JPS5683062A - Photo-semiconductor device - Google Patents
Photo-semiconductor deviceInfo
- Publication number
- JPS5683062A JPS5683062A JP16024679A JP16024679A JPS5683062A JP S5683062 A JPS5683062 A JP S5683062A JP 16024679 A JP16024679 A JP 16024679A JP 16024679 A JP16024679 A JP 16024679A JP S5683062 A JPS5683062 A JP S5683062A
- Authority
- JP
- Japan
- Prior art keywords
- transmitting resin
- light transmitting
- resin layer
- groove
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 8
- 229920005989 resin Polymers 0.000 abstract 8
- 230000007423 decrease Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
PURPOSE:To remove thermal distortion and molding distortion generated between a light transmitting resin layer and a non-light transmitting resin layer laminated and covered on the layer, prevent the disconnection of wires and improve an airtight property by boring a groove at the interface side at which the light transmitting resin layer contacts with the non-light transmitting resin layer. CONSTITUTION:A light receiving element 1 and an active circuit element 2 are separately mounted to a lead frame 3 with a floor section of a disposing base, and connected by means of bonding wires 4. A light transmitting resin layer 15 is formed so as to make up a groove 10a between the light receiving element 1 and the active circuit element 2. A transfer mold is executed on the light receiving element 1 with non-light transmitting resin leaving a window 7, a non-light transmitting resin layer 6 is laminated, the lead frame is cut, and the layer 6 is molded. Thus, since the groove 10a formed to the light transmitting resin layer disperses and decreases distortion generated due to the difference of thermal expansivity, the disconnection of the bonding wires is prevented, and an airtight property can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16024679A JPS5683062A (en) | 1979-12-12 | 1979-12-12 | Photo-semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16024679A JPS5683062A (en) | 1979-12-12 | 1979-12-12 | Photo-semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5683062A true JPS5683062A (en) | 1981-07-07 |
JPS621251B2 JPS621251B2 (en) | 1987-01-12 |
Family
ID=15710850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16024679A Granted JPS5683062A (en) | 1979-12-12 | 1979-12-12 | Photo-semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5683062A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6012777A (en) * | 1983-07-01 | 1985-01-23 | Matsushita Electric Ind Co Ltd | Photoconductive element |
JPS61159751A (en) * | 1984-12-29 | 1986-07-19 | Sumitomo Electric Ind Ltd | Manufacture of optical signal apparatus |
JPH0546057U (en) * | 1991-11-18 | 1993-06-18 | 和泉電気株式会社 | LED display device |
JP2004363454A (en) * | 2003-06-06 | 2004-12-24 | Stanley Electric Co Ltd | Reliable optical semiconductor device |
US6885109B2 (en) * | 2001-08-21 | 2005-04-26 | Oki Electric Industry Co., Ltd. | Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same |
JP2007096325A (en) * | 2005-09-29 | 2007-04-12 | Osram Opto Semiconductors Gmbh | Radiation emission constituting element |
-
1979
- 1979-12-12 JP JP16024679A patent/JPS5683062A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6012777A (en) * | 1983-07-01 | 1985-01-23 | Matsushita Electric Ind Co Ltd | Photoconductive element |
JPS61159751A (en) * | 1984-12-29 | 1986-07-19 | Sumitomo Electric Ind Ltd | Manufacture of optical signal apparatus |
JPH0546057U (en) * | 1991-11-18 | 1993-06-18 | 和泉電気株式会社 | LED display device |
US6885109B2 (en) * | 2001-08-21 | 2005-04-26 | Oki Electric Industry Co., Ltd. | Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same |
JP2004363454A (en) * | 2003-06-06 | 2004-12-24 | Stanley Electric Co Ltd | Reliable optical semiconductor device |
JP2007096325A (en) * | 2005-09-29 | 2007-04-12 | Osram Opto Semiconductors Gmbh | Radiation emission constituting element |
Also Published As
Publication number | Publication date |
---|---|
JPS621251B2 (en) | 1987-01-12 |
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