JPS5218659U - - Google Patents
Info
- Publication number
- JPS5218659U JPS5218659U JP1975104025U JP10402575U JPS5218659U JP S5218659 U JPS5218659 U JP S5218659U JP 1975104025 U JP1975104025 U JP 1975104025U JP 10402575 U JP10402575 U JP 10402575U JP S5218659 U JPS5218659 U JP S5218659U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1975104025U JPS5218659U (ja) | 1975-07-25 | 1975-07-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1975104025U JPS5218659U (ja) | 1975-07-25 | 1975-07-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5218659U true JPS5218659U (ja) | 1977-02-09 |
Family
ID=28585396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1975104025U Pending JPS5218659U (ja) | 1975-07-25 | 1975-07-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5218659U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59115853U (ja) * | 1983-01-25 | 1984-08-04 | 川崎重工業株式会社 | エアクリ−ナ |
JPS59121466U (ja) * | 1983-02-03 | 1984-08-16 | 富士重工業株式会社 | エアクリ−ナ |
JPS6073869U (ja) * | 1983-10-27 | 1985-05-24 | 本田技研工業株式会社 | 自動二輪車のエアクリ−ナ構造 |
-
1975
- 1975-07-25 JP JP1975104025U patent/JPS5218659U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59115853U (ja) * | 1983-01-25 | 1984-08-04 | 川崎重工業株式会社 | エアクリ−ナ |
JPS59121466U (ja) * | 1983-02-03 | 1984-08-16 | 富士重工業株式会社 | エアクリ−ナ |
JPS6313417Y2 (ja) * | 1983-02-03 | 1988-04-15 | ||
JPS6073869U (ja) * | 1983-10-27 | 1985-05-24 | 本田技研工業株式会社 | 自動二輪車のエアクリ−ナ構造 |