JPS59159939U - chip capacitor - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は従来のコンデンサの断面図、第３図
は本考案金属箔を配置した平面図、第４図は絶縁フィル
ムを貼付けた表面部を示す平面図、第５図は同底面図、
第６図はプリント基板に実装した断面図である。 図面において、１１．１２は金属箔、１３は折れ線、１
４は空間部、１５は表面部、１６．１７は露出部、１８
は絶縁フィルム、１９は裏面部、２０は絶縁フィルム、
２１は素子、２３は端子。Figures 1 and 2 are cross-sectional views of a conventional capacitor, Figure 3 is a plan view of the metal foil of the present invention, Figure 4 is a plan view showing the surface area to which an insulating film is attached, and Figure 5 is the same. bottom view,
FIG. 6 is a sectional view of the device mounted on a printed circuit board. In the drawing, 11.12 is metal foil, 13 is a polygonal line, 1
4 is a space part, 15 is a surface part, 16.17 is an exposed part, 18
19 is an insulating film, 19 is a back side part, 20 is an insulating film,
21 is an element, and 23 is a terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 少なくとも一面が折れ線で形成された２枚の金属箔を用
い、これらの金属箔の折れ線同士が対向するよう組合わ
さり、かつこれら金属箔に空間が生じるよう平面上に配
置し、これらの金属箔の表裏面に絶縁フィルムを貼合わ
せて一体化し、この表面に貼合わせた絶縁フィルムには
露出部を形成し、この露出部にコンデンサ素子及び端子
部を電気的に接続することを特徴とするチップ型コンデ
ンサ。Two sheets of metal foil with at least one side formed by a folded line are used, and the folded lines of these metal foils are placed so that they face each other, and the metal foils are placed on a plane so that a space is created between them. A chip type characterized in that an insulating film is laminated to the front and back surfaces and is integrated, an exposed portion is formed on the insulating film laminated to the front surface, and a capacitor element and a terminal portion are electrically connected to this exposed portion. capacitor.