JPS61225841A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS61225841A JPS61225841A JP6502685A JP6502685A JPS61225841A JP S61225841 A JPS61225841 A JP S61225841A JP 6502685 A JP6502685 A JP 6502685A JP 6502685 A JP6502685 A JP 6502685A JP S61225841 A JPS61225841 A JP S61225841A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- resin
- semiconductor device
- lead
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
この発明は、樹脂封止型半導体装置に関し、特に回路基
板等に対する搭載面積が従来の同種半導体装置よりも著
しく小さい樹脂封止型半導体装置に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a resin-sealed semiconductor device, and particularly to a resin-sealed semiconductor device whose mounting area on a circuit board or the like is significantly smaller than that of conventional similar semiconductor devices. It is.
［発明の技術的背景］
電子機器の小型化は時代の要請であり、従ってこれを推
進するために電子機器に搭載する各種電子部品にも小型
化が求められている。[Technical Background of the Invention] Miniaturization of electronic devices is a demand of the times, and therefore, in order to promote this, miniaturization of various electronic components installed in electronic devices is also required.
特に、多ビン化が進行している樹脂封止型半導体装置の
パッケージでは、回路基板に対する搭載面積を小さくし
て高密度実装を実現させるため、表面実装型のフラット
パッケージやリード付きチップキャリヤが多用されるよ
うになってきている。In particular, in resin-sealed semiconductor device packages, where the number of bins is increasing, surface-mount flat packages and chip carriers with leads are often used to reduce the mounting area on circuit boards and achieve high-density mounting. This is becoming more and more common.
かかる従来の半導体装置には以下のごとき問題点があっ
た。Such conventional semiconductor devices have the following problems.
［背景技術の問題点］
第４図は従来公知の一方向フラットパッケージ型の樹脂
封止型半導体装置を示したものである。[Problems with Background Art] FIG. 4 shows a conventionally known unidirectional flat package type resin-sealed semiconductor device.
この型式の半導体装置は、同図に図示したようにリード
２を屈曲成形した後、樹脂モールド部１の下面１ａを下
にして回路基板（図示せず）に搭載するが、回路基板へ
搭載した状態ではリード２が樹脂モールド部１の側方へ
の張り出しており、リード２の突出長が該半導体装置の
全中の数十％（面積比２０〜５０％）にも達していた。This type of semiconductor device is mounted on a circuit board (not shown) with the lower surface 1a of the resin molded part 1 facing down after the leads 2 are bent and molded as shown in the figure. In this state, the leads 2 protruded to the sides of the resin molded part 1, and the protruding length of the leads 2 reached several tens of percent (area ratio 20 to 50%) of the entire semiconductor device.
このため、従来の半導体装置ではリード２の占める占
有面積が大きく、従ってリードの形状がそれ以上の高密
度実装を妨げる大きな障害となっている。For this reason, in the conventional semiconductor device, the lead 2 occupies a large area, and the shape of the lead is therefore a major obstacle to higher density packaging.
また、従来のフラットパッケージ型半導体装ばては樹脂
モールド部１の側方へ張り出すリード２のリードピッチ
が狭かったり張出量が大きいため、たとえば振動搬送機
によって該半導体装置を搬送する時にリードが他の半導
体装置のリードに絡みやすかったり、或いはリードが他
の物体に衝突して変形しやすい等の問題があった。In addition, in conventional flat package semiconductor devices, the lead pitch of the leads 2 that protrude to the sides of the resin molded part 1 is narrow, and the amount of protrusion is large. There have been problems such as the leads easily becoming entangled with the leads of other semiconductor devices, or the leads colliding with other objects and being easily deformed.
次に、リード付きチップキャリヤの場合には、リードピ
ッチが狭いため折曲げに際しあるいは折曲げ後に、隣り
合うリードが接触しやすいという欠点があった。 また
ＳＩＰ型のようにリードが樹脂モールド部の一側面のみ
から突出しているリード付きチップキャリヤは搭載が不
安定なため、そのようなリード付きチップキャリヤは実
現されていなかった。Next, in the case of a chip carrier with leads, the lead pitch is narrow, so that adjacent leads tend to come into contact with each other during or after bending. In addition, a chip carrier with leads such as the SIP type, in which the leads protrude from only one side of the resin molded portion, is unstable to mount, so such a chip carrier with leads has not been realized.
［発明の目的コ
この発明の目的は、リード付きチップキャリヤのリード
折り曲げ用ガイドを有する半導体装置を提供することで
ある。 またこの発明の別の目的は、搭載が安定したリ
ード付きチップキャリヤ型半導体装置を提供することで
ある。 ざらにこの発明の他の目的は、樹脂モールド部
（すなわち外囲器）からのリード突出長を従来の半導体
装置よりも著しく減少させた新規な樹脂封止型半導体装
置を提供することであり、従来のフラットパッケージ型
半導体装置よりもかなり実装密度を高くすることのでき
る新規な半導体装置を提供することである。[Object of the Invention] An object of the present invention is to provide a semiconductor device having a lead bending guide for a chip carrier with leads. Another object of the present invention is to provide a leaded chip carrier type semiconductor device that can be mounted stably. Another object of the present invention is to provide a novel resin-sealed semiconductor device in which the protrusion length of the leads from the resin mold portion (i.e., the envelope) is significantly reduced compared to conventional semiconductor devices; It is an object of the present invention to provide a new semiconductor device that can have a considerably higher packaging density than conventional flat package type semiconductor devices.
［発明の概要］
本発明による半導体装置の特徴は、樹脂モールド部すな
わち外囲器の側面から突出しているり一ドを該側面及び
樹脂モールド部下面に沿ってそれぞれの角でＬ字形に屈
曲成形するとともに、該樹脂モールド部の下面における
リード先端部が該リード先端部の各々と平行になるよう
に咳下面にモールド成形された多数の浅い溝の中に収容
されており、該溝の深さが該リード先端部の肉厚よりも
浅いことにある。 このような構造によれば、樹脂モー
ルド部の側面から突出しているリードの長さを従来の半
導体装置よりも著しく短くすることができ、その結果、
回路基板上への実装密度を高めることができる。 なお
、リードの相互接触を防止するために樹脂モールド部の
下面には各リードを個別に収容しつる浅い溝が互いに並
列して形成されており、リード相互の接触を防止すると
ともに屈曲成形のガイドとなっている。[Summary of the Invention] A feature of the semiconductor device according to the present invention is that the resin mold portion, that is, the groove protruding from the side surface of the envelope is bent into an L-shape at each corner along the side surface and the lower surface of the resin mold. At the same time, the lead tips on the lower surface of the resin molded part are accommodated in a number of shallow grooves molded on the lower surface so as to be parallel to each of the lead tips, and the depth of the grooves is The reason is that it is shallower than the wall thickness of the tip of the lead. According to such a structure, the length of the leads protruding from the side surface of the resin molded part can be made significantly shorter than that of conventional semiconductor devices, and as a result,
The packaging density on the circuit board can be increased. In order to prevent the leads from coming into contact with each other, shallow grooves are formed in parallel with each other on the bottom surface of the resin molded part to accommodate each lead individually. It becomes.
なおまた、樹脂モールド部下面にリードと同一平面を構
成する傾き防止用突部をもうけることが、一方向のリー
ド付きチップキャリヤや隣り合う二方向チップキャリヤ
にとっての安定搭載に好ましく、ざらに該突部を成形用
金型のエジエクタピンのモールド成形の跡として形成さ
れる突部とすることが成形を容易にするうえで好ましい
。Furthermore, it is preferable to provide a tilt-prevention protrusion on the lower surface of the resin mold that is flush with the leads for stable mounting of chip carriers with leads in one direction and adjacent two-way chip carriers. In order to facilitate molding, it is preferable that the portion be a protrusion formed as a molding trace of the ejector pin of the molding die.
［発明の実施例］
第１図乃至第３図は本発明による半導体装置の一実施例
を示した図である。[Embodiment of the Invention] FIGS. 1 to 3 are diagrams showing an embodiment of a semiconductor device according to the present invention.
本発明の半導体装置においては、第１図乃至第３図に示
すように樹脂モールド部１の側面から突出しているリー
ド２が該側面及び樹脂モールド部１の下面１ａに沿うよ
うにＬ字形に折曲げ成形されており、樹脂モールド部１
の下面に平行な各リードの先端部２ａは該樹脂モールド
部１の下面に形成された浅い溝１ｂの中に収容されてい
る。In the semiconductor device of the present invention, as shown in FIGS. 1 to 3, the leads 2 protruding from the side surface of the resin molded portion 1 are folded into an L-shape along the side surface and the lower surface 1a of the resin molded portion 1. It is bent and molded, and the resin mold part 1
The tip end portion 2a of each lead parallel to the lower surface is accommodated in a shallow groove 1b formed in the lower surface of the resin molded part 1.
これらの溝１ｂは各リード毎に設けられており、この溝
１ｂは各リード２の肉厚よりも浅い深さに形成されてい
る。 従って、第３図に示すように樹脂モールド部１の
下面においては各リード２の先端部２ａが樹脂モールド
部１の下面１ａよりも下側へｈだけ突出しており、この
半導体装置を回路基板上へ搭載する時に各リードの先端
部２ａに塗布した半田リフロ一部分と該回路基板上の導
体とが接着するようになっている。 一方、樹脂モール
ド部１の下面には該リード２の突出１ｈと同じ突出高さ
ｈの突部１Ｃが設けられており、この突部１Ｃは回路基
板上に接触して該半導体装置と回路基板との間隔を保つ
ようになっている。 この突部１Ｃの高ざｈがリード２
の突出高さｈと同じであるため半導体装置を回路基板上
に搭載する時に樹脂モールド部１は突部１Ｃとリード２
の先端部２ａとによって回路基板上に水平に支持される
。 この突部１Ｃは専用に成形してもよいが、樹脂モー
ルド部１の成形時に金型に該樹脂モールド部の離型用と
して設けたエジェクタピンの成形跡を利用して形成して
もよい。These grooves 1b are provided for each lead, and the grooves 1b are formed at a depth shallower than the thickness of each lead 2. Therefore, as shown in FIG. 3, on the bottom surface of the resin molded part 1, the tip end 2a of each lead 2 protrudes downward by h from the bottom surface 1a of the resin molded part 1, and this semiconductor device is mounted on a circuit board. When the circuit board is mounted on the circuit board, a portion of the solder reflow applied to the tip end 2a of each lead adheres to the conductor on the circuit board. On the other hand, a protrusion 1C having the same protrusion height h as the protrusion 1h of the lead 2 is provided on the lower surface of the resin molded part 1, and this protrusion 1C contacts the circuit board to connect the semiconductor device and the circuit board. It is designed to maintain a distance between the two. The height h of this protrusion 1C is the lead 2
Since the protrusion height h is the same as that of the protrusion height h, when mounting the semiconductor device on the circuit board, the resin mold part 1 has the protrusion 1C and the lead 2.
It is horizontally supported on the circuit board by the tip end 2a of. This protrusion 1C may be specially molded, but it may also be formed using the molding marks of an ejector pin provided in the mold during molding of the resin mold part 1 for releasing the resin mold part.
［発明の効果］
前記のごとき本発明の半導体装置では、リードが樹脂モ
ールド部の側面と下面とに沿ってＬ字形に屈曲成形され
ているため、その全中Ｗ２（第１図参照）が従来の半導
体装置の全巾Ｗ、よりかなり小さく、しかも樹脂モール
ド部の側方にリードが張り出していないので次のような
種々の効果が得られる。[Effects of the Invention] In the semiconductor device of the present invention as described above, since the leads are bent into an L-shape along the side and bottom surfaces of the resin molded part, the entire middle W2 (see FIG. 1) is different from the conventional one. Since the total width W of the semiconductor device is considerably smaller than that of the semiconductor device shown in FIG.
（ｉ ） 回路基板への実装密度を従来の半導体装置
よりも面積比で２０〜５０％大きくすることができ、従
って電子機器の小型化が可能となる。(i) The mounting density on a circuit board can be increased by 20 to 50% in terms of area compared to conventional semiconductor devices, thus making it possible to downsize electronic devices.
（ｉｉ） リードが樹脂モールド部の下面の溝に収
′容されており、該下面から著しく突出してはい
ないので、リード相互の接触又はリードと他の物体との
接触によるリードの変形が生じる恐れが少なく、従って
取扱いが従来品にくらべて容易となる。(ii) The lead fits into the groove on the bottom of the resin mold part.
'Since the leads do not protrude significantly from the lower surface, there is less risk of deformation of the leads due to contact between the leads or contact between the leads and other objects, making handling easier than with conventional products. .
それ故、たとえば振動搬送機による自動搬送を行っても
他の物体との接触による停滞や詰りが起こりにくく、自
動的な搬送及び処理が容易となる。Therefore, even when automatic transport is performed using a vibrating transport machine, for example, stagnation or clogging due to contact with other objects is unlikely to occur, and automatic transport and processing are facilitated.
（ｉｉｉ ） 全体の占有面積が従来品よりも小さい
ので、包装及び梱包を経済的に行うことができ、また、
保管場所が小さくてすむ。 従って、半導体装置の包装
コスト及び保管コストなどが従来品よりも簡易ですむ。(iii) Since the overall area occupied is smaller than conventional products, packaging and packing can be carried out economically, and
Small storage space is required. Therefore, packaging costs and storage costs for the semiconductor device can be reduced compared to conventional products.
第１図（Ａ）は本発明の半導体装置の一実施例を示す上
面図、第１図（８）は第１図（Ａ）の右側面図、第１図
（Ｃ）はＭ１図（Ａ）の下面図、第２図は第１図（Ｃ）
の矢印■で示した部分の拡大図、第３図は第１図に示し
た半導体装置の拡大側面図、第４図（Ａ＞は従来の半導
体装置の上面図、第４図（８）は第４図（Ａ＞の右側面
図である。
１・・・樹脂モールド部、 １ａ・・・下面、 １ｂ・
・・溝、 １Ｃ・・・突部、 ２・・・リード、 ２ａ
・・・先端部。
特許出願人 株式会社 東 芝
代理人 弁理士 諸１）英二篇
；
第１ 図
第２図 第３図
第４図FIG. 1(A) is a top view showing one embodiment of the semiconductor device of the present invention, FIG. 1(8) is a right side view of FIG. 1(A), and FIG. 1(C) is an M1 diagram (A). ) bottom view, Figure 2 is Figure 1 (C)
3 is an enlarged side view of the semiconductor device shown in FIG. 1, FIG. 4 (A> is a top view of the conventional semiconductor device, and FIG. 4 (8) is an enlarged view of the part indicated by the arrow FIG. 4 is a right side view of A>. 1...Resin mold part, 1a...Bottom surface, 1b.
...Groove, 1C...Protrusion, 2...Lead, 2a
...Tip. Patent applicant Toshiba Corporation Agent Patent attorney 1) Eiji edition; Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
るリードが該樹脂モールド部の側面及び下面に沿つてそ
れぞれの角でＬ字形に折り曲げられるとともに、該樹脂
モールド部の下面におけるリード先端部が該下面に該リ
ード先端部の各々と平行にモールド成形された多数の浅
い溝の中に収容されており、該溝の深さが該リード先端
部の肉厚よりも浅いことを特徴とする樹脂封止型半導体
装置。 ２ 該樹脂モールド部の下面に、該溝内に収容された該
リード先端部の肉厚と該溝の深さとの差に相当する高さ
をもつ傾き防止用突部が、モールド成形されている特許
請求の範囲第１項記載の樹脂封止型半導体装置。 ３ 該傾き防止用突部が、樹脂封止用金型のエジエクタ
ピンによるモールド成形跡として形成された突部である
特許請求の範囲第２項記載の樹脂封止型半導体装置。[Scope of Claims] 1. A lead protruding from a side surface of a resin molded portion of a semiconductor device is bent into an L-shape at each corner along the side surface and bottom surface of the resin molded portion, and a lead protruding from the side surface of the resin molded portion The lead tips are housed in a number of shallow grooves molded into the lower surface parallel to each of the lead tips, and the depth of the grooves is shallower than the wall thickness of the lead tips. Characteristics of resin-sealed semiconductor devices. 2. A tilt prevention protrusion having a height corresponding to the difference between the thickness of the lead tip housed in the groove and the depth of the groove is molded on the lower surface of the resin molded part. A resin-sealed semiconductor device according to claim 1. 3. The resin-sealed semiconductor device according to claim 2, wherein the tilt-preventing protrusion is a protrusion formed as a molding trace by an ejector pin of a resin-sealing mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6502685A JPS61225841A (en) | 1985-03-30 | 1985-03-30 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6502685A JPS61225841A (en) | 1985-03-30 | 1985-03-30 | Resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61225841A true JPS61225841A (en) | 1986-10-07 |
Family
ID=13275049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6502685A Pending JPS61225841A (en) | 1985-03-30 | 1985-03-30 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61225841A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722568A (en) * | 1993-07-01 | 1995-01-24 | Nec Corp | Semiconductor device and its manufacture |
| JPH0750379A (en) * | 1993-08-05 | 1995-02-21 | Nec Corp | Semiconductor device |
| US6078102A (en) * | 1998-03-03 | 2000-06-20 | Silicon Bandwidth, Inc. | Semiconductor die package for mounting in horizontal and upright configurations |
| CN113533149A (en) * | 2020-04-15 | 2021-10-22 | 杭州海康消防科技有限公司 | Detection device welding packaging module and labyrinth assembly of photoelectric smoke detector |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169948A (en) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | Resin-sealed type semiconductor device |
-
1985
- 1985-03-30 JP JP6502685A patent/JPS61225841A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169948A (en) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | Resin-sealed type semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722568A (en) * | 1993-07-01 | 1995-01-24 | Nec Corp | Semiconductor device and its manufacture |
| JPH0750379A (en) * | 1993-08-05 | 1995-02-21 | Nec Corp | Semiconductor device |
| US6078102A (en) * | 1998-03-03 | 2000-06-20 | Silicon Bandwidth, Inc. | Semiconductor die package for mounting in horizontal and upright configurations |
| CN113533149A (en) * | 2020-04-15 | 2021-10-22 | 杭州海康消防科技有限公司 | Detection device welding packaging module and labyrinth assembly of photoelectric smoke detector |
| CN113533149B (en) * | 2020-04-15 | 2024-06-07 | 杭州海康消防科技有限公司 | Detection device welding packaging module of photoelectric smoke detector and labyrinth assembly |
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