JPS58222843A - Laminated board for printed wiring board - Google Patents
Laminated board for printed wiring boardInfo
- Publication number
- JPS58222843A JPS58222843A JP10655082A JP10655082A JPS58222843A JP S58222843 A JPS58222843 A JP S58222843A JP 10655082 A JP10655082 A JP 10655082A JP 10655082 A JP10655082 A JP 10655082A JP S58222843 A JPS58222843 A JP S58222843A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- laminate
- resin
- nonwoven fabric
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
不発明に、′にあけ加工性および特性に優nた印刷配線
板用積層板に関する0
最近、印刷配線板用積層板としてガラス不織布を基材と
してエポキシ樹脂を結合剤とした槓I−板(以下不織布
基材積層板と呼ぶ)か使用さnるz ’) rcなって
@たoCれに、電気絶縁特性か、ガラス布t−基材とし
たエポキシ情側槓膚板(ガシス布晶材積ノー板と呼ぶ)
It匹敵し、烙らに冷間打抜き加工性か優rしている
という%微を有する几めである0
しかしなから、スルーホールメッキ壁および−mはんだ
耐熱性を要求さnる一部電子関係用途においては、不織
布基材積層板のfIIF1彫彊がガラス布基材積層板に
比べて大きいために、基&のスルーホール内にはんだを
満たした場合にスルーホールメッキ壁と樹脂層との間に
を隙を生じ(以下こり現象全レジンリセッシヲンと叶ぶ
)スルーホールの1g顆性か低下するという問題点を壱
するoJ!に、近時配線板に部品ヶ搭載しにんだ浸漬を
行な9際のはんだ浴渦度か渇くなる傾向にあり、積層板
に要求さjLる0んだ耐熱性も厳しくなってきているか
、不織布基材積層板かcfLらυ厳しい榮件に耐えら7
’Lないとい9問題点tVする0
上記レジンリセッシ璽ンの生rゐ理由e、[不明な点か
多いか、ガラス不織布の留置かガラス布と比べて疎でる
。67tめ、樹脂と共に成形して得らr′L九積層板内
(/J @J脂υ含有率か必然的に高くlり、従って熱
膨張係数か高い樹脂v与υ部分か多くなり、基板が高温
のはんだに浸漬さnスルーホール内にはんだか満たさ2
″した時、こqJ樹脂のみ0部分の熱膨張収縮がガラス
やメッキ銅のそn工9大きい^め、冷却過程でメッキ壁
から(/J樹脂uHかrLt引き起すもOと考えらnる
〇本発明の発明者QIPに、不織布基材積層板υ優n7
t%黴を失7!9ことlく、上記の欠点を改良すべく検
討し、不織布に使9ガラス繊維を選ぶ仁とrc 、cり
改良することか出来ることを明らかrc (、た0
即ち、従来の不織布に密度か疎であるために、crLら
を使用し几積層版fミクロ的にみfLば樹脂部分の多い
部分と少ない部分とがありかなり不均一でめることがわ
か、り7to従って、cnら□
の不均一性を改善すrLは先にあげたレジンリセッシ璽
ン現象やはんだ耐熱性か向上すること七見出し本発明に
至り瓦◎上配不均−性に、ガラス不織布に起因丁411
もυでめる◎ガラス不織布σ一般yc平均径が9μmの
カラス繊維ki、5fllnlに切断したものt原繊と
して用い、こ1.全水中に分散せしめ、走行する網上に
抄造する方法で製造さtする。繊維υ結曾剤とじてに、
電気絶縁用途にに一般的にエポキシ樹脂エマルジョンが
使用さnる。この様にして得ら′nた不織布はマクロ的
rcみnVi均一なシート状物であるか、積層板のスル
ーホールで問題trtする程度(/Jミクロな部分でに
不均一である◇
不発明者等に、種々の平均径、平均長のガラス繊維で構
成さnる不織布について検討した結果、一枚の積層板中
K[用する不織布υ11か同一でろnは、即ち樹脂金M
率か同一であiLば、ガラス織布に使用する原NR(D
平均径全1μm以上5μm以下、平均長さを2mm以上
1[1mm以下とすることに↓り、積層板中のミクロ的
なカラス分布力・著しく改善さnることを見出した・し
1・かじ、使用するガラス繊維の平均長さ’
t2mrn以上iomm以下としたガラス不織布にエポ
キシ樹脂と共に積層成形するとsqJm脂υ流nrC耐
えらn丁、不織布切t′L、″を起こす場@かめるか、
この場付次の二つの方法で不織布切nt−解決すること
ができる。一つに、樹脂を流す速度を遅くすることであ
る0即ち、黙諾υ型締め速度を遅くして樹脂流動速度を
小さく丁才しは樹脂流n時の不織布切nt起すことなく
良好な積層板を得ることかで′@る0もう一つの方法に
、前述の平均長さ2mm以上10mm以下のガラス繊維
に従来の不織布Ki2用している平均* 15 mn+
以上以上25塁
らn7を不織布を使う方法であって、外形時の樹脂流R
t/cよる不織布切jLかなく、良好な積層板を得るこ
とかで@る。又混合するガラス繊維の平均長さか100
11110’(+”越えると不織布自身のガラスのマク
ロな分布が着しく感化することと、不織布をmgする繊
維長の平均がlQmmを越えるmめ不織布中のガラス繊
維のミクロ的な分布は改善さnないことり理由で不発明
の目的#/L@わないもりとなる。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminate for printed wiring boards which has excellent processability and properties. A laminated I-board (hereinafter referred to as a non-woven fabric base material laminate) is used.In addition to the electrical insulation properties, the epoxy side laminate with a glass cloth T-base material is used. skin board (called gasis cloth crystal board)
It is a method with a slight advantage in cold punching workability that is comparable to that of other electronic devices. In the application, because the fIIF1 engraving of the nonwoven fabric base laminate is larger than that of the glass fabric base laminate, when the through holes of the base board are filled with solder, the gap between the through hole plated wall and the resin layer is OJ! Recently, when parts are mounted on wiring boards and immersed in solder, the solder bath vorticity tends to become dry, and the heat resistance required for laminates has become stricter. , non-woven base material laminates or cfL etc. can withstand harsh conditions 7
9 Problems tV 0 Reasons for the creation of the above resin recess seal e. [There are many unclear points, or the retention of glass non-woven fabric is sparse compared to glass cloth. 67t, the inside of the r'L9 laminate obtained by molding with resin (/J @J fat υ content is inevitably high, and therefore the resin v with a high coefficient of thermal expansion has a large υ part, and the substrate is dipped in high temperature solder and the through hole is filled with solder 2
``When doing this, the thermal expansion and contraction of the 0 part of this qJ resin is larger than that of glass and plated copper, so it is thought that the cooling process will cause (/J resin uH or rLt) from the plated wall. 〇 To the inventor of the present invention, QIP, the nonwoven fabric base material laminate υyu n7
In order to improve the above-mentioned drawbacks, it was found that the glass fiber used for the non-woven fabric could be improved. Since conventional non-woven fabrics have a low density, it can be seen that the laminated version using crL et al., microscopically, has some parts with a lot of resin and some parts with a small amount of resin, making it quite uneven. Therefore, rL that improves the non-uniformity of cn et al. improves the resin recess phenomenon and soldering heat resistance mentioned above. Origin 411
◎ Glass nonwoven fabric σ General yc Glass fiber ki with an average diameter of 9 μm, cut into 5flnnl t Used as raw fiber, 1. It is manufactured by dispersing it in water and forming it on a moving net. As well as a fiber condenser,
Epoxy resin emulsions are commonly used for electrical insulation applications. The nonwoven fabric obtained in this way is either a sheet-like material with uniform macroscopic dimensions, or it is non-uniform in microscopic areas to the extent that it causes problems in the through holes of the laminate. As a result of examining nonwoven fabrics composed of glass fibers with various average diameters and average lengths, they found that in one laminate, the nonwoven fabrics υ11 or n used are the same, that is, resin gold M.
If the ratio is the same, the original NR (D
We have found that by setting the average diameter to 1 μm or more and 5 μm or less and the average length to 2 mm or more and 1 mm or less, the microscopic glass distribution force in the laminate can be significantly improved. , average length of glass fiber used'
When laminated and molded with epoxy resin on a glass nonwoven fabric with a thickness of t2mrn or more and iomm or less, it can withstand sqJm oil flow nrC, and nonwoven fabric cut t'L,'' can occur.
This situation can be solved by the following two methods. One way is to slow down the resin flow rate.In other words, by slowing down the mold clamping speed and reducing the resin flow rate, it is possible to achieve good lamination without causing nonwoven fabric tear when the resin flow is n. Another way to obtain a board is to use the conventional non-woven fabric Ki2 on the glass fibers with an average length of 2 mm or more and 10 mm or less.
The above is a method of using non-woven fabric for the 25th base and n7, and the resin flow R at the time of external shape.
It is important to obtain a good laminate without cutting the nonwoven fabric by t/c. Also, the average length of the glass fibers to be mixed is 100
If it exceeds 11110'(+"), the macroscopic distribution of glass in the nonwoven fabric itself will become sensitive, and the average fiber length in mg of the nonwoven fabric will exceed lQmm, and the microscopic distribution of glass fibers in the nonwoven fabric will be improved. The purpose of non-invention is #/L@Wanaimori because of the reason.
平均径か1μm以上5μm以下で平均−&が2m以上l
Qmm以下のガラス繊維と平均長か13mm以上25m
m以下の長いカラス繊維とfr.混合使用して得らt″
Lfc不織at菅えば得らrした積層板のレジンリセッ
シ冒ンの発生率お裏びrJんだ耐熱性rJ従従来不織布
基材積層板VC比べていりそう改善さn,さらに混合し
て使用する平均長がj5mmで平均径が9μmc/J長
いカラス確維を全体の約60重′M%、平均長が6f[
1mで平均径が5關りカラス繊維を全体の約70%とな
るように混合して作り7C 1j−yス不絨布七使っ7
ヒ槓層板りレジンリセッシ望ンVJ弗生率2よびにんた
耐熱性aいっそう著しく改善さn几0こり揚台の不織布
を構成′する繊細の全平均性rJ約4.8μmであり全
平均長に約6. 1 mmであった。冷間打抜きおよび
ドリルV(よる大内粗さへの効釆も笈らなか−)7′?
:、。又、平均長か1,5m+nC/J艮いカラス繊維
の混曾割公か50%を越えると、レジンリセッシ璽ンの
発生率か尚くなる傾同が与ら7Lる。従って、平均−&
15mm以上25mm以Fり艮いガラス繊維ctJ混せ
割せに50%以下とすることか好ましい。又、不織布を
構成するガラス繊維の平均径rI5μm以下であnば本
発明の目的を達成゛ する仁とかできるか、平均径75
11μm未満になるとガ乏ス繊維callli造コスト
か高<7!り望ましくない。又、不織布全構成するガラ
ス繊維の平均長さはiQmm以下でめnば、本発明の目
的音達成する仁とかできるが、平均長さか2 n++n
未満になると不織布の柔軟性か無くなり、積層板の加工
作業性か著しく低下す、6丸め本発明の目的を達成する
ことかで@ない。本発明による印刷配線板用積層板に用
いるガラス不織布t−構成するガラス繊維としては通称
無アルカリガラスと呼ばnるEガラス繊維t−便用する
のか一般的であるか、−気特性か優n九他の組成Oガラ
ス穢維會用いてもさしつかえない。又、ガラス繊維の製
造法とじては、溶融紡糸I/c↓る長繊維を切断する方
法、溶融ガラスを遠心法や蒸気流に!り吹き飛ばして得
られる短繊維をミキサー等で粉砕して得らnる短繊維を
ミキサー等で粉砕して得る方法等のいずnvtエウても
かまわない〇以下VL朶施例を説明する・なお%に電量
%である。The average diameter is 1μm or more and 5μm or less, and the average -& is 2m or more.
Glass fiber of Qmm or less and average length of 13mm or more 25m
long glass fibers of less than m and fr. obtained using mixed t''
The incidence of resin recessing of the laminates obtained with LFC nonwovens has been improved, and the heat resistance has been improved compared to conventional nonwoven base laminates. The crow fibers with an average length of 5 mm and an average diameter of 9 μm c/J are approximately 60% of the total weight and have an average length of 6 f[
7C 1j-y non-woven fabric made by mixing crow fibers with an average diameter of 5 and making up about 70% of the total.
After recessing the resin layer, the heat resistance and heat resistance of VJ are even more significantly improved. Approximately 6. It was 1 mm. Cold punching and drilling V (it has no effect on roughness) 7'?
:,. Furthermore, if the average length of the glass fibers exceeds 50%, the incidence of resin recess tends to increase further (7L). Therefore, the average −&
It is preferable that glass fibers of 15 mm or more and 25 mm or more are mixed and divided by 50% or less. Also, if the average diameter rI of the glass fibers constituting the nonwoven fabric is 5 μm or less, it is possible to achieve the purpose of the present invention.
When the thickness is less than 11 μm, the cost of manufacturing the fibers becomes high <7! undesirable. In addition, if the average length of the glass fibers constituting the entire nonwoven fabric is less than iQmm, it is possible to achieve the purpose of the present invention, but the average length is less than 2n++n.
If it is less than 6, the flexibility of the nonwoven fabric will be lost, and the processing workability of the laminate will be significantly reduced. Glass nonwoven fabric used in the laminate for printed wiring boards according to the present invention - The constituent glass fiber is commonly called alkali-free glass - Is it convenient or common? - Characteristics? 9. Glass fibers of other compositions may also be used. In addition, methods for manufacturing glass fiber include cutting long fibers using melt spinning I/C↓, and using molten glass using centrifugation or steam flow! Any nvt method may be used, such as the method of pulverizing the short fibers obtained by blowing the fibers with a mixer, etc. Below, we will explain the VL examples. The amount of electricity is %.
積層板の成形に用いた樹脂に次のように準備した。M搗
固形(tJ無溶剤型エポキシ樹脂(テバ社商品名ア2ル
ダイト8011)を加熱容器内で110℃で溶融液化し
、別の容器に硬化剤(日立化成、商品名HN−2200
)とイ足進剤べ/ジルジメチルアミン(BDMA)tQ
γ昆@9勿を厘渦液状の状態″′C準備し7tocjL
らの容器から樹脂100都、硬化剤66s、促進剤1.
5都となるように秤量し攪拌混合した0混甘しに樹脂4
00g會準備し九〇
〈実施?I11>
平均径6μm平均長か6mmのガラス繊維で抄紙し、エ
ポキシバインダーk1台剤として?4たszomm角の
200 g/rd(tJガラス不織布Aり上に・上述0
混甘した樹脂400 g’i・不織布
1゜υ中央部の約400mmφとなる様に流延供給しj
!にこの上にガラス不織布A會電ねた0こり両表面に厚
さ55μmり銅箔と処理カラスクロスを銅箔か最表面と
72.6ように重ね、仁nt下金型か5iQmmP4υ
平盤で上金型か510關角平盤の内側周辺部に筒さj、
l mm1幅5mmの帯状の突起上進らした金型Vt
チャージし、直ちl’を熱圧プレスした。この時の金型
温度に下、下とも170℃であり、50秒間で型締め全
行ない黙諾VLかかる最^圧カフ0鞄/−で5分間成形
した。The resin used for forming the laminate was prepared as follows. Melt and liquefy a M-solid (tJ solvent-free epoxy resin (trade name: Aldite 8011, manufactured by Teva Corporation) at 110°C in a heating container, and add a curing agent (Hitachi Chemical, trade name: HN-2200) to a separate container.
) and the stimulant be/zyldimethylamine (BDMA) tQ
γkon @ 9 Nuru vortex liquid state''C Prepare 7tocjL
100 resin, 66 s hardener, 1 accelerator from the container.
Weighed and stirred to make 5 parts, mixed 0 parts with 4 parts of resin.
Prepare for 00g meeting and conduct 90? I11> Paper is made from glass fiber with an average diameter of 6 μm and an average length of 6 mm, and used as an epoxy binder K1 agent? 4 szomm square 200 g/rd (on top of tJ glass nonwoven fabric A)
Sweetened resin 400 g'i/non-woven fabric
1゜υCentral part has a diameter of approximately 400mm.
! Layer 55 μm thick copper foil and treated crow cloth on both surfaces of the glass nonwoven fabric A and the treated glass cloth on top of the copper foil or the outermost surface, and place 5iQmm P4υ on the bottom mold.
With a flat plate, insert a tube into the upper mold or the inner periphery of the 510 square plate.
l Mold Vt advanced over a band-shaped protrusion with a width of 5 mm
After charging, l' was immediately hot pressed. At this time, the mold temperature was 170° C. for both the lower and lower molds, and molding was carried out for 5 minutes at the maximum pressure cuff 0 bag/-, which required full mold clamping in 50 seconds.
傅らnた積層板の加工性とスルーホールの信頼性に表1
に示す通りであって、いfnも従来のガラス不織布基材
積層板と比較して優nていることがわかる。Table 1 shows the processability of the laminate and the reliability of through holes.
As shown in Fig. 2, it can be seen that fn is also superior to that of the conventional glass nonwoven fabric base laminate.
〈実施例2〉
平均径9μmで平均長が13mmυEガ2ス繊維全2ス
繊維會全平均長か6mmで平均径か6μmのEガラス繊
維を全体C1J70%となる様に混合したガラス#!慎
平均径4.8 ttm 3f!−均長8.1 flll
yc抄紙し、エポキシバインダー上箱合剤として得た5
2父州角の200 g/rn”QJガ2ス不絨布を実施
例1と同様の方法で成形し積層板を得九〇ただし、型締
め時間rI50秒で実施例1と比べて短かくすることか
できた。<Example 2> E glass fibers with an average diameter of 9 μm and an average length of 13 mm υ E glass fibers with a total average length of 6 mm and an average diameter of 6 μm were mixed so that the total C1J was 70% #! Shinken average diameter 4.8 ttm 3f! -Uniform length 8.1 flll
5 obtained by making yc paper and using an epoxy binder upper box mixture.
A laminate was obtained by molding a 200 g/rn" QJ gas nonwoven fabric with a 2-inch diameter in the same manner as in Example 1. However, the mold clamping time rI was 50 seconds, which was shorter than in Example 1. I was able to do something.
積層板り〃ロエ性と特性に表1に示f通りでめりて、平
均径か9μmで平均長さが15mmのEガラス繊mV)
蓋を全体の繊維の50%まで増加させても、加工性おL
び時性共、従来のガラス不織布基材積層板と比べて良好
であることかわアク為60
〈比較例1〉
平均径5μm平均長か6mm以下(t、)E jj 9
、<繊維に、平均径か9μmで平均長か16闘υEガ
ラス繊維を!it割台で40%となる工うVC−m台し
たガラス繊維(平均径5.4μm、平均長8.8市)で
抄紙し、エポキシバインダーを粕台剤として得7t52
0mln角の200 g/m”のガラス不織布t−実施
例2と同様の方法で成形し積層板上!また・倚ら2″L
7を積層板の加工性および特性tq表IK示す通りで、
平均長か15mmCL)Eガラス繊維の比率かQ<nる
と、レジ/リセッシyンの発生率が高くなり、はんだ耐
熱性も劣るCとがわかる◎
〈比較?lJ2>
平均径か9μm′t″平均長か15rnmυEガンス繊
Mのみで抄紙した従来のガラス不織布を使用して実施例
1と同様の方法′crJy、形し7’C槓層板の特性を
表1に参考の^め示した。Laminated board (E glass fiber mV with an average diameter of 9 μm and an average length of 15 mm)
Even if the lid is increased to 50% of the total fiber, the processability is still low.
Comparative example 1 Average diameter: 5 μm Average length: 6 mm or less (t,) E jj 9
, <For the fibers, use glass fibers with an average diameter of 9 μm and an average length of 16 mm! Paper was made using glass fibers (average diameter 5.4 μm, average length 8.8 mm) processed on a VC-m machine that was 40% on an IT machine, and an epoxy binder was used as a lees base agent to obtain 7t52.
0 mln square 200 g/m" glass non-woven fabric T - Molded in the same manner as in Example 2 and placed on a laminate board! Also, 2" L
7 is the processability and characteristics of the laminate as shown in Table IK,
If the average length is 15mm (CL) E or the ratio of glass fiber is Q < n, the incidence of registration/recession will be high and the soldering heat resistance will be inferior to C. ◎ <Comparison? lJ2> Average diameter: 9 μm′t″ Average length: 15 nmυE A conventional glass nonwoven fabric made of only E Gans fiber M was used and shaped using the same method as in Example 1. 1 is provided for reference.
表1 積層板り特性
*L 金m′t1打抜い丸穴り壁粗畜をIII黴鋺で観
察し魁*1 スルーホールメッキした姦O閤角の基板を
1811℃のはんだ箔にてはんだ嬶げをし、スルーホー
ル断面【顕II鏑にで観察しメッキ壁と基板の樹脂Mと
のはがれの長さを−ILU下の0真で発生率を算出した
。Table 1 Laminated board characteristics*L Gold m't1 Punched round hole wall roughness was observed with III molding machine *1 Through-hole plated board with 100° angle was soldered with solder foil at 1811°C. The length of peeling between the plated wall and the resin M of the substrate was determined by observing the cross section of the through-hole with a microscope II and calculating the occurrence rate using the zero true value under -ILU.
1 鋼重”げ″′n除去し1層M”°ら60−幀片を採
堆1水蒸気1”′1・82々 1(121℃)
O圧力がt中で1時間l1kIII&履したあと、2s
8℃の社んだ浴l!:所定時間の開演を行ない、外観の
変化を調べ丸。1. Remove the steel weight and collect 1 layer of M"° 60-layer strips. 1. Steam 1.82" (121℃).
After 1 hour of l1kIII & wear at O pressure t, 2s
A bath at 8℃! : Start the show at the specified time and check for changes in appearance.
以上に貌明したLうIc、不発明り積層板に加工性およ
び特性に優rしており従来問題とさ才していたレジンリ
セッシ冒ン現象やaんたl1llt熱性を解決するもの
でめった。The above-mentioned LIC has superior workability and properties to the uninvented laminate, and has been found to be able to solve the conventional problems of resin recess failure and thermal properties.
92A92A
Claims (1)
m以上1Qmm以下cLJガ2ス繊維で構成さnるガラ
ス不織布′(I−PPJ硬化性樹脂と共に成形して得ら
nる印刷配線板用積層板。 2、ガラス不織布が、平均長さか15mm以上25mm
以下のガラス繊維を混付したものであることt−待機と
する特許請求の範囲第1項に記載の印刷配線板用積層板
。[Claims] 1. Average diameter is 12 m or more and 5 μm or more and average length is 2 m.
A glass nonwoven fabric composed of LJ gas fibers with a length of 1 Qmm or more and a printed wiring board laminate obtained by molding with an I-PPJ curable resin. 2. The glass nonwoven fabric has an average length of 15 mm or more. 25mm
The laminate for a printed wiring board according to claim 1, wherein the laminate for a printed wiring board is made of a material mixed with the following glass fibers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10655082A JPS58222843A (en) | 1982-06-21 | 1982-06-21 | Laminated board for printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10655082A JPS58222843A (en) | 1982-06-21 | 1982-06-21 | Laminated board for printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58222843A true JPS58222843A (en) | 1983-12-24 |
Family
ID=14436454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10655082A Pending JPS58222843A (en) | 1982-06-21 | 1982-06-21 | Laminated board for printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58222843A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS543166A (en) * | 1977-06-09 | 1979-01-11 | Japan Vilene Co Ltd | Manufacture of laminated board |
JPS5496107A (en) * | 1978-01-13 | 1979-07-30 | Mitsubishi Paper Mills Ltd | Production of paper or sheet with good dimentional stability |
JPS54144487A (en) * | 1978-04-30 | 1979-11-10 | Matsushita Electric Works Ltd | Manufacture of epoxy resin laminate |
JPS5536760A (en) * | 1978-09-07 | 1980-03-14 | Seiko Epson Corp | Measuring device of aging |
JPS5559957A (en) * | 1978-10-30 | 1980-05-06 | Shin Kobe Electric Machinery | Preparation of thermal plastic resin laminated board |
-
1982
- 1982-06-21 JP JP10655082A patent/JPS58222843A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS543166A (en) * | 1977-06-09 | 1979-01-11 | Japan Vilene Co Ltd | Manufacture of laminated board |
JPS5496107A (en) * | 1978-01-13 | 1979-07-30 | Mitsubishi Paper Mills Ltd | Production of paper or sheet with good dimentional stability |
JPS54144487A (en) * | 1978-04-30 | 1979-11-10 | Matsushita Electric Works Ltd | Manufacture of epoxy resin laminate |
JPS5536760A (en) * | 1978-09-07 | 1980-03-14 | Seiko Epson Corp | Measuring device of aging |
JPS5559957A (en) * | 1978-10-30 | 1980-05-06 | Shin Kobe Electric Machinery | Preparation of thermal plastic resin laminated board |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW508772B (en) | Semiconductor apparatus | |
DE60014549T2 (en) | High permeability layers or prepregs, their manufacture and use in printed circuit boards | |
CN101585955A (en) | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil | |
JPH0145417B2 (en) | ||
JPS607796A (en) | Copper-lined laminated board for printed circuit and method of producing same | |
JPS58222843A (en) | Laminated board for printed wiring board | |
US6117516A (en) | Laminate and process for producing the same | |
JPH01222950A (en) | Laminated plate | |
JPH1017684A (en) | Production of prepreg and laminate | |
CN109451658A (en) | A kind of flexible circuit board and preparation method | |
JPS58225689A (en) | Method of producing laminated board for printed circuit board | |
JPS6072931A (en) | Production of paper-base phenolic resin laminate | |
CN209636157U (en) | A kind of Wireless charging coil covering glue film | |
CN109385089A (en) | A kind of stringent equimolar monomer combines the synthesis of polyamic acid resin of compensation charging | |
JPH0320354A (en) | Film for metallic substrate | |
JPH0356583B2 (en) | ||
JPS58139490A (en) | Composite material utilizing alumina fiber | |
CN106515125A (en) | Metal-based composite substrate and preparation process thereof | |
CN109628036A (en) | A kind of filling glue for Wireless charging coil cover film | |
JPH01258487A (en) | Supporter of drill vsed for drilling small diameter hole in circuit board | |
JPH0453182A (en) | Copper-plated laminated sheet | |
JPH02160998A (en) | Raw material for electrical insulation laminate | |
JPH0497838A (en) | Copper plated laminated sheet | |
JPS5941262A (en) | Manufacture of laminated board | |
JPS6336943B2 (en) |