JPS56111225A - X ray exposuring device - Google Patents
X ray exposuring deviceInfo
- Publication number
- JPS56111225A JPS56111225A JP1122680A JP1122680A JPS56111225A JP S56111225 A JPS56111225 A JP S56111225A JP 1122680 A JP1122680 A JP 1122680A JP 1122680 A JP1122680 A JP 1122680A JP S56111225 A JPS56111225 A JP S56111225A
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- marks
- ray
- wafer
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To make it possible to conduct positioning with high precision, by measuring the X ray amount using pattern asymmetric to the positioning mark. CONSTITUTION:As generally known, marks 24 on a wafer 23 correspond to marks 22 on a mask 21. The precise positioning can be ascertained by identical amount of X rays that are radiated on the mask passed through on the left and the right side and detected 25. In the present method, the shape of the marks are asymmetric. When positioning matches, an Au mark 31 on the mask falls on a mark 32 on the wafer precisely. The marks on the right side likewise fall on each other precisely. The X rays pass through the penetration region 100 and are measured. Measurement on both sides are identical. If the positioning is not precise, the X ray penetration regions below the left and right marks are 101, 101' respectively, not identical. The difference is returned back to the driving system of the wafer so that the measurement on both sides are identical. With such an arrangement, positioning by the X ray flux that has been not feasible hitherto can be made possible to the copying the ultra fine patterns.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1122680A JPS56111225A (en) | 1980-02-01 | 1980-02-01 | X ray exposuring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1122680A JPS56111225A (en) | 1980-02-01 | 1980-02-01 | X ray exposuring device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56111225A true JPS56111225A (en) | 1981-09-02 |
JPS6212657B2 JPS6212657B2 (en) | 1987-03-19 |
Family
ID=11772035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1122680A Granted JPS56111225A (en) | 1980-02-01 | 1980-02-01 | X ray exposuring device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56111225A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175859A (en) * | 1987-01-16 | 1988-07-20 | Ushio Inc | Exposure system for production of liquid crystal substrate |
JPH0218924A (en) * | 1988-05-13 | 1990-01-23 | Mrs Technol Inc | Optical aligner with low reflection error for photolithography |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51147264A (en) * | 1975-06-13 | 1976-12-17 | Fujitsu Ltd | High-precision positioning system |
JPS53144681A (en) * | 1977-05-20 | 1978-12-16 | Siemens Ag | Method of relatively positioning projecting mask and semiconductor wafer |
-
1980
- 1980-02-01 JP JP1122680A patent/JPS56111225A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51147264A (en) * | 1975-06-13 | 1976-12-17 | Fujitsu Ltd | High-precision positioning system |
JPS53144681A (en) * | 1977-05-20 | 1978-12-16 | Siemens Ag | Method of relatively positioning projecting mask and semiconductor wafer |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175859A (en) * | 1987-01-16 | 1988-07-20 | Ushio Inc | Exposure system for production of liquid crystal substrate |
JPH0218924A (en) * | 1988-05-13 | 1990-01-23 | Mrs Technol Inc | Optical aligner with low reflection error for photolithography |
Also Published As
Publication number | Publication date |
---|---|
JPS6212657B2 (en) | 1987-03-19 |
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