JPS5868048U - 発光ダイオ−ドの取付構造 - Google Patents
発光ダイオ−ドの取付構造Info
- Publication number
- JPS5868048U JPS5868048U JP16238081U JP16238081U JPS5868048U JP S5868048 U JPS5868048 U JP S5868048U JP 16238081 U JP16238081 U JP 16238081U JP 16238081 U JP16238081 U JP 16238081U JP S5868048 U JPS5868048 U JP S5868048U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- mounting structure
- diode mounting
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来例の説明図、第2図は本考案の一実施例を
示す要部の断面図、第3図はその背面図、第4図及び第
5図は本考案の他の実施例をそれぞれ示す発光ダイオー
ドの側面図である。 1・・・光ファイバー、2・・・取付部材、2b、
’lc・・・ガイド溝、3・・・発光ダイオード、3a
、 3b・・・リードフレーム、3C・・・発光体、
3e・・・発光部、4゜5・・・突起、6・・・光軸、
7・・・軸線。
示す要部の断面図、第3図はその背面図、第4図及び第
5図は本考案の他の実施例をそれぞれ示す発光ダイオー
ドの側面図である。 1・・・光ファイバー、2・・・取付部材、2b、
’lc・・・ガイド溝、3・・・発光ダイオード、3a
、 3b・・・リードフレーム、3C・・・発光体、
3e・・・発光部、4゜5・・・突起、6・・・光軸、
7・・・軸線。
Claims (1)
- 光ファイバーの端面に発光ダイオードの発光部を臨ませ
て取付ける場合において、発光ダイオードフレームに位
置決め用の突起を設け、−この突部を光ファイバーの取
付部材に形成したガイド溝に嵌合する′ことにより、発
光ダイオードの光軸と光ファイバーの軸線とを合致させ
たことを特徴とする発光ダイオードの取付構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16238081U JPS5868048U (ja) | 1981-10-30 | 1981-10-30 | 発光ダイオ−ドの取付構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16238081U JPS5868048U (ja) | 1981-10-30 | 1981-10-30 | 発光ダイオ−ドの取付構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5868048U true JPS5868048U (ja) | 1983-05-09 |
JPS6236309Y2 JPS6236309Y2 (ja) | 1987-09-16 |
Family
ID=29954695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16238081U Granted JPS5868048U (ja) | 1981-10-30 | 1981-10-30 | 発光ダイオ−ドの取付構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5868048U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0371665U (ja) * | 1989-11-15 | 1991-07-19 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50147887A (ja) * | 1974-05-17 | 1975-11-27 | ||
JPS55121212U (ja) * | 1979-02-21 | 1980-08-28 |
-
1981
- 1981-10-30 JP JP16238081U patent/JPS5868048U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50147887A (ja) * | 1974-05-17 | 1975-11-27 | ||
JPS55121212U (ja) * | 1979-02-21 | 1980-08-28 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0371665U (ja) * | 1989-11-15 | 1991-07-19 |
Also Published As
Publication number | Publication date |
---|---|
JPS6236309Y2 (ja) | 1987-09-16 |
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