JPS52106678A - Resin sealed type semiconductor device - Google Patents
Resin sealed type semiconductor deviceInfo
- Publication number
- JPS52106678A JPS52106678A JP2329976A JP2329976A JPS52106678A JP S52106678 A JPS52106678 A JP S52106678A JP 2329976 A JP2329976 A JP 2329976A JP 2329976 A JP2329976 A JP 2329976A JP S52106678 A JPS52106678 A JP S52106678A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- sealed type
- resin sealed
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent a pellet of a sealed type device sealed with resin from cracking by coating elastic material at a part of the side part on the surface of a header in a semiconductor pellet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2329976A JPS5942457B2 (en) | 1976-03-05 | 1976-03-05 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2329976A JPS5942457B2 (en) | 1976-03-05 | 1976-03-05 | Resin-encapsulated semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52106678A true JPS52106678A (en) | 1977-09-07 |
JPS5942457B2 JPS5942457B2 (en) | 1984-10-15 |
Family
ID=12106711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2329976A Expired JPS5942457B2 (en) | 1976-03-05 | 1976-03-05 | Resin-encapsulated semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5942457B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57125542U (en) * | 1981-01-30 | 1982-08-05 |
-
1976
- 1976-03-05 JP JP2329976A patent/JPS5942457B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57125542U (en) * | 1981-01-30 | 1982-08-05 |
Also Published As
Publication number | Publication date |
---|---|
JPS5942457B2 (en) | 1984-10-15 |
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