JPS5981369A - Adhesive for electric circuit laminate - Google Patents
Adhesive for electric circuit laminateInfo
- Publication number
- JPS5981369A JPS5981369A JP19137082A JP19137082A JPS5981369A JP S5981369 A JPS5981369 A JP S5981369A JP 19137082 A JP19137082 A JP 19137082A JP 19137082 A JP19137082 A JP 19137082A JP S5981369 A JPS5981369 A JP S5981369A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- laminate
- epoxy resin
- silicone
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、電気回路積層＆における金属層で形成した電
気回路と積層板との間の接着に用いる接着剤に胸するも
のでちる。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an adhesive used for adhesion between a laminate and an electrical circuit formed of metal layers in an electrical circuit laminate.
電気回路積層板としては紙基材フェノール樹脂私層板、
紙基相エホ十シ倒脂積層板、乃うス布基材エボ＋シ樹脂
積層板など絶緒基板に銅箔を加圧接着した銅張り積層板
（ＣＣＬ）が一般的であり、銅箔を回路パターンを残し
てエツチング除去することにより電気回路が形成される
。そして従来のＣＣＬＯ銅箔用の接着剤としては一般に
フェノール樹脂々づチシール梅脂とを主成分とする接着
剤が用いられ、従来のかかる接着剤では熱時の銅箔のヒ
ール特性が十分と幻、いえないものであった。寸たＣＣ
Ｌでは不要部分の銅箔を１ツチンタ除去して回路を形成
するだめに省資源上の問題があり、さらに工程の面素化
、回路パターンの高密度化の見地より近時アヂイテイプ
工法が盛んに研究され、実用に至っている。アデイテイ
づ工法は公知のように、桿「、１−板子に刈（亀）φυ
同メツ士のみで電路を形成する（ツルアディティづ法）
か、もしく（は積層板−にに無電力・（銅メツ＋で湖い
導電層を形成し電路以外の部分を覆った状態で導電層に
通電することにより句、気メツ＋で電路を形成し、電路
以外の導電層をソフトエッチシフで除去する（セミアデ
ィティブ法）ものである。しかしながらアデイデイづ工
法で（ｄ積層板にメツ＋で回路を形成するために回路と
積層板との間の密着性に問題があり、そこで従来は接着
剤として工小十シ拘脂にＮＢＲにトリルゴム）を混合し
たものを用い、この接着剤を積層板に塗布してＢステー
ジにまで硬化させ、次でこの接着剤の表面をクロム酸を
含んだ液でエツチング処理することによって接着剤中の
ブタジェン成分を溶出させて接着剤の表面を粗面化し、
粗面に対するメツ＋金属のアンカー効果を利用して回路
と積層板との間のヒー１し特性を向上せしめるようにし
ていた。しかしこの場合はクロム酸を含有するエツチン
グ処理廃液が排田されることになるため作業環境面や公
害前で大きな問題が生じることに々る。ここで接着剤の
表面の粗面化は研磨紙による研磨など物理的研磨で行な
うことも可能ではあるが、エツチングによる粗面化処理
では奥が広い微***による凹凸で粗面を形成して大きな
アシカー効果が得られるのに対して物理的研磨ではこの
ような粗面にはならず大きなアンカー効果は期待できな
いために、もっばらエツチングによる粗面化が多用され
ているものである。そして、このようなアデイテイプエ
法では粗面化処理を施しても回路はメツ士で積層板に形
成しであるため、回路と積層板とのヒール強度はＣＣＬ
Ｋは及ばないものである。１
本発明は上記の点に鑑みてなされたものであって、積層
板と回路金属との接着性に優れ、特にアデイテイプ工法
においては物理的研磨の粗面で積層板と回路金属との接
着性を十分に得ることができる電気回路積層板用接着剤
を提供することを目的とするものである。Electric circuit laminates include paper-based phenolic resin laminates,
Copper-clad laminates (CCL) are common, in which copper foil is bonded under pressure to a solid substrate, such as a paper-based epoxy resin laminate or a cloth-based epoxy resin laminate. An electric circuit is formed by etching and removing the circuit pattern. Conventional adhesives for CCLO copper foil are generally based on phenolic resins such as zuchishiru plum fat, and conventional adhesives do not provide sufficient heel properties for copper foil when hot. , it was impossible. short CC
In L, there is a resource saving problem because the circuit is formed by removing one piece of unnecessary copper foil, and in recent years, the ad-itaping method has become popular from the viewpoint of making the process more planar and increasing the density of the circuit pattern. It has been researched and put into practical use. As is well-known, the aditeizu construction method is based on the following methods:
Form an electric path with only the same members (Tsuraditi method)
Or, (is a laminated board) - (by forming a thin conductive layer with copper metal + and applying electricity to the conductive layer with the area other than the electric path covered, the electric circuit can be formed with copper metal +). This is a semi-additive method in which the conductive layers other than the electrical circuits are removed by soft etch shift. There was a problem with the adhesion of the laminate, so conventionally a mixture of NBR and Trill rubber was used as an adhesive, and this adhesive was applied to the laminate and cured to the B stage, and then By etching the surface of this adhesive with a liquid containing chromic acid, the butadiene component in the adhesive is eluted and the surface of the adhesive is roughened.
The anchoring effect of the metal and the metal on the rough surface was used to improve the heat resistance between the circuit and the laminate. However, in this case, the etching treatment waste liquid containing chromic acid is discharged, which often causes major problems in terms of working environment and pollution. Here, it is possible to roughen the surface of the adhesive by physical polishing such as polishing with abrasive paper, but in surface roughening treatment by etching, a rough surface is formed with unevenness caused by wide micro holes, and it is difficult to make a large surface. Whereas physical polishing does not produce such a rough surface, a large anchoring effect cannot be expected, so surface roughening by etching is often used. In addition, in this type of adhesion process, even if the surface is roughened, the circuit is formed on the laminate using a metallizer, so the heel strength between the circuit and the laminate is CCL.
K is out of reach. 1 The present invention has been made in view of the above points, and has excellent adhesion between the laminate and the circuit metal. In particular, in the addi-tape construction method, the adhesion between the laminate and the circuit metal is improved on the rough surface of physical polishing. The object of the present invention is to provide an adhesive for electrical circuit laminates that can sufficiently obtain the following properties.
しかして本発明け、シリコン変性エポ＋シ樹脂とＮ Ｔ
３ Ｒとを主剤とし硬化剤が配合されて成ることケ％徴
とする′電気回路積層板用接着剤及び、シリコン変性エ
ボ＋シ樹脂とＮ Ｂ Ｒとを主剤とし硬化剤及び充てん
剤が配合されて１戊ることを特徴とする電気回路積層板
用接着剤により上記目的を達成したものであって、以下
本発明を詳７．４１１ Ｋ説明する。However, according to the present invention, silicon modified epoxy resin and N T
An adhesive for electrical circuit laminates, which is composed of 3 R as the main ingredient and a curing agent, and a curing agent and filler that is made of silicone-modified epoxy resin and NBR as the main ingredients. The above object has been achieved by an adhesive for electrical circuit laminates, which is characterized in that the adhesive is used for electrical circuit laminates, and the present invention will be explained in detail below.
本発明においては先ず、シリコン忽１生エボ士シ樹脂を
接着成分として用いることに％徴を有する。シリコン変
性エボ＋シ樹脂は次の構造式で示すようにヒスフェノー
ルＡ型のエポ士シ材脂の主鎖に小すシＤ＋サンを側鎖と
して付加せしめたものであり、エボ＋シ当量が５００〜
２５００ 、シリコン成分を５〜２０チ含有せしめたも
のが好ましい０−１・
ここで上記構造式中ｎ ＝ １〜４、ｍ−３／−８（好
ましくは４−〇）のものが好１しく、Ｒは芳香族又は脂
肪族の炭化水素で、Ｒとしては脂肪族のものが好ましく
、特にエチル基であることが好ましい。The present invention is first characterized by the use of silicone resin as an adhesive component. As shown in the following structural formula, silicone-modified Evo+Si resin is made by adding a small SiD+San as a side chain to the main chain of Hisphenol A type epoxy resin, and the Evo+Si equivalent is: 500～
2500, preferably 0-1 containing 5 to 20 silicone components, where n = 1 to 4, m-3/-8 (preferably 4-0) in the above structural formula is preferred. , R is an aromatic or aliphatic hydrocarbon, preferably an aliphatic hydrocarbon, and particularly preferably an ethyl group.
上記シリコニア変性エボ士シ樹脂にＮＢＲを配合して両
者を接着剤の主剤とするものであるが、これにさらに硬
化剤、必要に応じて無機充てん剤、溶剤を配合して接着
剤を調製するものである。硬化剤としてはエポ士シ樹脂
に汎用されているものを用いることができ、例えはフェ
ノールノボラック樹脂、フェノールレーノール捌脂、メ
ラ三ン構脂など横脂初期縮合物、無水フタル酸、無水マ
レイン酸１無水ヒＤメリツト酸、無水メチルテトラしド
ロフタル酸など酸無水物、脂肪族小すアミン、芳香族ボ
リア三ン、第ニア三ン、第三アミンなどア三シ類、三フ
ッ化ホウ素アミンコンプレックスなどを用いることがで
きる。もちろんこの中の一種のみを用いても又は二種以
上を併用してもよい。無機充てん剤としてはＣａＣＯ３
，Ａｌ２Ｏ，、Ｚｒ（５ｉＯ３）４、ｓｉｏ、、カオリ
ン等、酸化物、ケイ酸塩、炭酸塩、窒化物、炭化物など
種々のものを用いることができ、その粒径は０．１−１
０μのものが好ましい。溶剤としてはトルエン、イソプ
ロピルアルコール、アセトン、ＭＥＫ、シクロへ＋ザノ
ンなどを一種もしくは二種以上混合して用いることがで
きる。NBR is blended with the above-mentioned siliconia-modified EBO resin and both are used as the main ingredients of the adhesive, but the adhesive is further blended with a curing agent, an inorganic filler, and a solvent if necessary. It is something. As the curing agent, those commonly used for epoxy resins can be used, such as phenol novolak resin, phenol rayol resin, melatriamine resin, etc. Acids 1 Acid anhydrides such as arsenic anhydride, methyltetra-dolphthalic anhydride, aliphatic small amines, aromatic boriatrines, tertiary amines, tertiary amines, boron trifluoride amines Complex etc. can be used. Of course, only one type of these may be used or two or more types may be used in combination. CaCO3 as an inorganic filler
, Al2O, , Zr(5iO3)4, sio, , kaolin, etc., various oxides, silicates, carbonates, nitrides, carbides, etc. can be used, and the particle size is 0.1-1
Preferably, it has a diameter of 0μ. As the solvent, one or a mixture of two or more of toluene, isopropyl alcohol, acetone, MEK, cyclohe+zanone, etc. can be used.
配合割合は、シリコン変性エボ士シ樹脂１００重量部に
対してＮＢＲを８０〜２００重量部、無機光てん剤を０
〜５００重量部、溶剤を４００〜７００重量部が奸才し
く、硬化剤は接勉剤の使用条件に応じて適量を配合すれ
ばよい。The blending ratio is 80 to 200 parts by weight of NBR and 0 parts by weight of inorganic photonic agent to 100 parts by weight of silicone-modified resin.
~500 parts by weight and 400 to 700 parts by weight of the solvent are advisable, and the curing agent may be added in an appropriate amount depending on the usage conditions of the cement.
」二記のようにして得た本発明に係る接着剤は、ＣＣＬ
やアディティブ工法における積層板と金属回路さの間の
接着に用いられるが、その用法の概略を説明する。先ず
ＣＣＬの場合、銅箔に接着剤全２０〜３０μ厚程度で塗
布し、これを１５０ ’０．２分間位でＢステージ状態
に予備乾燥させる。The adhesive according to the present invention obtained as described in Section 2 is CCL
It is used for adhesion between laminates and metal circuits in additive construction methods, and an outline of its usage will be explained below. First, in the case of CCL, an adhesive is applied to a copper foil to a total thickness of about 20 to 30 microns, and this is pre-dried to a B-stage state for about 150'0.2 minutes.
そして紙基材や月ラス布基材にフェノール樹脂やエボ士
シ樹脂等のワニスを含浸して乾燥することにより得たづ
リプレタにこの銅箔を重ね、１６０’０．６０〜９０分
、 １２０１ｃｇ／ｄ程度の条イ１１で熱圧成形を行な
うことにより、プリプレグの積層硬化体である積層板に
接着剤を介して銅箔が張られたＣＣＬを得るものである
。まだアディティブ工法の場合は、積層板の表面に８０
μ厚程度以上の厚みで接着剤を塗布して先ずＢステージ
状態にまで予備加熱し、次で接着剤の表面を物理的に研
磨する。物理的研磨は、研磨紙を手操作したり、研磨ベ
ルト槻を用いたり、まだはサンドブラスト法を用いたり
、さらに籾面シートより粗面を転写する方法を用いたり
などして行なうことができる。このように物理的研磨で
接着剤の表面を面粗さ０．２〜１．０μ（好捷しくに０
．５−０．７５μ）程度に粗面化する。次で接着剤の粗
面に常法に従って化学メツ十、電、気メツ＋の手法を用
い、回路をメツ＋で形成し、このように回路形成を行ガ
つだのちに接着剤を完全硬化させるのである。内、本発
明の接着ム板に回路を形成する場合にも応用することが
可能である。Then, this copper foil was layered on a replete obtained by impregnating a paper base material or a moon lath cloth base material with varnish such as phenol resin or Eboshi resin and drying it, and then it was heated at 160' for 0.60 to 90 minutes, at 1201 cg/ By carrying out hot pressure forming using strips 11 of about d, a CCL is obtained in which a laminate, which is a cured prepreg laminate, is covered with copper foil via an adhesive. If you are still using the additive method, apply 80% to the surface of the laminate.
An adhesive is applied to a thickness of about μ or more, first preheated to a B-stage state, and then the surface of the adhesive is physically polished. Physical polishing can be carried out by manually handling abrasive paper, using an abrasive belt, currently using a sandblasting method, or by using a method of transferring a rough surface from a rice grain sheet. In this way, the surface of the adhesive is physically polished to a surface roughness of 0.2 to 1.0μ (preferably 0.0μ).
．． The surface is roughened to about 5-0.75μ). Next, a circuit is formed on the rough surface of the adhesive using chemical methods such as chemical metsu, electric, and kimetsu+ according to conventional methods, and after the circuit is formed in this way, the adhesive is completely cured. Let it happen. Among these, it is also possible to apply the present invention to the case where a circuit is formed on the adhesive board of the present invention.
上述のように本発明に係る接着剤にあっては、シリコン
変性エポ士シＰｊｌ脂とＮＢＲとを主剤とするものであ
り、シリコン変性エボ＋シ樹脂の接着作用によって積層
板と金属回路との接着性を向上させることができ、ＣＣ
ＬＫあっては金属回路のヒール特性、特に熱時のヒール
特性を向」ニさせることができるものであって半田時に
金属回路が積層板から剥れることを防止でき、半田耐熱
性を向」させることができるものであり、またアデイテ
イプエ法にあって値：シリコン変性エボ士シ樹脂の優れ
た接着作用によって、物理的研磨による接着剤表面の粗
面化でも金属回路をメツ士で接着性よく積層板に施すこ
とができて高いヒール特性を得ることができ、クロム酸
液によるエツチングで粗面化処理を行なうような必要が
ないものである。As mentioned above, the adhesive according to the present invention has silicone-modified epoxy resin and NBR as main ingredients, and the adhesive action of the silicone-modified epoxy resin can bond the laminate to the metal circuit. Can improve adhesion, CC
LK can improve the heel characteristics of metal circuits, especially the heel characteristics at high temperatures, and can prevent the metal circuits from peeling off from the laminate during soldering, improving soldering heat resistance. It is also possible to laminate metal circuits with good adhesion using a metal polisher, even if the adhesive surface is roughened by physical polishing, due to the excellent adhesive action of the silicone-modified epoxy resin. It can be applied to a board to obtain high heel properties, and there is no need to roughen the surface by etching with a chromic acid solution.
尚、電気特性については、本発明に係る接着剤に従来の
接着剤と同等のものを有するものである。Note that the adhesive according to the present invention has electrical properties equivalent to those of conventional adhesives.
次に本発明を実施例によって説明する。Next, the present invention will be explained by examples.
〈実施例１〜４〉
エポ士シ当搦、が１１００〜１８００てシリコン含悌：
が１５係、前記構造式においてＲがエチル基のシリコン
変性エボ士シ樹脂及び第１表のＮ Ｂ Ｒ（Ｎ−ｉｐｏ
ｌ １０７２ ：日本ゼオン製）、硬化剤、硬化促進剤
、充てん剤、安定剤、溶剤を第１表による配合で混合す
ることにより接着剤を調製した。<Examples 1 to 4> Epoxy resin content: 1100 to 1800:
15, silicon-modified EBO resin in which R is an ethyl group in the above structural formula, and NBR (N-ipo resin) in Table 1.
An adhesive was prepared by mixing a curing agent, a curing accelerator, a filler, a stabilizer, and a solvent according to the formulation shown in Table 1.
この接着剤を紙工）１′＜士シアンクラッド積層板に５
０μ厚の塗布厚で塗布したのち、１８０°０．６０分の
条件で加熱して接着剤をＢステージ状態にまで一次硬化
処理した。次でこの接着剤の表面に一６００’の研磨紙
でたてよと３０回づつ研磨し１、さらに住友スリーエム
製のスコッチづライトＵＦでたてよこ５０回づつ研磨す
ることにより、面粗さ０．５μに粗面処理した。Apply this adhesive to the paper coating) 1'< 5
After coating with a coating thickness of 0 μm, the adhesive was primarily cured to a B-stage state by heating at 180° and 0.60 minutes. Next, the surface of this adhesive was polished 30 times in the vertical direction with 1600' abrasive paper 1, and further 50 times in the vertical direction and horizontally with Scotch Light UF manufactured by Sumitomo 3M to achieve a surface roughness of 0. The surface was roughened to 5μ.
」ユ記のようにして得たアディティブ用粗面化処理積層
板にアディティブ法で回路全形成した。すなわち、先ず
シラづレイ社製士１フタプリップ４０４の２７ＣＪｇ／
ｌ水溶液（３０±１０°Ｃ）を接着剤粗面に塗布して５
〜６分１１４処理することにより酸処理を行ない、次で
シップレイ社製十Ｐタブリップ４０４の２７０１／／１
７１（溶液とシップしイ社製士セタボジット４４のａｏ
ｃｃ／Ａ水溶液との混合液を８０」−１Ｏ°ＯＫ調製し
てこれを接着剤粗面に塗布し、５〜６分間処理すること
により馳媒処理を行なった。次に水洗を行なったのちに
シップレイ社製アクセレータ１９の６倍希釈水溶液（３
０±１０°Ｃ）を接着剤粗面に塗布して５〜６分間処〕
」することによりアクセレータ処理を行なった。このよ
うに前処理を行なったのち、硫酸銅２〜：３ｇ／ｌ（銅
分として）、ホル？すｙ５”９ｇ／ｌ、ＥＤＴＡ ２Ｎ
ａ２（Ｊｇ／ｌ、安定剤少址の組成の水溶液で々る無電
解銅メツ士浴を３０±１ ’０に調製してこの無電解銅
メツ＋浴に積層板を５〜ＩＯ分間浸漬処理することによ
り、無電解銅メツ＋で接着剤粗面に薄い銅メツ士層を形
成した。次に水洗したのち薄銅メツ＋層の表面に回路と
なる部分を残して田村化仙製のエツチンジレジス１−Ｕ
Ｒ−４５０Ｂを塗布硬化せしめることによりマスクし、
硫酸銅７０ｇ／１３、イ流酸１６０ｇ／ｌ、光υ（剤少
量の組成の水溶液で調製した電気銅メツ士浴に積層板を
浸漬して８Ａ／ｄイ、６０分、室温の条件で電気メツ＋
を行なうことにより薄い銅メツ＋層上に回路パターンを
メツ士しだ。こののち上記エツチングしシストを５％Ｎ
ａ（）］水溶液で除去し、さらに塩化第２鉄溶液による
ライトエッチ、、Ｉりで回路以外の薄い銅メツ士層を除
去した。さらにこの積層板を１００°Ｃ×６０分、１６
０°Ｃ×６刺０分の条件で加熱して接着剤を２次硬化さ
せることにより、電気回路積層板を得た。A complete circuit was formed using the additive method on the additively roughened laminate obtained as described in ``U.''. That is, first of all, 27CJg /
5. Apply aqueous solution (30±10°C) to the rough surface of the adhesive.
Acid treatment was carried out by treating 114 for ~6 minutes, and then 2701//1 of Shipley's 10P tab lip 404
71 (ao of solution and ship, manufacturer Setabojit 44)
A mixed solution with a cc/A aqueous solution was prepared at 80''-10° OK, and this was applied to the rough surface of the adhesive and treated for 5 to 6 minutes to carry out the solvent treatment. Next, after washing with water, a 6-fold diluted aqueous solution of Accelerator 19 manufactured by Shipley (3
0±10°C) on the rough surface of the adhesive and treat for 5 to 6 minutes]
” to perform accelerator processing. After performing the pretreatment in this way, copper sulfate 2 to 3 g/l (as copper content), hol? Sy5”9g/l, EDTA 2N
A2 (Jg/l, an aqueous solution containing a small amount of stabilizer) was prepared to prepare an electroless copper metal bath of 30±1'0, and the laminate was immersed in this electroless copper metal bath for 5 to 10 minutes. By doing so, a thin copper metal layer was formed on the rough surface of the adhesive using electroless copper metal +.Next, after washing with water, a portion that would become a circuit was left on the surface of the thin copper metal + layer, and a resist layer made by Tamura Kasen was applied. 1-U
Masked by coating and curing R-450B,
The laminate was immersed in an electrolytic copper methane bath prepared with an aqueous solution containing a small amount of copper sulfate, 160 g/l of sulfuric acid, and a small amount of light. Metsu+
By doing this, a circuit pattern was printed on the thin copper layer. After this, the cyst was etched by 5%N.
a()] was removed with an aqueous solution, and the thin copper metal layer other than the circuit was removed by light etching with a ferric chloride solution. Furthermore, this laminate was heated at 100°C for 60 minutes for 16 minutes.
An electric circuit laminate was obtained by secondarily curing the adhesive by heating under the conditions of 0°C x 6 pricks for 0 minutes.
上記のようにして得た電気回路積層板について金属回路
と積層板との間のヒール強度及びはんだｉＪ熱件（測定
は２６０’Ｃのはんだ浴に電気回路積層板を浮かべて金
属回路が積層板から剥れるまでの時間を開側することに
Ｊ：し行なった）について測定した。その結果を第２表
に示す。Regarding the electrical circuit laminate obtained as described above, the heel strength between the metal circuit and the laminate and the solder iJ heat condition (measurements were made by floating the electrical circuit laminate in a 260'C solder bath, The time taken for the film to peel off was measured with respect to the open side. The results are shown in Table 2.
（以下屋白）ｊ
ｉｌｌ、、＋
□１ ・、′１
第 １ 表（重量部）
第２表
そして、実施例のもののビール強度と温度との関係をグ
ラフで定、性的に示すと添イづ図のようになる。ここで
添伺図のグラフにおいて比較例１のもディティづ電気回
路積層板、比較例２は接着剤としてフェノール樹脂とブ
チラール州側との混合接着剤を用いた従来の紙エボ士ジ
アジクラッド積層板によるＣＣＬについてのビール強度
と温度との関係を示すものである。このグラフより、夾
施し）］のもののヒール強度は比較例１のアゾ１テイプ
エ法のものよりも、そして比較例２のＣＣＬＯものより
も優れていることが確認される。(Hereinafter referred to as Yaro) jill,, + □1 ・,'1 Table 1 (Parts by weight) Table 2 The relationship between the beer strength and temperature of the examples is shown graphically and sexually. It will look like the diagram below. Here, in the accompanying graph, Comparative Example 1 is made of a modular electric circuit laminate, and Comparative Example 2 is a conventional paper-eboji clad laminate using a mixed adhesive of phenolic resin and butyral resin as an adhesive. It shows the relationship between beer strength and temperature for CCL. From this graph, it is confirmed that the heel strength of the material obtained by the Azo 1-tape method of Comparative Example 1 is superior to that of Comparative Example 1, and that of the CCLO material of Comparative Example 2.
添伺図はヒール強度と温度との閃係を示すグラフである
。
代理人 弁理士 石 １）長 七
手 続 補 正 書（自発）
１．事件の表示
ｑ（和５７年特許願第１９１ｉ３７０号２、発 明 の
名称
電気回路ｆｖ層板用接着剤
３ 補正をする者
事件との関係 特 許出願人住 所 大
阪府門真市大字門真１０４８番地名 称 （５８３）松
下電二Ｔニ株式会社代表者小 林 郁
４、代理人
郵便番号 ５３０
５、補正命令の日付
自 発
別紙の通り
訂 正 書
顯証番号 特願昭５７−１９１３７０ぢ・１、 明
＃ｌ掛第５頁下から第６行乃至下から第５行の「ｎ−１
〜４、ｍ＝３〜８（好壕しくは４−６）Ｊを削除し、「
ｎ−２〜２０（より好ましく ＆ｄ ４〜７）、ｍ＝１
〜８（より好筐しくに２〜４）」を挿入します。
２、同上第７貞第１１行目の「２０〜３０μ厚程度」を
削除し、「２０μ厚程度以上」を挿入し捷す。
３、同上第１０頁第１３行乃至第１５行の１−を接着剤
粗面・を行ないＪを削除し、「に５〜６分間浸漬処理し
−：を挿入します。
４、 同上同頁第１８行乃至第１９行の「これを・６分
間処理（」を削１余し、１−１５〜６分間浸漬」をづ申
入します。
５、同上第１１頁第１行乃至第２行の「を接着剤・分間
処理」を削除し、「に５〜６分間浸漬」を挿入します。
６、同Ｊ：第１４頁ｒから第８行目の「紙エボ＋シマシ
クラット」を「星、エボ＋ジアジクラッド」に訂正し゛
ます。
代理人 弁理士 石 １）長 七The accompanying diagram is a graph showing the relationship between heel strength and temperature. Agent Patent Attorney Ishi 1) Chief Seven Procedures Amendment (Voluntary) 1. Indication of the case q (Japanese Patent Application No. 191i370 2, Title of the invention: Adhesive for electric circuit fv laminates 3 Person making the amendment Relationship to the case Patent applicant address: 1048 Kadoma, Kadoma City, Osaka Prefecture Name (583) Matsushita Denji Tni Co., Ltd. Representative Iku Kobayashi 4, Agent postal code 530 5, Date of amendment order Self-corrected as shown in the attached document Certification number Patent application 1970-191370ぢ・1 , ``n-1'' on page 5, line #1, line 6 from the bottom or line 5 from the bottom
~4, m=3~8 (preferably 4-6) Delete J and
n-2 to 20 (more preferably &d 4 to 7), m=1
Insert "~8 (2~4 for better results)". 2. Delete "about 20 to 30 microns thick" in the 11th line of No. 7, same as above, and insert "about 20 microns thick or more". 3. Apply adhesive roughening to 1- in lines 13 to 15 on page 10 of the above, delete J, and insert ``Immerse in for 5 to 6 minutes and insert -:.'' 4. Same page as above. In lines 18 to 19, I would like to delete the words ``process this for 6 minutes, and soak it for 1-15 to 6 minutes.'' 5. Same as above, page 11, lines 1 and 2. Delete "Adhesive/minute treatment" and insert "Soak for 5 to 6 minutes". 6. Same J: From page 14 r to line 8, "Paper Evo+Shimasikrat" is added to "Star". , I am correcting it to ``Evo+Jiajiclad''.Representative Patent Attorney Ishi 1) Choshichi
Claims (2)
硬化剤が配合されて成ることを特徴とする電気回路積層
板用接着剤。(1) An adhesive for electrical circuit laminates, characterized in that it is comprised of silicone-modified Evo+Si resin and NBR as main ingredients, and a curing agent is added thereto.
％πＩ・請求の範囲第１項記載の゛亀気回路演層板用接
着剤。(2) %πI adhesive for a circuit board according to claim 1, characterized in that the filler 751 is incorporated therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19137082A JPS5981369A (en) | 1982-10-30 | 1982-10-30 | Adhesive for electric circuit laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19137082A JPS5981369A (en) | 1982-10-30 | 1982-10-30 | Adhesive for electric circuit laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5981369A true JPS5981369A (en) | 1984-05-11 |
Family
ID=16273455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19137082A Pending JPS5981369A (en) | 1982-10-30 | 1982-10-30 | Adhesive for electric circuit laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5981369A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141774A (en) * | 1984-12-13 | 1986-06-28 | Sumitomo Bakelite Co Ltd | Adhesive for additive plating |
| JPS62192422A (en) * | 1986-02-19 | 1987-08-24 | Matsushita Electric Works Ltd | Epoxy resin composition and its production |
| JP2004323810A (en) * | 2003-04-23 | 2004-11-18 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for flexible printed wiring board, and adhesive film |
| JP2004323811A (en) * | 2003-04-23 | 2004-11-18 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for laminating flexible printed circuit board and adhesive film |
| JP2004323807A (en) * | 2003-04-23 | 2004-11-18 | Hitachi Kasei Polymer Co Ltd | Flame retardant adhesive composition and cover lay |
| KR100613754B1 (en) * | 2000-01-18 | 2006-08-22 | 주식회사 코오롱 | Adhesive tape |
| KR100625054B1 (en) * | 2000-05-04 | 2006-09-18 | 주식회사 코오롱 | Thermally stable adhesive tape |
| EP3239205A1 (en) | 2016-04-27 | 2017-11-01 | Evonik Degussa GmbH | Radiation curable silicone epoxy resins |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014736A (en) * | 1973-06-11 | 1975-02-17 | ||
| JPS5230837A (en) * | 1975-09-03 | 1977-03-08 | Toshiba Chem Corp | Thermostable compositions for use in adhesives and thermostable lamina ted boards |
-
1982
- 1982-10-30 JP JP19137082A patent/JPS5981369A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014736A (en) * | 1973-06-11 | 1975-02-17 | ||
| JPS5230837A (en) * | 1975-09-03 | 1977-03-08 | Toshiba Chem Corp | Thermostable compositions for use in adhesives and thermostable lamina ted boards |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141774A (en) * | 1984-12-13 | 1986-06-28 | Sumitomo Bakelite Co Ltd | Adhesive for additive plating |
| JPH0475947B2 (en) * | 1984-12-13 | 1992-12-02 | Sumitomo Bakelite Co | |
| JPS62192422A (en) * | 1986-02-19 | 1987-08-24 | Matsushita Electric Works Ltd | Epoxy resin composition and its production |
| JPH0310664B2 (en) * | 1986-02-19 | 1991-02-14 | Matsushita Electric Works Ltd | |
| KR100613754B1 (en) * | 2000-01-18 | 2006-08-22 | 주식회사 코오롱 | Adhesive tape |
| KR100625054B1 (en) * | 2000-05-04 | 2006-09-18 | 주식회사 코오롱 | Thermally stable adhesive tape |
| JP2004323810A (en) * | 2003-04-23 | 2004-11-18 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for flexible printed wiring board, and adhesive film |
| JP2004323811A (en) * | 2003-04-23 | 2004-11-18 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for laminating flexible printed circuit board and adhesive film |
| JP2004323807A (en) * | 2003-04-23 | 2004-11-18 | Hitachi Kasei Polymer Co Ltd | Flame retardant adhesive composition and cover lay |
| EP3239205A1 (en) | 2016-04-27 | 2017-11-01 | Evonik Degussa GmbH | Radiation curable silicone epoxy resins |
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