JPS59159939U - chip capacitor - Google Patents
chip capacitorInfo
- Publication number
- JPS59159939U JPS59159939U JP5530583U JP5530583U JPS59159939U JP S59159939 U JPS59159939 U JP S59159939U JP 5530583 U JP5530583 U JP 5530583U JP 5530583 U JP5530583 U JP 5530583U JP S59159939 U JPS59159939 U JP S59159939U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- chip capacitor
- exposed portion
- laminated
- metal foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Capacitors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図及び第2図は従来のコンデンサの断面図、第3図
は本考案金属箔を配置した平面図、第4図は絶縁フィル
ムを貼付けた表面部を示す平面図、第5図は同底面図、
第6図はプリント基板に実装した断面図である。
図面において、11.12は金属箔、13は折れ線、1
4は空間部、15は表面部、16.17は露出部、18
は絶縁フィルム、19は裏面部、20は絶縁フィルム、
21は素子、23は端子。Figures 1 and 2 are cross-sectional views of a conventional capacitor, Figure 3 is a plan view of the metal foil of the present invention, Figure 4 is a plan view showing the surface area to which an insulating film is attached, and Figure 5 is the same. bottom view,
FIG. 6 is a sectional view of the device mounted on a printed circuit board. In the drawing, 11.12 is metal foil, 13 is a polygonal line, 1
4 is a space part, 15 is a surface part, 16.17 is an exposed part, 18
19 is an insulating film, 19 is a back side part, 20 is an insulating film,
21 is an element, and 23 is a terminal.
Claims (1)
い、これらの金属箔の折れ線同士が対向するよう組合わ
さり、かつこれら金属箔に空間が生じるよう平面上に配
置し、これらの金属箔の表裏面に絶縁フィルムを貼合わ
せて一体化し、この表面に貼合わせた絶縁フィルムには
露出部を形成し、この露出部にコンデンサ素子及び端子
部を電気的に接続することを特徴とするチップ型コンデ
ンサ。Two sheets of metal foil with at least one side formed by a folded line are used, and the folded lines of these metal foils are placed so that they face each other, and the metal foils are placed on a plane so that a space is created between them. A chip type characterized in that an insulating film is laminated to the front and back surfaces and is integrated, an exposed portion is formed on the insulating film laminated to the front surface, and a capacitor element and a terminal portion are electrically connected to this exposed portion. capacitor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5530583U JPS59159939U (en) | 1983-04-13 | 1983-04-13 | chip capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5530583U JPS59159939U (en) | 1983-04-13 | 1983-04-13 | chip capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59159939U true JPS59159939U (en) | 1984-10-26 |
JPH0140189Y2 JPH0140189Y2 (en) | 1989-12-01 |
Family
ID=30185627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5530583U Granted JPS59159939U (en) | 1983-04-13 | 1983-04-13 | chip capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59159939U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010165957A (en) * | 2009-01-19 | 2010-07-29 | Nichicon Corp | Chip-like solid electrolytic capacitor |
JP2010278032A (en) * | 2009-05-26 | 2010-12-09 | Nec Tokin Corp | Surface mounted capacitor |
-
1983
- 1983-04-13 JP JP5530583U patent/JPS59159939U/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010165957A (en) * | 2009-01-19 | 2010-07-29 | Nichicon Corp | Chip-like solid electrolytic capacitor |
JP2010278032A (en) * | 2009-05-26 | 2010-12-09 | Nec Tokin Corp | Surface mounted capacitor |
Also Published As
Publication number | Publication date |
---|---|
JPH0140189Y2 (en) | 1989-12-01 |
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