JPS58222843A - Laminated board for printed wiring board - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 不発明に、′にあけ加工性および特性に優ｎた印刷配線
板用積層板に関する０ 最近、印刷配線板用積層板としてガラス不織布を基材と
してエポキシ樹脂を結合剤とした槓Ｉ−板（以下不織布
基材積層板と呼ぶ）か使用さｎるｚ　’）　ｒｃなって
＠たｏＣれに、電気絶縁特性か、ガラス布ｔ−基材とし
たエポキシ情側槓膚板（ガシス布晶材積ノー板と呼ぶ）
　Ｉｔ匹敵し、烙らに冷間打抜き加工性か優ｒしている
という％微を有する几めである０ しかしなから、スルーホールメッキ壁および−ｍはんだ
耐熱性を要求さｎる一部電子関係用途においては、不織
布基材積層板のｆＩＩＦ１彫彊がガラス布基材積層板に
比べて大きいために、基＆のスルーホール内にはんだを
満たした場合にスルーホールメッキ壁と樹脂層との間に
を隙を生じ（以下こり現象全レジンリセッシヲンと叶ぶ
）スルーホールの１ｇ顆性か低下するという問題点を壱
するｏＪ！に、近時配線板に部品ヶ搭載しにんだ浸漬を
行な９際のはんだ浴渦度か渇くなる傾向にあり、積層板
に要求さｊＬる０んだ耐熱性も厳しくなってきているか
、不織布基材積層板かｃｆＬらυ厳しい榮件に耐えら７
’Ｌないとい９問題点ｔＶする０ 上記レジンリセッシ璽ンの生ｒゐ理由ｅ、［不明な点か
多いか、ガラス不織布の留置かガラス布と比べて疎でる
。６７ｔめ、樹脂と共に成形して得らｒ′Ｌ九積層板内
（／Ｊ　＠Ｊ脂υ含有率か必然的に高くｌり、従って熱
膨張係数か高い樹脂ｖ与υ部分か多くなり、基板が高温
のはんだに浸漬さｎスルーホール内にはんだか満たさ２
″した時、こｑＪ樹脂のみ０部分の熱膨張収縮がガラス
やメッキ銅のそｎ工９大きい＾め、冷却過程でメッキ壁
から（／Ｊ樹脂ｕＨかｒＬｔ引き起すもＯと考えらｎる
〇本発明の発明者ＱＩＰに、不織布基材積層板υ優ｎ７
ｔ％黴を失７！９ことｌく、上記の欠点を改良すべく検
討し、不織布に使９ガラス繊維を選ぶ仁とｒｃ　、ｃり
改良することか出来ることを明らかｒｃ　（、た０ 即ち、従来の不織布に密度か疎であるために、ｃｒＬら
を使用し几積層版ｆミクロ的にみｆＬば樹脂部分の多い
部分と少ない部分とがありかなり不均一でめることがわ
か、り７ｔｏ従って、ｃｎら□ の不均一性を改善すｒＬは先にあげたレジンリセッシ璽
ン現象やはんだ耐熱性か向上すること七見出し本発明に
至り瓦◎上配不均−性に、ガラス不織布に起因丁４１１
もυでめる◎ガラス不織布σ一般ｙｃ平均径が９μｍの
カラス繊維ｋｉ、５ｆｌｌｎｌに切断したものｔ原繊と
して用い、こ１．全水中に分散せしめ、走行する網上に
抄造する方法で製造さｔする。繊維υ結曾剤とじてに、
電気絶縁用途にに一般的にエポキシ樹脂エマルジョンが
使用さｎる。この様にして得ら′ｎた不織布はマクロ的
ｒｃみｎＶｉ均一なシート状物であるか、積層板のスル
ーホールで問題ｔｒｔする程度（／Ｊミクロな部分でに
不均一である◇ 不発明者等に、種々の平均径、平均長のガラス繊維で構
成さｎる不織布について検討した結果、一枚の積層板中
Ｋ［用する不織布υ１１か同一でろｎは、即ち樹脂金Ｍ
率か同一であｉＬば、ガラス織布に使用する原ＮＲ（Ｄ
平均径全１μｍ以上５μｍ以下、平均長さを２ｍｍ以上
１［１ｍｍ以下とすることに↓り、積層板中のミクロ的
なカラス分布力・著しく改善さｎることを見出した・し
　　　　　１・かじ、使用するガラス繊維の平均長さ’
ｔ２ｍｒｎ以上ｉｏｍｍ以下としたガラス不織布にエポ
キシ樹脂と共に積層成形するとｓｑＪｍ脂υ流ｎｒＣ耐
えらｎ丁、不織布切ｔ′Ｌ、″を起こす場＠かめるか、
この場付次の二つの方法で不織布切ｎｔ−解決すること
ができる。一つに、樹脂を流す速度を遅くすることであ
る０即ち、黙諾υ型締め速度を遅くして樹脂流動速度を
小さく丁才しは樹脂流ｎ時の不織布切ｎｔ起すことなく
良好な積層板を得ることかで′＠る０もう一つの方法に
、前述の平均長さ２ｍｍ以上１０ｍｍ以下のガラス繊維
に従来の不織布Ｋｉ２用している平均＊　１５　ｍｎ＋
以上以上２５塁 らｎ７を不織布を使う方法であって、外形時の樹脂流Ｒ
ｔ／ｃよる不織布切ｊＬかなく、良好な積層板を得るこ
とかで＠る。又混合するガラス繊維の平均長さか１００
１１１１０’（＋”越えると不織布自身のガラスのマク
ロな分布が着しく感化することと、不織布をｍｇする繊
維長の平均がｌＱｍｍを越えるｍめ不織布中のガラス繊
維のミクロ的な分布は改善さｎないことり理由で不発明
の目的＃／Ｌ＠わないもりとなる。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminate for printed wiring boards which has excellent processability and properties. A laminated I-board (hereinafter referred to as a non-woven fabric base material laminate) is used.In addition to the electrical insulation properties, the epoxy side laminate with a glass cloth T-base material is used. skin board (called gasis cloth crystal board)
It is a method with a slight advantage in cold punching workability that is comparable to that of other electronic devices. In the application, because the fIIF1 engraving of the nonwoven fabric base laminate is larger than that of the glass fabric base laminate, when the through holes of the base board are filled with solder, the gap between the through hole plated wall and the resin layer is OJ! Recently, when parts are mounted on wiring boards and immersed in solder, the solder bath vorticity tends to become dry, and the heat resistance required for laminates has become stricter. , non-woven base material laminates or cfL etc. can withstand harsh conditions 7
9 Problems tV 0 Reasons for the creation of the above resin recess seal e. [There are many unclear points, or the retention of glass non-woven fabric is sparse compared to glass cloth. 67t, the inside of the r'L9 laminate obtained by molding with resin (/J @J fat υ content is inevitably high, and therefore the resin v with a high coefficient of thermal expansion has a large υ part, and the substrate is dipped in high temperature solder and the through hole is filled with solder 2
``When doing this, the thermal expansion and contraction of the 0 part of this qJ resin is larger than that of glass and plated copper, so it is thought that the cooling process will cause (/J resin uH or rLt) from the plated wall. 〇 To the inventor of the present invention, QIP, the nonwoven fabric base material laminate υyu n7
In order to improve the above-mentioned drawbacks, it was found that the glass fiber used for the non-woven fabric could be improved. Since conventional non-woven fabrics have a low density, it can be seen that the laminated version using crL et al., microscopically, has some parts with a lot of resin and some parts with a small amount of resin, making it quite uneven. Therefore, rL that improves the non-uniformity of cn et al. improves the resin recess phenomenon and soldering heat resistance mentioned above. Origin 411
◎ Glass nonwoven fabric σ General yc Glass fiber ki with an average diameter of 9 μm, cut into 5flnnl t Used as raw fiber, 1. It is manufactured by dispersing it in water and forming it on a moving net. As well as a fiber condenser,
Epoxy resin emulsions are commonly used for electrical insulation applications. The nonwoven fabric obtained in this way is either a sheet-like material with uniform macroscopic dimensions, or it is non-uniform in microscopic areas to the extent that it causes problems in the through holes of the laminate. As a result of examining nonwoven fabrics composed of glass fibers with various average diameters and average lengths, they found that in one laminate, the nonwoven fabrics υ11 or n used are the same, that is, resin gold M.
If the ratio is the same, the original NR (D
We have found that by setting the average diameter to 1 μm or more and 5 μm or less and the average length to 2 mm or more and 1 mm or less, the microscopic glass distribution force in the laminate can be significantly improved. , average length of glass fiber used'
When laminated and molded with epoxy resin on a glass nonwoven fabric with a thickness of t2mrn or more and iomm or less, it can withstand sqJm oil flow nrC, and nonwoven fabric cut t'L,'' can occur.
This situation can be solved by the following two methods. One way is to slow down the resin flow rate.In other words, by slowing down the mold clamping speed and reducing the resin flow rate, it is possible to achieve good lamination without causing nonwoven fabric tear when the resin flow is n. Another way to obtain a board is to use the conventional non-woven fabric Ki2 on the glass fibers with an average length of 2 mm or more and 10 mm or less.
The above is a method of using non-woven fabric for the 25th base and n7, and the resin flow R at the time of external shape.
It is important to obtain a good laminate without cutting the nonwoven fabric by t/c. Also, the average length of the glass fibers to be mixed is 100
If it exceeds 11110'(+"), the macroscopic distribution of glass in the nonwoven fabric itself will become sensitive, and the average fiber length in mg of the nonwoven fabric will exceed lQmm, and the microscopic distribution of glass fibers in the nonwoven fabric will be improved. The purpose of non-invention is #/L@Wanaimori because of the reason.

平均径か１μｍ以上５μｍ以下で平均−＆が２ｍ以上ｌ
Ｑｍｍ以下のガラス繊維と平均長か１３ｍｍ以上２５ｍ
ｍ以下の長いカラス繊維とｆｒ．混合使用して得らｔ″
Ｌｆｃ不織ａｔ菅えば得らｒした積層板のレジンリセッ
シ冒ンの発生率お裏びｒＪんだ耐熱性ｒＪ従従来不織布
基材積層板ＶＣ比べていりそう改善さｎ，さらに混合し
て使用する平均長がｊ５ｍｍで平均径が９μｍｃ／Ｊ長
いカラス確維を全体の約６０重′Ｍ％、平均長が６ｆ［
１ｍで平均径が５關りカラス繊維を全体の約７０％とな
るように混合して作り７Ｃ　１ｊ−ｙス不絨布七使っ７
ヒ槓層板りレジンリセッシ望ンＶＪ弗生率２よびにんた
耐熱性ａいっそう著しく改善さｎ几０こり揚台の不織布
を構成′する繊細の全平均性ｒＪ約４．８μｍであり全
平均長に約６．　１　ｍｍであった。冷間打抜きおよび
ドリルＶ（よる大内粗さへの効釆も笈らなか−）７′？
：、。又、平均長か１，５ｍ＋ｎＣ／Ｊ艮いカラス繊維
の混曾割公か５０％を越えると、レジンリセッシ璽ンの
発生率か尚くなる傾同が与ら７Ｌる。従って、平均−＆
１５ｍｍ以上２５ｍｍ以Ｆり艮いガラス繊維ｃｔＪ混せ
割せに５０％以下とすることか好ましい。又、不織布を
構成するガラス繊維の平均径ｒＩ５μｍ以下であｎば本
発明の目的を達成゛　する仁とかできるか、平均径７５
１１μｍ未満になるとガ乏ス繊維ｃａｌｌｌｉ造コスト
か高＜７！り望ましくない。又、不織布全構成するガラ
ス繊維の平均長さはｉＱｍｍ以下でめｎば、本発明の目
的音達成する仁とかできるが、平均長さか２　ｎ＋＋ｎ
未満になると不織布の柔軟性か無くなり、積層板の加工
作業性か著しく低下す、６丸め本発明の目的を達成する
ことかで＠ない。本発明による印刷配線板用積層板に用
いるガラス不織布ｔ−構成するガラス繊維としては通称
無アルカリガラスと呼ばｎるＥガラス繊維ｔ−便用する
のか一般的であるか、−気特性か優ｎ九他の組成Ｏガラ
ス穢維會用いてもさしつかえない。又、ガラス繊維の製
造法とじては、溶融紡糸Ｉ／ｃ↓る長繊維を切断する方
法、溶融ガラスを遠心法や蒸気流に！り吹き飛ばして得
られる短繊維をミキサー等で粉砕して得らｎる短繊維を
ミキサー等で粉砕して得る方法等のいずｎｖｔエウても
かまわない〇以下ＶＬ朶施例を説明する・なお％に電量
％である。The average diameter is 1μm or more and 5μm or less, and the average -& is 2m or more.
Glass fiber of Qmm or less and average length of 13mm or more 25m
long glass fibers of less than m and fr. obtained using mixed t''
The incidence of resin recessing of the laminates obtained with LFC nonwovens has been improved, and the heat resistance has been improved compared to conventional nonwoven base laminates. The crow fibers with an average length of 5 mm and an average diameter of 9 μm c/J are approximately 60% of the total weight and have an average length of 6 f[
7C 1j-y non-woven fabric made by mixing crow fibers with an average diameter of 5 and making up about 70% of the total.
After recessing the resin layer, the heat resistance and heat resistance of VJ are even more significantly improved. Approximately 6. It was 1 mm. Cold punching and drilling V (it has no effect on roughness) 7'?
:,. Furthermore, if the average length of the glass fibers exceeds 50%, the incidence of resin recess tends to increase further (7L). Therefore, the average −&
It is preferable that glass fibers of 15 mm or more and 25 mm or more are mixed and divided by 50% or less. Also, if the average diameter rI of the glass fibers constituting the nonwoven fabric is 5 μm or less, it is possible to achieve the purpose of the present invention.
When the thickness is less than 11 μm, the cost of manufacturing the fibers becomes high <7! undesirable. In addition, if the average length of the glass fibers constituting the entire nonwoven fabric is less than iQmm, it is possible to achieve the purpose of the present invention, but the average length is less than 2n++n.
If it is less than 6, the flexibility of the nonwoven fabric will be lost, and the processing workability of the laminate will be significantly reduced. Glass nonwoven fabric used in the laminate for printed wiring boards according to the present invention - The constituent glass fiber is commonly called alkali-free glass - Is it convenient or common? - Characteristics? 9. Glass fibers of other compositions may also be used. In addition, methods for manufacturing glass fiber include cutting long fibers using melt spinning I/C↓, and using molten glass using centrifugation or steam flow! Any nvt method may be used, such as the method of pulverizing the short fibers obtained by blowing the fibers with a mixer, etc. Below, we will explain the VL examples. The amount of electricity is %.

積層板の成形に用いた樹脂に次のように準備した。Ｍ搗
固形（ｔＪ無溶剤型エポキシ樹脂（テバ社商品名ア２ル
ダイト８０１１）を加熱容器内で１１０℃で溶融液化し
、別の容器に硬化剤（日立化成、商品名ＨＮ−２２００
）とイ足進剤べ／ジルジメチルアミン（ＢＤＭＡ）ｔＱ
γ昆＠９勿を厘渦液状の状態″′Ｃ準備し７ｔｏｃｊＬ
らの容器から樹脂１００都、硬化剤６６ｓ、促進剤１．
５都となるように秤量し攪拌混合した０混甘しに樹脂４
００ｇ會準備し九〇 〈実施？Ｉ１１＞ 平均径６μｍ平均長か６ｍｍのガラス繊維で抄紙し、エ
ポキシバインダーｋ１台剤として？４たｓｚｏｍｍ角の
２００　ｇ／ｒｄ（ｔＪガラス不織布Ａり上に・上述０
混甘した樹脂４００　ｇ’ｉ・不織布　　　　　　　　
１゜υ中央部の約４００ｍｍφとなる様に流延供給しｊ
！にこの上にガラス不織布Ａ會電ねた０こり両表面に厚
さ５５μｍり銅箔と処理カラスクロスを銅箔か最表面と
７２．６ように重ね、仁ｎｔ下金型か５ｉＱｍｍＰ４υ
平盤で上金型か５１０關角平盤の内側周辺部に筒さｊ、
　ｌ　ｍｍ１幅５ｍｍの帯状の突起上進らした金型Ｖｔ
チャージし、直ちｌ’を熱圧プレスした。この時の金型
温度に下、下とも１７０℃であり、５０秒間で型締め全
行ない黙諾ＶＬかかる最＾圧カフ０鞄／−で５分間成形
した。The resin used for forming the laminate was prepared as follows. Melt and liquefy a M-solid (tJ solvent-free epoxy resin (trade name: Aldite 8011, manufactured by Teva Corporation) at 110°C in a heating container, and add a curing agent (Hitachi Chemical, trade name: HN-2200) to a separate container.
) and the stimulant be/zyldimethylamine (BDMA) tQ
γkon @ 9 Nuru vortex liquid state''C Prepare 7tocjL
100 resin, 66 s hardener, 1 accelerator from the container.
Weighed and stirred to make 5 parts, mixed 0 parts with 4 parts of resin.
Prepare for 00g meeting and conduct 90? I11> Paper is made from glass fiber with an average diameter of 6 μm and an average length of 6 mm, and used as an epoxy binder K1 agent? 4 szomm square 200 g/rd (on top of tJ glass nonwoven fabric A)
Sweetened resin 400 g'i/non-woven fabric
1゜υCentral part has a diameter of approximately 400mm.
! Layer 55 μm thick copper foil and treated crow cloth on both surfaces of the glass nonwoven fabric A and the treated glass cloth on top of the copper foil or the outermost surface, and place 5iQmm P4υ on the bottom mold.
With a flat plate, insert a tube into the upper mold or the inner periphery of the 510 square plate.
l Mold Vt advanced over a band-shaped protrusion with a width of 5 mm
After charging, l' was immediately hot pressed. At this time, the mold temperature was 170° C. for both the lower and lower molds, and molding was carried out for 5 minutes at the maximum pressure cuff 0 bag/-, which required full mold clamping in 50 seconds.

傅らｎた積層板の加工性とスルーホールの信頼性に表１
に示す通りであって、いｆｎも従来のガラス不織布基材
積層板と比較して優ｎていることがわかる。Table 1 shows the processability of the laminate and the reliability of through holes.
As shown in Fig. 2, it can be seen that fn is also superior to that of the conventional glass nonwoven fabric base laminate.

〈実施例２〉 平均径９μｍで平均長が１３ｍｍυＥガ２ス繊維全２ス
繊維會全平均長か６ｍｍで平均径か６μｍのＥガラス繊
維を全体Ｃ１Ｊ７０％となる様に混合したガラス＃！慎
平均径４．８　ｔｔｍ　３ｆ！−均長８．１　ｆｌｌｌ
ｙｃ抄紙し、エポキシバインダー上箱合剤として得た５
２父州角の２００　ｇ／ｒｎ”ＱＪガ２ス不絨布を実施
例１と同様の方法で成形し積層板を得九〇ただし、型締
め時間ｒＩ５０秒で実施例１と比べて短かくすることか
できた。<Example 2> E glass fibers with an average diameter of 9 μm and an average length of 13 mm υ E glass fibers with a total average length of 6 mm and an average diameter of 6 μm were mixed so that the total C1J was 70% #! Shinken average diameter 4.8 ttm 3f! -Uniform length 8.1 flll
5 obtained by making yc paper and using an epoxy binder upper box mixture.
A laminate was obtained by molding a 200 g/rn" QJ gas nonwoven fabric with a 2-inch diameter in the same manner as in Example 1. However, the mold clamping time rI was 50 seconds, which was shorter than in Example 1. I was able to do something.

積層板り〃ロエ性と特性に表１に示ｆ通りでめりて、平
均径か９μｍで平均長さが１５ｍｍのＥガラス繊ｍＶ）
蓋を全体の繊維の５０％まで増加させても、加工性おＬ
び時性共、従来のガラス不織布基材積層板と比べて良好
であることかわアク為６０ 〈比較例１〉 平均径５μｍ平均長か６ｍｍ以下（ｔ、）Ｅ　ｊｊ　９
　、＜繊維に、平均径か９μｍで平均長か１６闘υＥガ
ラス繊維を！ｉｔ割台で４０％となる工うＶＣ−ｍ台し
たガラス繊維（平均径５．４μｍ、平均長８．８市）で
抄紙し、エポキシバインダーを粕台剤として得７ｔ５２
０ｍｌｎ角の２００　ｇ／ｍ”のガラス不織布ｔ−実施
例２と同様の方法で成形し積層板上！また・倚ら２″Ｌ
７を積層板の加工性および特性ｔｑ表ＩＫ示す通りで、
平均長か１５ｍｍＣＬ）Ｅガラス繊維の比率かＱ＜ｎる
と、レジ／リセッシｙンの発生率が高くなり、はんだ耐
熱性も劣るＣとがわかる◎ 〈比較？ｌＪ２＞ 平均径か９μｍ′ｔ″平均長か１５ｒｎｍυＥガンス繊
Ｍのみで抄紙した従来のガラス不織布を使用して実施例
１と同様の方法′ｃｒＪｙ、形し７’Ｃ槓層板の特性を
表１に参考の＾め示した。Laminated board (E glass fiber mV with an average diameter of 9 μm and an average length of 15 mm)
Even if the lid is increased to 50% of the total fiber, the processability is still low.
Comparative example 1 Average diameter: 5 μm Average length: 6 mm or less (t,) E jj 9
, <For the fibers, use glass fibers with an average diameter of 9 μm and an average length of 16 mm! Paper was made using glass fibers (average diameter 5.4 μm, average length 8.8 mm) processed on a VC-m machine that was 40% on an IT machine, and an epoxy binder was used as a lees base agent to obtain 7t52.
0 mln square 200 g/m" glass non-woven fabric T - Molded in the same manner as in Example 2 and placed on a laminate board! Also, 2" L
7 is the processability and characteristics of the laminate as shown in Table IK,
If the average length is 15mm (CL) E or the ratio of glass fiber is Q < n, the incidence of registration/recession will be high and the soldering heat resistance will be inferior to C. ◎ <Comparison? lJ2> Average diameter: 9 μm′t″ Average length: 15 nmυE A conventional glass nonwoven fabric made of only E Gans fiber M was used and shaped using the same method as in Example 1. 1 is provided for reference.

表１　積層板り特性 ＊Ｌ　金ｍ′ｔ１打抜い丸穴り壁粗畜をＩＩＩ黴鋺で観
察し魁＊１　スルーホールメッキした姦Ｏ閤角の基板を
１８１１℃のはんだ箔にてはんだ嬶げをし、スルーホー
ル断面【顕ＩＩ鏑にで観察しメッキ壁と基板の樹脂Ｍと
のはがれの長さを−ＩＬＵ下の０真で発生率を算出した
。Table 1 Laminated board characteristics*L Gold m't1 Punched round hole wall roughness was observed with III molding machine *1 Through-hole plated board with 100° angle was soldered with solder foil at 1811°C. The length of peeling between the plated wall and the resin M of the substrate was determined by observing the cross section of the through-hole with a microscope II and calculating the occurrence rate using the zero true value under -ILU.

１　鋼重”げ″′ｎ除去し１層Ｍ”°ら６０−幀片を採
堆１水蒸気１”′１・８２々　　　　　１（１２１℃）
Ｏ圧力がｔ中で１時間ｌ１ｋＩＩＩ＆履したあと、２ｓ
８℃の社んだ浴ｌ！：所定時間の開演を行ない、外観の
変化を調べ丸。1. Remove the steel weight and collect 1 layer of M"° 60-layer strips. 1. Steam 1.82" (121℃).
After 1 hour of l1kIII & wear at O pressure t, 2s
A bath at 8℃! : Start the show at the specified time and check for changes in appearance.

以上に貌明したＬうＩｃ、不発明り積層板に加工性およ
び特性に優ｒしており従来問題とさ才していたレジンリ
セッシ冒ン現象やａんたｌ１ｌｌｔ熱性を解決するもの
でめった。The above-mentioned LIC has superior workability and properties to the uninvented laminate, and has been found to be able to solve the conventional problems of resin recess failure and thermal properties.

９２Ａ92A

Claims (1)

【特許請求の範囲】 １、平均径か１２ｍ以上５゛μｍ以上で平均長さか２ｍ
ｍ以上１Ｑｍｍ以下ｃＬＪガ２ス繊維で構成さｎるガラ
ス不織布′（Ｉ−ＰＰＪ硬化性樹脂と共に成形して得ら
ｎる印刷配線板用積層板。 ２、ガラス不織布が、平均長さか１５ｍｍ以上２５ｍｍ
以下のガラス繊維を混付したものであることｔ−待機と
する特許請求の範囲第１項に記載の印刷配線板用積層板
。[Claims] 1. Average diameter is 12 m or more and 5 μm or more and average length is 2 m.
A glass nonwoven fabric composed of LJ gas fibers with a length of 1 Qmm or more and a printed wiring board laminate obtained by molding with an I-PPJ curable resin. 2. The glass nonwoven fabric has an average length of 15 mm or more. 25mm
The laminate for a printed wiring board according to claim 1, wherein the laminate for a printed wiring board is made of a material mixed with the following glass fibers.