JPH0746978Y2 - Electronic component mounting structure - Google Patents
Electronic component mounting structureInfo
- Publication number
- JPH0746978Y2 JPH0746978Y2 JP1988028028U JP2802888U JPH0746978Y2 JP H0746978 Y2 JPH0746978 Y2 JP H0746978Y2 JP 1988028028 U JP1988028028 U JP 1988028028U JP 2802888 U JP2802888 U JP 2802888U JP H0746978 Y2 JPH0746978 Y2 JP H0746978Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electrode
- mounting
- board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、圧電部品その他の電子部品を、回路基板に実
装するための実装構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a mounting structure for mounting a piezoelectric component and other electronic components on a circuit board.
第2図は上記のような電子部品の一例としての従来の厚
みスベリ振動型(エネルギとじこめ型)の圧電部品の構
造を示すものである。このような圧電部品1の場合、セ
ラミック基板2の表裏両面に電極3a及び3bが形成され、
両電極3a及び3bの対向する部分が共振部4を構成してい
る。各電極3a及び3bには、それぞれリード端子5a及び5b
が半田付けされており、これらリード端子5a,5bと各電
極3a,3bとの接続部を含んで圧電部品1全体が樹脂被覆
6によりモールドされている。FIG. 2 shows the structure of a conventional thickness sliding vibration type (energy binding type) piezoelectric component as an example of the electronic component as described above. In the case of such a piezoelectric component 1, electrodes 3a and 3b are formed on both front and back surfaces of the ceramic substrate 2,
The opposing portions of both electrodes 3a and 3b form a resonance section 4. Lead electrodes 5a and 5b are provided on the electrodes 3a and 3b, respectively.
Are soldered, and the entire piezoelectric component 1 is molded by the resin coating 6 including the connecting portions between the lead terminals 5a and 5b and the electrodes 3a and 3b.
このような圧電部品1では、上記リード端子5a及び5bを
回路基板の端子に差し込むか、半田付けして用いるもの
であり、その背高Hが大きいため、例えばICカード等の
ような回路基板に実装する場合、回路基板が厚くなりす
ぎるという問題点がある。In such a piezoelectric component 1, the lead terminals 5a and 5b are used by inserting them into the terminals of the circuit board or by soldering them. Since their height H is large, they can be used for circuit boards such as IC cards. When mounting, there is a problem that the circuit board becomes too thick.
そのため、近年、第3図及び第4図に示すような圧電部
品7が開発されている。Therefore, in recent years, the piezoelectric component 7 as shown in FIGS. 3 and 4 has been developed.
この場合、取付基板8の片面側に一定の間隔をおいて、
基板電極9a及び9bが形成されており、これらの基板電極
9a,9b上に圧電素子10が電気的に結合されている。圧電
素子10はセラミック基板11と、その表面及び裏面側に形
成された電極12a,12bより構成され、通常上記振動電極1
2aが基板電極9aに、また電極12bが基板電極9bにそれぞ
れ半田付けされる。In this case, with a certain space on one side of the mounting substrate 8,
Substrate electrodes 9a and 9b are formed, and these substrate electrodes
A piezoelectric element 10 is electrically coupled on 9a and 9b. The piezoelectric element 10 is composed of a ceramic substrate 11 and electrodes 12a and 12b formed on the front surface and the back surface side of the ceramic substrate 11.
2a is soldered to the substrate electrode 9a, and electrode 12b is soldered to the substrate electrode 9b.
更に上記取付基板8の上面には、上記圧電素子10を内蔵
するように枠体13が接着され、枠体13上に蓋板14が接着
されることによって、上記圧電素子10が密封される。上
記枠体13及び蓋板14によって絶縁性カバーが形成されて
いる。Further, a frame 13 is adhered to the upper surface of the mounting substrate 8 so as to house the piezoelectric element 10, and a cover plate 14 is adhered onto the frame 13 to seal the piezoelectric element 10. An insulating cover is formed by the frame body 13 and the cover plate 14.
このような圧電部品7では、取付基板8に沿って圧電素
子10が取り付けられているため、圧電部品7の背高hを
小さくでき、回路基板全体の薄形化を図ることが可能で
ある。In such a piezoelectric component 7, since the piezoelectric element 10 is attached along the attachment substrate 8, the height h of the piezoelectric component 7 can be reduced, and the overall thickness of the circuit board can be reduced.
上記のような圧電部品7を回路基板15に取り付けた状態
が第5図及び第6図に示されている。A state in which the above-described piezoelectric component 7 is attached to the circuit board 15 is shown in FIGS. 5 and 6.
第5図に示した取付構造は、取付基板8上の基板電極9a
及び9bが取付基板8の片表面のみに形成されている場合
で、この場合には、回路基板15表面の回路基板電極16
と、基板電極9a,9bとを電気的に接合する半田17を図示
の如く大きく盛らなければならず、せっかく圧電部品7
の背高hを小さくしても、半田17の高さh′が圧電部品
7の背高hを越えてしまうことになり、回路基板全体の
薄形化にとって弊害となるものであった。The mounting structure shown in FIG. 5 has a substrate electrode 9a on the mounting substrate 8.
And 9b are formed only on one surface of the mounting board 8, in this case, the circuit board electrode 16 on the surface of the circuit board 15
, And the solder 17 for electrically connecting the substrate electrodes 9a and 9b to each other must be largely laid up as shown in the drawing.
Even if the height h is reduced, the height h'of the solder 17 exceeds the height h of the piezoelectric component 7, which is a hindrance to the thinning of the entire circuit board.
また、第6図に示した電子部品7′では、半田17′の肉
盛りを少なくするように基板電極9a及び9bを取付基板8
の端面にまで伸ばしたものであるが、この場合、上記取
付基板8の端面に電極を形成する必要があり、コスト高
となる問題点があるばかりでなく、上記端面に形成した
電極の幅が狭いために、半田17′の信頼性にも問題があ
った。In the electronic component 7'shown in FIG. 6, the board electrodes 9a and 9b are attached to the mounting board 8 so as to reduce the buildup of the solder 17 '.
However, in this case, it is necessary to form an electrode on the end surface of the mounting substrate 8 and there is a problem that the cost becomes high, and the width of the electrode formed on the end surface is increased. Since it is narrow, there is a problem in the reliability of the solder 17 '.
従って、本考案が目的とするところは、回路基板全体の
薄形化を図り得ると共にコスト高とならず、また半田の
信頼性の低下しない電子部品の実装構造を提供すること
である。Therefore, it is an object of the present invention to provide an electronic component mounting structure which can reduce the thickness of the entire circuit board, does not increase the cost, and does not reduce the reliability of the solder.
上記目的を達成するために、本考案が採用する主たる手
段は、その要旨とするところが、取付基板の片面側に形
成された基板電極上に、この基板電極に接続される圧電
素子を内蔵した絶縁性カバーが該基板電極の端部表面を
外部に露出させるようにして取り付けられてなる電子部
品を回路基板に実装するための構造において、上記取付
基板の基板電極側が回路基板の表面に対向するように上
記絶縁性カバーを回路基板上に載置し、この回路基板上
の回路基板電極とこの回路基板電極に上記絶縁性カバー
が介在することにより形成された間隙を介して対向する
上記基板電極の外部に露出した端部表面とを、導電接合
剤を付与することにより電気的に接合してなる点に係る
電子部品の実装構造である。In order to achieve the above-mentioned object, the main means adopted by the present invention is the gist of the invention, in which a piezoelectric element connected to the substrate electrode is embedded on the substrate electrode formed on one side of the mounting substrate. In a structure for mounting an electronic component on a circuit board, in which a flexible cover is mounted so that the end surface of the board electrode is exposed to the outside, the board electrode side of the mounting board faces the surface of the circuit board. The insulative cover is placed on a circuit board, and the circuit board electrodes on the circuit board and the board electrodes facing each other through a gap formed by interposing the insulative cover on the circuit board electrodes. It is a mounting structure of an electronic component according to a point in which an end surface exposed to the outside is electrically joined by applying a conductive bonding agent.
この考案では上記のように、表面に基板電極の形成され
た取付基板を有する電子部品が、従来の実装構造と比べ
て反対向きに回路基板上に取り付けられるので、回路基
板上の回路基板電極と、取付基板上の基板電極が絶縁性
カバーの厚みの分のスペースを介して対向することにな
り、両電極間にリフロー半田づけ法等の電気的接合手法
により導電接合剤としての半田を付与することにより、
該半田はこのスペース間にしみ込むように注入され、強
固な電気的接合が得られる。そして、回路基板の基板電
極と取付基板の基板電極とで上/下面が規制されること
により上記半田が盛り上がるような不都合がなく、電子
部品の厚みを越えて回路基板の厚さが大きくなることは
ない。即ち、電子部品の実装時には、回路基板と電子部
品の厚み分以下にその寸法を収めることができ、回路基
板全体の高さ(厚み)を低くすることができる。In this invention, as described above, the electronic component having the mounting substrate on which the substrate electrode is formed is mounted on the circuit board in the opposite direction as compared with the conventional mounting structure. , The board electrodes on the mounting board face each other through a space corresponding to the thickness of the insulating cover, and solder as a conductive bonding agent is applied between the electrodes by an electric bonding method such as a reflow soldering method. By
The solder is injected so as to permeate between the spaces, and a strong electrical connection is obtained. The upper and lower surfaces are regulated by the board electrode of the circuit board and the board electrode of the mounting board, so that the solder does not rise and the thickness of the circuit board increases beyond the thickness of the electronic component. There is no. That is, at the time of mounting the electronic component, it is possible to keep the dimensions within the thickness of the circuit board and the electronic component and reduce the height (thickness) of the entire circuit board.
続いて第1図を参照して本考案を具体化した実施例に付
き説明し、本考案の理解に供する。ここに第1図は本考
案の一実施例に係る電子部品の実装構造を示す正断面図
である。Subsequently, an embodiment of the present invention will be described with reference to FIG. 1 to provide an understanding of the present invention. FIG. 1 is a front sectional view showing an electronic component mounting structure according to an embodiment of the present invention.
尚、以下の実施例は本考案の一具体例に過ぎず、本考案
の技術的範囲を限定する性格のものではない。It should be noted that the following embodiments are merely specific examples of the present invention, and do not limit the technical scope of the present invention.
第1図に示したように、この実施例に係る圧電部品7
は、第3図及び第4図に示した厚みスベリ型(エネルギ
とじこめ型)圧電素子が採用され、取付基板8の片面側
に圧電素子10が基板電極9a,9bを介して接続され、圧電
素子10は枠体13及び蓋板14よりなる絶縁性カバーにより
覆われている。As shown in FIG. 1, the piezoelectric component 7 according to this embodiment.
Is a thickness sliding type (energy binding type) piezoelectric element shown in FIGS. 3 and 4, and the piezoelectric element 10 is connected to one side of the mounting substrate 8 via substrate electrodes 9a and 9b. The frame 10 is covered with an insulating cover composed of a frame 13 and a cover plate 14.
この圧電部品7は、回路基板15上にその蓋板14を回路基
板電極16に当接するように取り付けられる。即ち、基板
電極9aが回路基板15の表面に形成された回路基板電極16
に対向するように接続されている。The piezoelectric component 7 is mounted on the circuit board 15 so that the cover plate 14 is in contact with the circuit board electrodes 16. That is, the circuit board electrode 16 is formed by forming the circuit board electrode 9a on the surface of the circuit board 15.
Are connected to face each other.
そして、上記回路基板電極16と、基板電極9a,9bとはリ
フロー半田づけ法等の手法によって半田18により電気的
に接合される。このような半田18は、導電性ペースト
等、他の導電接合剤により置き換えることも可能であ
る。Then, the circuit board electrode 16 and the board electrodes 9a and 9b are electrically joined by the solder 18 by a method such as a reflow soldering method. Such solder 18 can be replaced by another conductive bonding agent such as a conductive paste.
この実施例に係る圧電部品7と回路基板15とを接続する
上記半田18は、回路基板電極16と、基板電極9a,9bとの
間にしみ込むように注入され、両電極間を強固に接続す
ると共に、第5図に示した従来装置のように圧電部品の
背高を越えて盛り上げる必要がないので、回路基板全体
の薄形化が可能となる。The solder 18 for connecting the piezoelectric component 7 and the circuit board 15 according to this embodiment is injected so as to penetrate between the circuit board electrode 16 and the board electrodes 9a and 9b, and firmly connects both electrodes. At the same time, unlike the conventional device shown in FIG. 5, it is not necessary to raise the piezoelectric component beyond the height of the piezoelectric component, so that the entire circuit board can be thinned.
本考案は以上述べたように、取付基板の片面側に形成さ
れた基板電極上に、この基板電極に接続される圧電素子
を内蔵した絶縁性カバーが該基板電極の端部表面を外部
に露出させるようにして取り付けられてなる電子部品を
回路基板に実装するための構造において、上記取付基板
の基板電極側が回路基板の表面に対向するように上記絶
縁性カバーを回路基板上に載置し、この回路基板上の回
路基板電極とこの回路基板電極に上記絶縁性カバーが介
在することにより形成された間隙を介して対向する上記
基板電極の外部に露出した端部表面とを、導電接合剤を
付与することにより電気的に接合してなることを特徴と
する電子部品の実装構造であるから、回路基板全体の薄
形化を図り得ると共に、特殊な電極構造を用いることに
よるコストアップになることなく、また、回路基板電極
と基板電極との間の電気的接合の信頼性を向上させるこ
とができる。As described above, according to the present invention, on the board electrode formed on one side of the mounting board, the insulating cover having the piezoelectric element connected to the board electrode exposes the end surface of the board electrode to the outside. In a structure for mounting an electronic component mounted so as to be mounted on a circuit board, the insulating cover is placed on the circuit board so that the board electrode side of the mounting board faces the surface of the circuit board, A circuit board electrode on the circuit board and an end surface exposed to the outside of the board electrode facing the circuit board electrode with a gap formed by interposing the insulating cover between the circuit board electrode and a conductive bonding agent Since it is a mounting structure of electronic parts characterized by being electrically joined by giving it, it is possible to reduce the thickness of the entire circuit board and increase the cost by using a special electrode structure Without being, also, it is possible to improve the reliability of the electrical connection between the circuit substrate electrode and the substrate electrode.
7……圧電部品 8……取付基板 9a,9b……基板電極 10……圧電素子 13……枠体 14……蓋板(絶縁性カバー) 15……回路基板 16……回路基板電極 18……半田 h,H……背高。 7 ... Piezoelectric component 8 ... Mounting substrate 9a, 9b ... Substrate electrode 10 ... Piezoelectric element 13 ... Frame 14 ... Lid plate (insulating cover) 15 ... Circuit board 16 ... Circuit board electrode 18 ... … Handa h, H… tall.
Claims (1)
に、この基板電極に接続される圧電素子を内蔵した絶縁
性カバーが該基板電極の端部表面を外部に露出させるよ
うにして取り付けられてなる電子部品を回路基板に実装
するための構造において、 上記取付基板の基板電極側が回路基板の表面に対向する
ように上記絶縁性カバーを回路基板上に載置し、この回
路基板上の回路基板電極とこの回路基板電極に上記絶縁
性カバーが介在することにより形成された間隙を介して
対向する上記基板電極の外部に露出した端部表面とを、
導電接合剤を付与することにより電気的に接合してなる
ことを特徴とする電子部品の実装構造。1. A substrate electrode formed on one side of a mounting substrate, wherein an insulating cover containing a piezoelectric element connected to the substrate electrode exposes an end surface of the substrate electrode to the outside. In a structure for mounting an attached electronic component on a circuit board, the insulating cover is placed on the circuit board so that the board electrode side of the mounting board faces the surface of the circuit board. A circuit board electrode and an end surface exposed to the outside of the board electrode facing the circuit board electrode through a gap formed by interposing the insulating cover,
A mounting structure for an electronic component, which is electrically bonded by applying a conductive bonding agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988028028U JPH0746978Y2 (en) | 1988-03-01 | 1988-03-01 | Electronic component mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988028028U JPH0746978Y2 (en) | 1988-03-01 | 1988-03-01 | Electronic component mounting structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01132120U JPH01132120U (en) | 1989-09-07 |
JPH0746978Y2 true JPH0746978Y2 (en) | 1995-10-25 |
Family
ID=31251039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988028028U Expired - Lifetime JPH0746978Y2 (en) | 1988-03-01 | 1988-03-01 | Electronic component mounting structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0746978Y2 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5371597A (en) * | 1976-12-08 | 1978-06-26 | Seiko Instr & Electronics Ltd | Structure and fixing method for ceramic sealed crystal unit |
JPS60141129U (en) * | 1984-02-29 | 1985-09-18 | 富士通株式会社 | Terminal structure of leadless chip carrier |
JPH0331043Y2 (en) * | 1985-03-29 | 1991-07-01 | ||
JPS62126836U (en) * | 1986-01-31 | 1987-08-12 |
-
1988
- 1988-03-01 JP JP1988028028U patent/JPH0746978Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01132120U (en) | 1989-09-07 |
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