JPS6119507Y2 - - Google Patents
Info
- Publication number
- JPS6119507Y2 JPS6119507Y2 JP10741282U JP10741282U JPS6119507Y2 JP S6119507 Y2 JPS6119507 Y2 JP S6119507Y2 JP 10741282 U JP10741282 U JP 10741282U JP 10741282 U JP10741282 U JP 10741282U JP S6119507 Y2 JPS6119507 Y2 JP S6119507Y2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- metal fitting
- hole
- integrated circuit
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 18
- 238000005192 partition Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000004907 flux Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、デユアルインラインパツケージ集積
回路（以下、単に集積回路と記す）のソケツトに
関するものである。DETAILED DESCRIPTION OF THE PRESENT APPLICATION Field of the Invention The present invention relates to a socket for a dual in-line package integrated circuit (hereinafter simply referred to as an integrated circuit).
従来技術の代表的な一例を、第３図を参照しな
がら説明する。
A typical example of the prior art will be explained with reference to FIG.
絶縁材製のソケツト本体２に、ソケツト金具３
の金具本体７が挿入組付けされる組付け孔１１を
穿設している。金具本体７下端に接続ピン８が連
設されており、金具本体７直下に伸びている。こ
の接続ピン８は配線基板１２の孔１３に挿入さ
れ、半田付けによつて配線基板１２に固定され
る。この従来技術の特徴は、ソケツト本体２組付
け孔１１の直下に配線基板の孔１３が位置してい
ることである。 A socket metal fitting 3 is attached to a socket body 2 made of insulating material.
An assembly hole 11 is formed into which the metal fitting body 7 is inserted and assembled. A connecting pin 8 is connected to the lower end of the metal fitting body 7 and extends directly below the metal fitting body 7. This connecting pin 8 is inserted into the hole 13 of the wiring board 12 and fixed to the wiring board 12 by soldering. A feature of this prior art is that the hole 13 of the wiring board is located directly below the socket body 2 assembly hole 11.
上記した半田付けは、まず配線基板１２下面に
フラツクスを付着させ、次に半田槽上に搬送して
半田付けを行うものである。 In the above-described soldering, flux is first applied to the lower surface of the wiring board 12, and then the wiring board 12 is transferred onto a solder bath and soldered.
上記半田付け工程において、フラツクス液が配
線基板の孔内のみにとどまるものであれば問題は
ないのであるが、毛細管現象によつてソケツト本
体の組付け孔内にも侵入して、ソケツト金具の金
具本体に付着し、その結果、金具本体とそれに接
触する集積回路の端子ピンとの通電性が不良とな
る欠点があつた。
In the above soldering process, there would be no problem if the flux liquid remained only in the hole of the wiring board, but due to capillary action it may also enter the assembly hole of the socket body and cause damage to the metal fittings of the socket fitting. It adheres to the main body, resulting in poor electrical conductivity between the metal fitting main body and the terminal pins of the integrated circuit that come into contact with it.
この点を解消するため、例えば、ソケツト金具
を組付け孔に組付けした後、組付け孔下部内に接
着剤を充填する手段も考えられたが、同様に接着
剤がソケツト金具に付着してしまうので、根本的
な解決策とはなり得なかつた。 In order to solve this problem, for example, a method of filling the lower part of the assembly hole with adhesive after assembling the socket metal fitting into the assembly hole has been considered, but the adhesive also adheres to the socket metal fitting. Therefore, it could not be a fundamental solution.
本考案は、上記した問題点を解決するために考
案されたもので、以下の構成としている。
The present invention was devised to solve the above-mentioned problems, and has the following configuration.
本考案による集積回路用ソケツト１は、上面に
集積回路の端子ピンに対応した間隔で凹部４を設
けると共に、該凹部４の底面から起立設された隔
壁６をはさんで隣接し、下方にいくほど開口面積
の小さい透孔５を穿設した、絶縁材製のソケツト
本体２と、前記凹部４内に挿入組付けされ、前記
集積回路の端子ピンに接触する金具本体７と、該
金具本体７に上端が連設され、前記透孔５を挿通
する接続ピン８とで構成されたソケツト金具３と
から成つている。 The integrated circuit socket 1 according to the present invention has recesses 4 on the upper surface at intervals corresponding to the terminal pins of the integrated circuit, and adjacent recesses 4 extending downward from the bottom of the recesses 4 with a partition wall 6 standing upright between them. A socket body 2 made of an insulating material and having a through hole 5 with a relatively small opening area, a metal fitting body 7 that is inserted and assembled into the recess 4 and comes into contact with the terminal pin of the integrated circuit, and the metal fitting body 7 The socket fitting 3 has an upper end connected to the connecting pin 8 and a connecting pin 8 which is inserted through the through hole 5.
本考案によるソケツト１を配線基板１２に半付
けする際、フラツクス液が飛散することがあつて
も、隔壁６によつて凹部４内への飛散を阻止する
ことが出来る。
Even if the flux liquid may scatter when the socket 1 according to the present invention is half-attached to the wiring board 12, the partition wall 6 can prevent the flux liquid from scattering into the recess 4.
又、ソケツト本体２の下面にフラツクス液が付
着しても、透孔５が下方にいくほど開口面積のせ
まいものとなつているので、そのフラツクス液が
毛細管現象によつて上昇し、凹部４内に侵入して
金具本体７に付着するということがない。 Furthermore, even if the flux liquid adheres to the lower surface of the socket body 2, since the opening area of the through hole 5 becomes smaller as it goes downward, the flux liquid rises due to capillary action and flows into the recess 4. There is no possibility that the metal particles will enter the metal fitting body 7 and adhere to the metal fitting body 7.
本考案の一実施例を第１図、及び第２図を参照
しながら説明する。
An embodiment of the present invention will be described with reference to FIGS. 1 and 2.
凹部４は、集積回路の端子ピン（図示せず）と
同数で同間隔をもつて設けられている。 The recesses 4 are provided in the same number and at the same intervals as the terminal pins (not shown) of the integrated circuit.
凹部４内に組付けられた金具本体７は弾性変形
し、集積回路の端子ピンを挾持して接触すること
によつて通電を図つている。 The metal fitting main body 7 assembled in the recess 4 is elastically deformed and energizes by pinching and contacting the terminal pins of the integrated circuit.
隔壁６をはさんで、凹部４に隣接された透孔５
は、下方にいくほど開口面積が小さく設定されて
いるが、ここでは透孔５を形成している四つの面
全てをテーパ面とすることで、開口面積を下方に
いくにしたがつて小さくしている。 A through hole 5 adjacent to the recess 4 across the partition wall 6
The opening area is set smaller as it goes downward, but here, by making all four surfaces forming the through hole 5 tapered surfaces, the opening area becomes smaller as it goes downward. ing.
この実施例においては、隔壁６がそれに対向す
る壁より低く設定されているが、この隔壁６の高
さは必要に応じて設定する。 In this embodiment, the partition wall 6 is set lower than the wall facing it, but the height of the partition wall 6 may be set as necessary.
ソケツト本体２の下面で各透孔５間には、平板
状の突部６が設けられている。この突部９によつ
て各突部９間にはガイド溝１０が形成されてい
る。 A flat protrusion 6 is provided between each through hole 5 on the lower surface of the socket body 2. Guide grooves 10 are formed between the protrusions 9 by the protrusions 9.
透孔５から外方へ突出した接続ピンは、ソケツ
ト本体２下面に沿つて直角に屈曲され、金具本体
７直下の位置でさらに下方に直角に屈曲されてい
る。ソケツト本体２下面に沿つて位置している接
続ピン８は前記したガイド溝１０によつて両側端
をガイドされる。 The connecting pin protruding outward from the through hole 5 is bent at a right angle along the lower surface of the socket body 2, and further bent at a right angle downward at a position directly below the fitting body 7. The connecting pin 8 located along the lower surface of the socket body 2 is guided at both ends by the guide groove 10 described above.
このように本考案は、配線基板１２への半田付
けの際、フラツクス液が凹部４内の金具本体７に
付着することがないので、集積回路端子との接触
不良をおこすことがなく、常に良好な通電性を発
揮する優れたソケツト１である。
In this way, the present invention prevents the flux liquid from adhering to the metal fitting body 7 in the recess 4 when soldering to the wiring board 12, so there is no possibility of poor contact with the integrated circuit terminals, and a good connection is always achieved. This is an excellent socket 1 that exhibits excellent current conductivity.
第１図は一実施例を示す部分断面図、第２図は
第１図に示した一実施例の底面図、第３図は従来
例を示した部分断面図である。
符号の説明、１……ソケツト、２……ソケツト
本体、３……ソケツト金具、４……凹部、５……
透孔、６……隔壁、７……金具本体、８……接続
ピン、９……突部、１０……ガイド溝、１１……
組付け孔、１２……配線基板、１３……孔。
FIG. 1 is a partial sectional view showing one embodiment, FIG. 2 is a bottom view of the embodiment shown in FIG. 1, and FIG. 3 is a partial sectional view showing a conventional example. Explanation of symbols, 1...Socket, 2...Socket body, 3...Socket metal fitting, 4...Recess, 5...
Through hole, 6...Partition wall, 7...Metal fitting body, 8...Connecting pin, 9...Protrusion, 10...Guide groove, 11...
Assembly hole, 12... wiring board, 13... hole.
Claims (1)
部を設けると共に、該凹部の底面から起立設され
た隔壁をはさんで隣接し下方にいくほど開口面積
の小さい透孔を穿設した絶縁材製のソケツト本体
と、前記凹部内に挿入組付けされ前記集積回路の
端子ピンに接触する金具本体と、該金具本体に上
端が連設され前記透孔に挿通する接続ピンとで構
成されたソケツト金具とから成る集積回路用ソケ
ツト。 Made of insulating material, the top surface has recesses at intervals corresponding to the terminal pins of the integrated circuit, and adjacent through holes are formed across a partition wall that stands up from the bottom of the recess, and the opening area becomes smaller as you move downward. a socket body, a metal fitting body that is inserted and assembled into the recess and comes into contact with a terminal pin of the integrated circuit, and a connecting pin that has an upper end connected to the metal fitting body and is inserted into the through hole; A socket for integrated circuits consisting of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10741282U JPS5912287U (en) | 1982-07-15 | 1982-07-15 | integrated circuit socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10741282U JPS5912287U (en) | 1982-07-15 | 1982-07-15 | integrated circuit socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5912287U JPS5912287U (en) | 1984-01-25 |
| JPS6119507Y2 true JPS6119507Y2 (en) | 1986-06-12 |
Family
ID=30250981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10741282U Granted JPS5912287U (en) | 1982-07-15 | 1982-07-15 | integrated circuit socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5912287U (en) |
-
1982
- 1982-07-15 JP JP10741282U patent/JPS5912287U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5912287U (en) | 1984-01-25 |
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