体リード検査装置においては、集積回路１のリ
ード端子１息群を撮像して得た画像信号に対して画像認
識・分析処理を自動的に行なってリード端子１ａ群の外
観を自動的に検査するものである。したがって、従来の
検査員の目視観察による検査に比べて、正確かつ効率良
く検査することができる。また、前記リード端子１＆群
を撮像して得た画像を画像表示器６に拡大表示すること
が可能であり、検査員によるモニタ観察も可能である。In the semiconductor lead inspection device described above, image recognition and analysis processing is automatically performed on image signals obtained by imaging one group of lead terminals of the integrated circuit 1, and the appearance of the group of lead terminals 1a is automatically inspected. It is something to do. Therefore, compared to the conventional inspection by visual observation by an inspector, inspection can be performed more accurately and efficiently. Further, the image obtained by capturing the lead terminals 1 & group can be enlarged and displayed on the image display 6, and can also be observed on a monitor by an inspector.
そして、上記検査装置にあっては、載置台２の表面は暗
くて非鏡面であるから光源３からの照射による反射光が
少なくなるので、撮像装置４の入力光像はリード端子ｌ
ａ像と背景像との区別が明確になシ、リード端子ｌａ像
の輪郭が明確になる。また、光源３としてリング状のも
のが使用され、リード端子部、は装置周辺からの光が入
射しないように遮光フード５によシ遮光されて暗視野照
明が施されてｈるので、リード端子１ａ部はリング状光
源、？によシ比較的容易に全体的に平均的に照射され、
装置周辺の明るさの影響を受けることがなく、一定の明
るさを保つことができる。したがって、撮像装置４の人
力画像は光度が均一化され、その撮像出力信号を画像処
理装置７で正確に処理（リード端子Ｊａ像を正確に判別
）することが容易になシ、検査を正確かつ容易に行なう
ことが可能になる。In the above inspection apparatus, since the surface of the mounting table 2 is dark and non-mirror, the reflected light from the light source 3 is reduced, so that the input light image of the imaging device 4 is transmitted to the lead terminal l.
The image a and the background image can be clearly distinguished, and the outline of the image of the lead terminal la becomes clear. In addition, a ring-shaped light source 3 is used, and the lead terminal portion is shielded from light by a light-shielding hood 5 to prevent light from entering the device surroundings and dark-field illumination is applied to the lead terminal. Part 1a is a ring-shaped light source, ? It is relatively easy to irradiate the whole body evenly,
It is not affected by the brightness around the device and can maintain a constant brightness. Therefore, the luminous intensity of the human image captured by the imaging device 4 is made uniform, and the image processing device 7 can easily process the captured image output signal accurately (accurately identify the image of the lead terminal Ja). It becomes possible to do it easily.
なお、本発明は上記実施例に限らず、リング状光源とし
て複数個の点光源をリング状に配列したものを用いても
よく、またリング状光源に代えて中心部に撮像用透孔を
有する面光源を用いてもよく、要はリード端子群を平均
的に照射可能な光源を用いればよい。また、検査対象で
ある半導体装置は、ＤＩＰ型以外（たとえばフラット型
）のものであってもよく、載置台もレール状以外のもの
であってもよい。Note that the present invention is not limited to the above-mentioned embodiments, and a ring-shaped light source in which a plurality of point light sources are arranged in a ring-shape may be used, and a ring-shaped light source may be replaced with a ring-shaped light source having a through-hole for imaging in the center. A surface light source may be used, and in short, a light source that can irradiate the lead terminal group evenly may be used. Further, the semiconductor device to be inspected may be of a type other than the DIP type (for example, a flat type), and the mounting table may also be of a type other than the rail type.
上述したように本発明の半導体リード検査装置によれば
、半導体装置リード端子の背景となる載置台表面を暗い
色の非鏡面とし、このＩＪ−ド端子部を平均的に照射す
る光源を使用し、仁のリード端子部からの反射光を受け
てテレビノヨン撮像し、撮像出力信号を画像処理して検
査するようにしたので、半導体装置リード端子像を背景
と明確に区別されたはりきシした輪郭を有すると共にほ
ぼ均一の光度を有する入力画像として捉えて観測可能に
なシ、正確かつ効率良く検査することができる。As described above, according to the semiconductor lead inspection apparatus of the present invention, the surface of the mounting table, which is the background of the semiconductor device lead terminals, is made into a dark non-mirror surface, and a light source is used that irradiates the IJ-domain terminals evenly. By receiving the reflected light from the lead terminals of the semiconductor device, a telephoto image is captured, and the image output signal is image-processed for inspection, so that the image of the semiconductor device lead terminals has a sharp outline that is clearly distinguished from the background. It is possible to capture and observe the input image as an input image having a substantially uniform luminous intensity, and to inspect it accurately and efficiently.
図面は本発明の半導体リード検査装置の一実施例を示す
構成説明図である。
１・・・半導体装置、Ｊ＆・・・リード端子、２・・・
載置台、３・・・リング状光源、４・・・撮像装置、５
・・・遮光２−ド、６・・・画像表示器、７・・・画像
処理装置・The drawing is a configuration explanatory diagram showing an embodiment of the semiconductor lead inspection apparatus of the present invention. 1... Semiconductor device, J&... Lead terminal, 2...
Mounting table, 3... Ring-shaped light source, 4... Imaging device, 5
. . . Light shielding 2-door, 6 . . Image display, 7 . . . Image processing device.
Claims (3)
台に載せられる検査対象である半導体装置のリード端子
部に対向して配設され、このリード端子部を平均的に照
射する光源と、上記リード端子部からの反射光像を受け
てテレビジョン撮像を行なう撮像装置と、この撮像装置
の出力信号を受けて画像処理し、前記リード端子部の状
態を検査する画像処理装置とを具備することを特徴とす
る半導体リード検査装置。(1) A mounting table with a dark non-specular surface, and a light source that is arranged opposite to the lead terminal section of the semiconductor device to be inspected placed on this mounting table and irradiates the lead terminal section evenly. an imaging device that performs television imaging by receiving a reflected light image from the lead terminal portion; and an image processing device that receives an output signal from the imaging device, processes the image, and inspects the state of the lead terminal portion. A semiconductor lead inspection device comprising:
前記特許請求の範囲第１項記載の半導体リード検査装置
。(2) The semiconductor lead inspection apparatus according to claim 1, wherein the light source is a ring-shaped light source.
いように遮光するフードを設けてなることを特徴とする
前記特許請求の範囲第１項または第２項に記載の半導体
リード検査装置。(3) The semiconductor lead inspection device according to claim 1 or 2, further comprising a hood that blocks light from entering the lead terminal portion from the periphery of the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60123004A JPS61280628A (en) | 1985-06-06 | 1985-06-06 | Semiconductor lead inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60123004A JPS61280628A (en) | 1985-06-06 | 1985-06-06 | Semiconductor lead inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61280628A true JPS61280628A (en) | 1986-12-11 |
Family
ID=14849874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60123004A Pending JPS61280628A (en) | 1985-06-06 | 1985-06-06 | Semiconductor lead inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61280628A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63134524A (en) * | 1986-11-27 | 1988-06-07 | Toppan Printing Co Ltd | Production apparatus for iron solution |
| US5257714A (en) * | 1990-11-20 | 1993-11-02 | International Business Machines Corporation | Method and apparatus for electronic component lead inspection |
-
1985
- 1985-06-06 JP JP60123004A patent/JPS61280628A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63134524A (en) * | 1986-11-27 | 1988-06-07 | Toppan Printing Co Ltd | Production apparatus for iron solution |
| US5257714A (en) * | 1990-11-20 | 1993-11-02 | International Business Machines Corporation | Method and apparatus for electronic component lead inspection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR960006968B1 (en) | Semiconductor inspection apparatus and the method | |
| JPS6472540A (en) | Radiation microscope and method for detecting light emitted from defect in dielectric layer of integrated circuit device | |
| JP2004037248A (en) | Inspection device and inspection method for through hole | |
| KR960005090B1 (en) | Bonding wire inspection apparatus | |
| TW561240B (en) | Illumination system used for apparatus for inspecting surface-mounted chip | |
| JPS61280628A (en) | Semiconductor lead inspection device | |
| JP2507421B2 (en) | Observation device for the subject | |
| JP2000018927A (en) | Visual inspection device | |
| JP2842486B2 (en) | Transparent mold IC inspection equipment | |
| JPH0522176B2 (en) | ||
| JP2004347525A (en) | Visual inspection method for semiconductor chip and device therefor | |
| JPH05188006A (en) | Surface flaw detecting device | |
| JPH07104287B2 (en) | Inspection method for minute defects of transparent object with curved surface | |
| JP2003050212A (en) | Appearance inspection device for liquid crystal module for electronic appliance | |
| JP3596182B2 (en) | Image processing system | |
| JP2981510B2 (en) | Lead parts inspection equipment | |
| JPH0682216A (en) | Appearance inspector | |
| KR0152885B1 (en) | Classifying method of soldering for pcb | |
| KR100243219B1 (en) | Method for inspecting the light-receiving face of a charge coupled device | |
| JPH03181807A (en) | Visual apparatus | |
| JPH08223727A (en) | Surface inspection apparatus for cable insulator | |
| JPS6025405A (en) | Input system for image of solder surface | |
| JPH05307007A (en) | Surface inspecting method | |
| KR19990056827A (en) | Lead frame inspection system and method | |
| JPH06213822A (en) | Method and apparatus for stereoscopic inspection of ceramic substrate |