JPS55108745U - - Google Patents
Info
- Publication number
- JPS55108745U JPS55108745U JP757079U JP757079U JPS55108745U JP S55108745 U JPS55108745 U JP S55108745U JP 757079 U JP757079 U JP 757079U JP 757079 U JP757079 U JP 757079U JP S55108745 U JPS55108745 U JP S55108745U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP757079U JPS5930538Y2 (ja) | 1979-01-23 | 1979-01-23 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP757079U JPS5930538Y2 (ja) | 1979-01-23 | 1979-01-23 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55108745U true JPS55108745U (ja) | 1980-07-30 |
JPS5930538Y2 JPS5930538Y2 (ja) | 1984-08-31 |
Family
ID=28815473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP757079U Expired JPS5930538Y2 (ja) | 1979-01-23 | 1979-01-23 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5930538Y2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60154646A (ja) * | 1984-01-25 | 1985-08-14 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
WO1986005322A1 (en) * | 1985-02-28 | 1986-09-12 | Sony Corporation | Semiconducteur circuit device |
-
1979
- 1979-01-23 JP JP757079U patent/JPS5930538Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60154646A (ja) * | 1984-01-25 | 1985-08-14 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
WO1986005322A1 (en) * | 1985-02-28 | 1986-09-12 | Sony Corporation | Semiconducteur circuit device |
Also Published As
Publication number | Publication date |
---|---|
JPS5930538Y2 (ja) | 1984-08-31 |