JPS57129710A - Molds for forming resin seal for insert - Google Patents

Molds for forming resin seal for insert

Info

Publication number
JPS57129710A
JPS57129710A JP1507681A JP1507681A JPS57129710A JP S57129710 A JPS57129710 A JP S57129710A JP 1507681 A JP1507681 A JP 1507681A JP 1507681 A JP1507681 A JP 1507681A JP S57129710 A JPS57129710 A JP S57129710A
Authority
JP
Japan
Prior art keywords
cavity
insert
resin
roughness
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1507681A
Other languages
Japanese (ja)
Other versions
JPH0159085B2 (en
Inventor
Shigeharu Tsunoda
Junichi Saeki
Aizo Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1507681A priority Critical patent/JPS57129710A/en
Publication of JPS57129710A publication Critical patent/JPS57129710A/en
Publication of JPH0159085B2 publication Critical patent/JPH0159085B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/372—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To raise the releasing property, moisture resistant reliability, etc., of molding by applying an aventurine finishing with a specific range of max. roughness to the surface of the cavity of molds for forming a resin seal for an insert. CONSTITUTION:An insert, e.g., a lead frame 11 bonded with a semiconductor pellet 10, is beforehand put in a cavity 8 formed by an upper mold 4 and a lower mold 5, and then molten resin 1 is charged into the cavity 8 to seal up the lead frame 11 with the resin. In this case, a smoothly but undulately surfaced aventurine face with a max. surface roughness (Hmax) of 5-15mum is provided to the surface of the cavity 8 in such a way that the differences in the center value and the upper limit value of the roughness become 2mum or less by the upper mold face and the lower mold face of the cavity 8. Thus, the difference in the separability between the upper mold and the lower mold is smaller and the delamination in the interface between the insert and the resin can be prevented.
JP1507681A 1981-02-05 1981-02-05 Molds for forming resin seal for insert Granted JPS57129710A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1507681A JPS57129710A (en) 1981-02-05 1981-02-05 Molds for forming resin seal for insert

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1507681A JPS57129710A (en) 1981-02-05 1981-02-05 Molds for forming resin seal for insert

Publications (2)

Publication Number Publication Date
JPS57129710A true JPS57129710A (en) 1982-08-11
JPH0159085B2 JPH0159085B2 (en) 1989-12-14

Family

ID=11878754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1507681A Granted JPS57129710A (en) 1981-02-05 1981-02-05 Molds for forming resin seal for insert

Country Status (1)

Country Link
JP (1) JPS57129710A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03218055A (en) * 1990-01-23 1991-09-25 Matsushita Electron Corp Resin sealed semiconductor package
JPH05147045A (en) * 1991-12-02 1993-06-15 Enplas Corp Method for producing rough surface forming mold

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03218055A (en) * 1990-01-23 1991-09-25 Matsushita Electron Corp Resin sealed semiconductor package
JPH05147045A (en) * 1991-12-02 1993-06-15 Enplas Corp Method for producing rough surface forming mold

Also Published As

Publication number Publication date
JPH0159085B2 (en) 1989-12-14

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