JPS4947564U - - Google Patents
Info
- Publication number
- JPS4947564U JPS4947564U JP1972090177U JP9017772U JPS4947564U JP S4947564 U JPS4947564 U JP S4947564U JP 1972090177 U JP1972090177 U JP 1972090177U JP 9017772 U JP9017772 U JP 9017772U JP S4947564 U JPS4947564 U JP S4947564U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972090177U JPS4947564U (ja) | 1972-07-31 | 1972-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972090177U JPS4947564U (ja) | 1972-07-31 | 1972-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4947564U true JPS4947564U (ja) | 1974-04-25 |
Family
ID=28277259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972090177U Pending JPS4947564U (ja) | 1972-07-31 | 1972-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4947564U (ja) |
-
1972
- 1972-07-31 JP JP1972090177U patent/JPS4947564U/ja active Pending