JPS57129710A - Molds for forming resin seal for insert - Google Patents
Molds for forming resin seal for insertInfo
- Publication number
- JPS57129710A JPS57129710A JP1507681A JP1507681A JPS57129710A JP S57129710 A JPS57129710 A JP S57129710A JP 1507681 A JP1507681 A JP 1507681A JP 1507681 A JP1507681 A JP 1507681A JP S57129710 A JPS57129710 A JP S57129710A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- insert
- resin
- roughness
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
- B29C45/372—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To raise the releasing property, moisture resistant reliability, etc., of molding by applying an aventurine finishing with a specific range of max. roughness to the surface of the cavity of molds for forming a resin seal for an insert. CONSTITUTION:An insert, e.g., a lead frame 11 bonded with a semiconductor pellet 10, is beforehand put in a cavity 8 formed by an upper mold 4 and a lower mold 5, and then molten resin 1 is charged into the cavity 8 to seal up the lead frame 11 with the resin. In this case, a smoothly but undulately surfaced aventurine face with a max. surface roughness (Hmax) of 5-15mum is provided to the surface of the cavity 8 in such a way that the differences in the center value and the upper limit value of the roughness become 2mum or less by the upper mold face and the lower mold face of the cavity 8. Thus, the difference in the separability between the upper mold and the lower mold is smaller and the delamination in the interface between the insert and the resin can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1507681A JPS57129710A (en) | 1981-02-05 | 1981-02-05 | Molds for forming resin seal for insert |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1507681A JPS57129710A (en) | 1981-02-05 | 1981-02-05 | Molds for forming resin seal for insert |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57129710A true JPS57129710A (en) | 1982-08-11 |
JPH0159085B2 JPH0159085B2 (en) | 1989-12-14 |
Family
ID=11878754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1507681A Granted JPS57129710A (en) | 1981-02-05 | 1981-02-05 | Molds for forming resin seal for insert |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57129710A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03218055A (en) * | 1990-01-23 | 1991-09-25 | Matsushita Electron Corp | Resin sealed semiconductor package |
JPH05147045A (en) * | 1991-12-02 | 1993-06-15 | Enplas Corp | Method for producing rough surface forming mold |
-
1981
- 1981-02-05 JP JP1507681A patent/JPS57129710A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03218055A (en) * | 1990-01-23 | 1991-09-25 | Matsushita Electron Corp | Resin sealed semiconductor package |
JPH05147045A (en) * | 1991-12-02 | 1993-06-15 | Enplas Corp | Method for producing rough surface forming mold |
Also Published As
Publication number | Publication date |
---|---|
JPH0159085B2 (en) | 1989-12-14 |
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