JPS59209500A - Copper-solder clad material - Google Patents
Copper-solder clad materialInfo
- Publication number
- JPS59209500A JPS59209500A JP8315783A JP8315783A JPS59209500A JP S59209500 A JPS59209500 A JP S59209500A JP 8315783 A JP8315783 A JP 8315783A JP 8315783 A JP8315783 A JP 8315783A JP S59209500 A JPS59209500 A JP S59209500A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- copper
- tin
- tin layer
- clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は例えば半導体用リードフレームあるいは電気的
接点材料−とじて使用される銅−半田クラツド材に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper-solder clad material used, for example, in semiconductor lead frames or electrical contact materials.
従来、半導体用り−Ｐフレームあるいは電気的接点材料
の分野では、鋼材（銅合金材を含む。以下同じ。）およ
び半田材を冷間もしくは熱間圧延圧接してなる銅−半田
クラッド材が半田の接着性を利用した機能材料として使
用される。Conventionally, in the field of P frames or electrical contact materials for semiconductors, copper-solder cladding materials made by cold or hot rolling welding of steel materials (including copper alloy materials; the same shall apply hereinafter) and solder materials have been used as solder materials. It is used as a functional material that takes advantage of its adhesive properties.
ところで半田の接着性はそれ自身酸化しやすいだめに酸
化の程度によって左右される面があり、特にｐｂ含有量
の多い耐熱半田の場合には鋼材との接着において接合界
面が完全な接着状態になりにくく、部分的に非接着部分
が存在することがある。By the way, the adhesion of solder itself is easily oxidized, but it also depends on the degree of oxidation.In particular, in the case of heat-resistant solder with a high PB content, the bonding interface becomes completely adhesive when bonding to steel materials. There may be some non-adhesive parts.
このことは銅−半田クラッド材の半田材と他の金属材と
の接着においても同様のことがいえる。The same can be said for adhesion between the solder material of the copper-solder clad material and other metal materials.
なお、半田の接着性の悪い状態を一般にぬれ性が悪いと
呼んでいるが、これは特にｐｂ含有量の多い半田の場合
その表面に酸化鉛を主体とする酸化膜を形成するだめで
ある。Note that the state of poor adhesion of solder is generally referred to as poor wettability, and this is because an oxide film mainly composed of lead oxide is formed on the surface of the solder, especially when the solder has a high Pb content.
このことから、従来の銅−半田クラツド材については、
クラツド材を製造する過程では半田材が酸化するだめに
圧延の際に接着性を考慮して十分酸化膜を除去する必要
があり、クラツド材製造後においては半田材の表面が酸
化により黒味を帯び、傷付きやすいなど外観上商品価値
を低下させる恐れがあり厳重に保管する必要がある。From this, regarding conventional copper-solder clad materials,
In the process of manufacturing cladding materials, it is necessary to sufficiently remove the oxide film during rolling to avoid oxidation of the solder material, taking into account adhesive properties. It is necessary to store it under strict conditions as it may deteriorate the product value due to its appearance, such as being easily scratched or scratched.
本発明の目的は、前記した従来技術の欠点を解消し、鋼
材および半田材の接合界面にきわめて健全な接着状態を
みることができ、また半田材の表。It is an object of the present invention to eliminate the drawbacks of the prior art described above, to provide an extremely sound adhesion state at the bonding interface between the steel material and the solder material, and to provide an extremely healthy adhesive state on the surface of the solder material.
面酸化を抑えることができる銅−半田クラッド利を提供
することにある。The object of the present invention is to provide a copper-solder cladding technique that can suppress surface oxidation.
すなわち、本発・明の要旨は、鋼材および半田材゛の接
合界面に錫層を形成してなることにある。That is, the gist of the present invention is to form a tin layer at the bonding interface between the steel material and the solder material.
錫層ば、Ｐｂあるいはｐｂ富相Ｓｎ合金と比較して自然
酸化しにりく、安定な金属表面を長期にわたり維持する
ことができる。The tin layer is less prone to natural oxidation than Pb or pb-rich phase Sn alloys, and can maintain a stable metal surface for a long period of time.
また、半田が他の金属材との接着に寄与するのはその中
のＳｎ原子であり、しだがってかかる錫層の形成は鋼材
および半田材の接着に際してＳｎ原子の拡散を活発化せ
しめることによってきわめて健全な接着状態を得ること
ができる。Furthermore, it is the Sn atoms in solder that contribute to its adhesion with other metal materials, and therefore the formation of such a tin layer activates the diffusion of Sn atoms when bonding steel materials and solder materials. This makes it possible to obtain extremely sound adhesion.
次に誰何図面によシ本発明銅−半田クラッド材の実施例
を説明する。Next, embodiments of the copper-solder cladding material of the present invention will be described with reference to the drawings.
第１図は従来例を示し、（ａ）はオー・ζ−レイと呼ば
れるクラツド材で、銅材１を母材とし、その上に全面半
田材２を圧延圧接してなる。（ｂ）はインレイと呼ばれ
るクラツド材で、銅材１を母材とし、その表面の一部に
溝を設けて半田材２を埋設してなる。FIG. 1 shows a conventional example, in which (a) is a clad material called O. (b) is a clad material called an inlay, which is made of a copper material 1 as a base material, with a groove formed in a part of its surface and a solder material 2 buried therein.
第２図は本発明の一実雄例を示し、（ａ）に示されるク
ラッド材は銅材１を母材とし、これに鋼材３を間に挾ん
で半田材２を圧延圧接してな不。（ｂ）に示されるクラ
ツド材は銅材１を母材とし、その表面の一部に溝を設は
鋼材３を間に挾んで半田材２を埋設してなる。FIG. 2 shows an example of the present invention, and the cladding material shown in FIG. 2(a) is made by using a copper material 1 as a base material, and a solder material 2 with a steel material 3 sandwiched therebetween by rolling pressure. The cladding material shown in (b) has a copper material 1 as a base material, a groove is formed in a part of the surface of the material, a steel material 3 is sandwiched therebetween, and a solder material 2 is buried therein.
鋼材３は別部材によって形成してもよく、銅材１または
半田材３に錫めっきすることによって形成してもよい。The steel material 3 may be formed as a separate member, or may be formed by tin-plating the copper material 1 or the solder material 3.
第３図は本発明の他の実施例を示し、（ａ）に示される
クラツド材は銅材１と、予めその両面に鋼材３を圧延圧
接してなる半田材２を圧延圧接してなる。（ｂ）に示さ
れるクラツド材は銅材１を母材とし、その表面の一部に
溝を設け、この溝内に予め表面に錫めっき３′を施した
半田材２を埋設一体化してなる。FIG. 3 shows another embodiment of the present invention, in which the cladding material shown in (a) is made by rolling and welding a copper material 1 and a solder material 2 which is formed by rolling and welding a steel material 3 to both surfaces of the copper material 1 in advance. The cladding material shown in (b) has a copper material 1 as a base material, a groove is provided on a part of its surface, and a solder material 2 whose surface has been previously tin-plated 3' is buried and integrated into this groove. .
圧延圧接は冷間で行うことができ、接着の信頼性を増す
ためには圧メ後さらに拡散焼鈍を行うとよい。Rolling and pressure welding can be performed cold, and in order to increase the reliability of bonding, diffusion annealing may be performed after the pressure and pressure welding.
以上のように、本発明銅−半田りラツｒ材によれば、鋼
材および半田材の接合界面に錫層を形成してなるから、
かかる錫層の存在により両者の接合界面にきわめて健全
な接着状態をみることができる。との結果品質並びに信
頼性に優れた銅−半田クラツド材を得ることができる。As described above, according to the copper-solder latz material of the present invention, since a tin layer is formed at the bonding interface between the steel material and the solder material,
Due to the presence of such a tin layer, an extremely sound adhesion state can be observed at the bonding interface between the two. As a result, a copper-solder clad material with excellent quality and reliability can be obtained.
さらに、半田材の表面に錫層を形成した場合半田材の酸
化を防止し、接着性の確保向上および製品価値の向上を
図ることができる。Furthermore, when a tin layer is formed on the surface of the solder material, oxidation of the solder material can be prevented, ensuring improved adhesion and improving product value.
第１図（ａ）、 （ｂ）は夫り従来例に係るクラツド材
の断面図、第２図（ａ） 、 （ｂ）は夫々本発明の一
実楢例に係るクラツド材の断面図、第３図（ａ） 、
（ｂ）は夫々本発明の他の実施例に係るクラツド材の断
面図である。
■・・・鋼材、２ ・半田材、３・・・鋼材、３′・錫
めっき。
算 １ 口
（α） （ｂ）算２図
（α） （ｂ）軍３
畝
（α）（ｂ）1(a) and (b) are cross-sectional views of a cladding material according to a conventional example, and FIGS. 2(a) and (b) are sectional views of a cladding material according to a practical example of the present invention, respectively. Figure 3(a),
(b) is a sectional view of a clad material according to another embodiment of the present invention. ■... Steel material, 2 - Solder material, 3... Steel material, 3' - Tin plating. Arithmetic 1 Mouth (α) (b) Arithmetic 2 Diagram (α) (b) Army 3
Ridge (α) (b)
Claims (1)
ことを特徴とする銅−半田クララｌ：材。 ２、 前記半田材は表面に錫層を形成してなることを特
徴とする特許請求の第１項記載の銅−半田クラツド材。[Claims] 1. A copper-solder Clara material, characterized in that a tin layer is formed at the bonding interface of a preparation and a solder material. 2. The copper-solder clad material according to claim 1, wherein the solder material has a tin layer formed on its surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8315783A JPS59209500A (en) | 1983-05-12 | 1983-05-12 | Copper-solder clad material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8315783A JPS59209500A (en) | 1983-05-12 | 1983-05-12 | Copper-solder clad material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59209500A true JPS59209500A (en) | 1984-11-28 |
| JPH0339798B2 JPH0339798B2 (en) | 1991-06-14 |
Family
ID=13794406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8315783A Granted JPS59209500A (en) | 1983-05-12 | 1983-05-12 | Copper-solder clad material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59209500A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63141734A (en) * | 1986-12-04 | 1988-06-14 | 住友特殊金属株式会社 | Clad board |
| CN104400339A (en) * | 2014-10-28 | 2015-03-11 | 东莞市中一合金科技有限公司 | Processing technology for continuous strip compound solder band material and solder band material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474248A (en) * | 1977-11-24 | 1979-06-14 | Hitachi Cable Ltd | Clad solder |
-
1983
- 1983-05-12 JP JP8315783A patent/JPS59209500A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474248A (en) * | 1977-11-24 | 1979-06-14 | Hitachi Cable Ltd | Clad solder |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63141734A (en) * | 1986-12-04 | 1988-06-14 | 住友特殊金属株式会社 | Clad board |
| CN104400339A (en) * | 2014-10-28 | 2015-03-11 | 东莞市中一合金科技有限公司 | Processing technology for continuous strip compound solder band material and solder band material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339798B2 (en) | 1991-06-14 |
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