JPH06270154A - Resin molding die and manufacture of high functional resin molded form - Google Patents
Resin molding die and manufacture of high functional resin molded formInfo
- Publication number
- JPH06270154A JPH06270154A JP8537093A JP8537093A JPH06270154A JP H06270154 A JPH06270154 A JP H06270154A JP 8537093 A JP8537093 A JP 8537093A JP 8537093 A JP8537093 A JP 8537093A JP H06270154 A JPH06270154 A JP H06270154A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- molding
- manufacture
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2907/00—Use of elements other than metals as mould material
- B29K2907/04—Carbon
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂成形用金型ならび
に該金型により高機能性樹脂、すなわちエンジニアリン
グプラスチック製成形品の製造方法に関し、特に金型温
度を低く保ちながら成形品にクラックを発生させること
なしにソリ、曲がり、ヒネリの少ない成形品を得ること
ができるエンジニアリングプラスチック成形品の製造方
法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding die and a method for producing a highly functional resin, that is, a molded article made of engineering plastic, by using the mold, and in particular, cracking the molded article while keeping the mold temperature low. The present invention relates to a method for producing an engineering plastic molded product, which can obtain a molded product with less warping, bending and twisting without being generated.
【０００２】近年、この種の高機能性樹脂は、自動車、
ＯＡ機器、家庭電気製品、工業用各種装置の構造部品等
における板金製部品やダイキャスト品等の金属製品、ガ
ラス製品等に代えて採用さることが多くなっている。こ
のエンジニアリングプラスチック成形品は、軽量でかつ
耐食性に富む等の一般的なプラスチック材料と共通する
長所に加えて、機械的強度、耐衝撃性、耐熱性、耐溶剤
性等の物理的および化学的特性が良好であるなどの特徴
がある。In recent years, high-performance resins of this kind have been used in automobiles,
It is increasingly used in place of metal products such as sheet metal parts and die cast products in structural parts of OA equipment, home electric appliances, various industrial devices, glass products and the like. In addition to the advantages common to general plastic materials such as lightweight and excellent corrosion resistance, this engineering plastic molded product has physical and chemical properties such as mechanical strength, impact resistance, heat resistance, solvent resistance, etc. Is good.
【０００３】[0003]
【従来の技術】これらエンジニアプラスチックには、ポ
リフェニレンエーテル、ポリカーボネート、ＡＢＳ／Ｐ
Ｃ等がある。このようなエンジニアプラスチックの成形
品により、工業用部品としての特徴を発揮するために
は、成形時における操作において成形品に大きな残留応
力を残さないように配慮する必要がある。2. Description of the Related Art These engineering plastics include polyphenylene ether, polycarbonate, ABS / P
There is C etc. In order to exert the characteristics of industrial parts by such engineered plastic molded products, it is necessary to take care not to leave a large residual stress in the molded products during the operation during molding.
【０００４】このため、高機能性樹脂の成形にあたって
は、成形品の形状、金型の改良、特にゲート位置、ゲー
ト数を改良すると共に、成形品の離型方法等を工夫し、
金型内に供給された溶融樹脂がスムーズに流動させると
共に、成形品を金型からスムーズに離型させる工夫がな
されていた。Therefore, when molding a high-performance resin, the shape of the molded product and the mold are improved, especially the gate position and the number of gates are improved, and the method for releasing the molded product is devised.
The molten resin supplied into the mold smoothly flows, and the molded product is smoothly released from the mold.
【０００５】従来の成形法においては、使用材料によっ
ても異なるが、金型温度を低い場合にあっても、７０℃
以上に保温して成形することが行なわれている。しかし
ながら、金型温度をこのようにかなり高温に保持して成
形を行なうことは、成形作業性に問題があり、成形さぎ
ょう問題があり、作業効率を低下させる。さらに、比較
的大きな成形品にあっては、ソリや曲がりが生じたり、
成形品の離型時に歪が生じがちであることから歩留まり
が悪くなり、結果的にコスト高となる欠点があった。In the conventional molding method, although it depends on the material used, even if the mold temperature is low, 70 ° C.
Molding is performed while keeping the temperature as above. However, if the mold temperature is maintained at such a considerably high temperature for molding, there is a problem in molding workability, there is a problem in molding, and working efficiency is reduced. Furthermore, for relatively large molded products, warping and bending may occur,
Since the molded product tends to be distorted at the time of mold release, the yield is deteriorated, resulting in a high cost.
【０００６】一方、金型温度を必要温度以下で成形する
場合、溶融樹脂が金型内に流入した際に急激に冷却固化
され、成形品内部に大きな残留応力を生じて、成形品に
クラックを発生させる場合がある。On the other hand, in the case of molding at a mold temperature below the required temperature, when the molten resin flows into the mold, it is rapidly cooled and solidified, and a large residual stress is generated inside the molded product, causing cracks in the molded product. May be generated.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、上述の従来
技術の欠点を解消すると共に、大型成形品であってもソ
リ、曲がり、ヒネリ等が生じないエンジニアリングプラ
スチックの成形品の製造方法ならびにこの方法を実施す
るに適する樹脂成形用金型を提供することを課題とす
る。DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned drawbacks of the prior art and, at the same time, a method for producing a molded article of engineering plastic which does not cause warping, bending, or twisting even in a large molded article, and An object is to provide a resin molding die suitable for carrying out the method.
【０００８】[0008]
【課題を解決するための手段】本発明は、溶融した樹脂
組成物を充填することによって、樹脂成形品を得るため
の金型において、そのキャビティ面にダイヤモンド微粒
子を分散共析させた樹脂成形用金型、ならびにキャビテ
ィ面にダイヤモンド微粒子を分散共析させた複合メッキ
被膜を形成した樹脂成形用金型のキャビティに溶融した
高機能性樹脂成形材料を供給し、金型温度１０ないし６
０℃において高機能性樹脂製成形品を成形する、高機能
製樹脂製成形品の製造方法によって解決される。DISCLOSURE OF THE INVENTION The present invention provides a mold for obtaining a resin molded product by filling a molten resin composition with resin particles for which a diamond fine particle is dispersed and co-deposited on the cavity surface. The molten high-performance resin molding material is supplied to the mold and the cavity of the resin molding mold in which the composite plating film in which the diamond fine particles are dispersed and co-deposited is formed on the cavity surface, and the mold temperature is 10 to 6
This is solved by a method for producing a highly functional resin molded product, which comprises molding a highly functional resin molded product at 0 ° C.
【０００９】[0009]
【作用】本発明にかかる樹脂成形用金型は、そのキャビ
ティ面にダイヤモンド微粒子が共析分散せしめられた複
合メッキ被膜が形成されている。このようなダイヤモン
ド微粒子を共析分散させた複合メッキ被膜は、熱伝導性
ならびに潤滑性に優れている。In the resin molding die according to the present invention, a composite plating film in which diamond fine particles are eutectically dispersed is formed on the cavity surface. The composite plating film in which such diamond fine particles are eutectoidally dispersed has excellent thermal conductivity and lubricity.
【００１０】したがって、金型を特別に保温することな
しに、溶融樹脂の保有する熱量をいち早くキャビティ面
に伝導させる。この伝熱によって、キャビティ面の温度
は、瞬間的には通常の保温金型温度より十分に高い温度
に保たれ、キャビティ面に接触する溶融樹脂の瞬間的急
冷に伴い発生する残留応力を緩和することができる。Therefore, the amount of heat held by the molten resin is quickly conducted to the cavity surface without the need to keep the mold warm. Due to this heat transfer, the temperature of the cavity surface is momentarily maintained at a temperature sufficiently higher than the normal heat retaining mold temperature, and the residual stress generated by the instantaneous rapid cooling of the molten resin contacting the cavity surface is relaxed. be able to.
【００１１】加えて、キャビティ面に共析分散されてい
るダイヤモンド微粒子本来の潤滑性により溶融樹脂のキ
ャビティ内への充填時の流動を滑らかに行なう効果があ
る。そのため、格別の保温装置等を装備することなし
に、１０ないし６０℃程度の室温の金型により、通常の
成形機により成形作業を行なうことができる。In addition, the inherent lubricity of the diamond fine particles dispersed by eutectoid on the cavity surface has the effect of smoothing the flow of the molten resin when the molten resin is filled into the cavity. Therefore, the molding work can be performed by a normal molding machine using a mold at room temperature of about 10 to 60 ° C. without equipping a special heat insulating device.
【００１２】さらに、その良好な潤滑性のために、成形
品を金型から離脱させる際の抵抗、すなわち離型抵抗が
小さいため、離型時の成形品の歪を小さくすることがで
きる。このような点からも、離型時の歪の低減が可能と
なる。Further, because of its good lubricity, the resistance when the molded product is released from the mold, that is, the mold release resistance is small, so that the distortion of the molded product at the time of mold release can be reduced. From this point as well, it is possible to reduce the strain at the time of mold release.
【００１３】また、同様の理由から離型剤の使用も省略
することができ、成形のための加工時間、すなわち成形
サイクルを短縮し、作業性の向上を図ることができる。
なお、このキャビティ面は汚れもつき難く、樹脂成形品
の色替えや樹脂種類の変更等に伴う清掃が容易となる副
次的効果も得られる。For the same reason, the use of a release agent can be omitted, the processing time for molding, that is, the molding cycle can be shortened, and the workability can be improved.
It should be noted that this cavity surface does not easily get dirty, and there is also a secondary effect that cleaning can be easily performed when the color of the resin molded product is changed or the resin type is changed.
【００１４】また、このように形成されたキャビティ面
は、そのダイヤモンド微粒子の共析分散された被膜の特
性によって、摺動性、耐摩耗性に優れており、製品寿命
を大幅に伸長することができる。Further, the cavity surface thus formed has excellent slidability and wear resistance due to the characteristics of the eutectoid-dispersed film of the diamond fine particles, and the product life can be greatly extended. it can.
【００１５】[0015]
【実施例】以下、実施例により本発明を開示する。図１
は、本発明にかかる樹脂成形用金型のキャビティ面の構
成を示す断面モデル図である。金型１０のキャビティ１
２の面には、ダイヤモンド微粒子が共析分散せしめられ
た複合メッキ被膜１４が適宜厚さに形成される。The present invention will be disclosed below with reference to examples. Figure 1
FIG. 3 is a cross-sectional model view showing a configuration of a cavity surface of a resin molding die according to the present invention. Cavity 1 of mold 10
On the second surface, a composite plating film 14 in which diamond fine particles are eutectoidally dispersed is formed in an appropriate thickness.
【００１６】ここで、金型の材質、キャビティ面の材質
等には特に制限がなく、例えばスチール、アルミニウ
ム、銅、あるいはこれらの合金等の通常の材料を使用す
ることができる。Here, the material of the mold, the material of the cavity surface, etc. are not particularly limited, and ordinary materials such as steel, aluminum, copper, or alloys thereof can be used.
【００１７】このような金型のキャビティ面に形成され
る複合メッキ被膜は、メッキ被膜母相中にダイヤモンド
微粒子が均一に共析分散され、あるいはごく表層に高濃
度に析出させたものとすることができる。この場合のダ
イヤモンド微粒子の粒径は、0.01から200μm、特に0.1
から0.5μmであって、球形のものが望ましい。また、母
相となるメッキ被膜は、ニッケル、ニッケル−リン、ニ
ッケル−コバルト等のニッケル合金、クロム、鉄、鉄合
金、銅、銅合金などのメッキ被膜とすることができる。
特に、ニッケル、ニッケル合金、クロム、クロム合金等
のメッキ被膜が好適である。In the composite plating film formed on the cavity surface of such a mold, diamond fine particles are uniformly eutectically dispersed in the matrix phase of the plating film, or are deposited in a very high concentration on the surface layer. You can In this case, the diamond fine particles have a particle size of 0.01 to 200 μm, particularly 0.1.
To 0.5 μm, and spherical shape is preferable. Further, the plating film serving as the parent phase may be a plating film of nickel, nickel alloy such as nickel-phosphorus, nickel-cobalt, etc., chromium, iron, iron alloy, copper, copper alloy or the like.
In particular, a plating film of nickel, nickel alloy, chromium, chromium alloy or the like is suitable.
【００１８】このようなメッキ被膜にダイヤモンド微粒
子が共析分散した複合メッキ被膜を形成する方法として
は、電解メッキ法を採用することも、無電解メッキ法を
採用してもよい。これらメッキ母相用の適宜メッキ液に
ダイヤモンド微粒子を懸濁させた複合メッキ液を調製
し、このメッキ液によりメッキを行なう公知の複合メッ
キ法を採用することができる。As a method for forming a composite plating film in which diamond fine particles are eutectically dispersed in such a plating film, either an electrolytic plating method or an electroless plating method may be adopted. A well-known composite plating method of preparing a composite plating solution in which diamond fine particles are suspended in an appropriate plating solution for the plating mother phase and performing plating with this plating solution can be adopted.
【００１９】この場合に形成される複合メッキ被膜中の
ダイヤモンド微粒子の量は、３から７５％（容量）、特
に５から３５％（容量）が好ましく、また、被膜厚さは
0．1から2000μm、特に15から30μm程度が好ましい。The amount of diamond fine particles in the composite plating film formed in this case is preferably 3 to 75% (volume), particularly preferably 5 to 35% (volume), and the coating thickness is
It is preferably from 0.1 to 2000 μm, and particularly preferably from 15 to 30 μm.
【００２０】本発明は、上述した複合メッキ被膜形成金
型を使用し、上述したエンジニアリングプラスチックの
溶融樹脂を射出成形などの加工法を用い、金型温度１０
から６０℃、好ましくは３０から５０℃において成形を
行なうものである。この場合、その他の成形条件は、成
形方法や成形すべきプラスチックの種類、成形品の用途
などに応じた公知の成形条件が採用可能である。また、
成形材料には樹脂成分以外に充填剤、フィラー等の成分
が添加されていてもよい。The present invention uses the above-mentioned composite plating film forming die, and uses the above-mentioned molten resin of the engineering plastic by a processing method such as injection molding to obtain a die temperature of 10
The molding is carried out at a temperature of 60 to 60 ° C, preferably 30 to 50 ° C. In this case, other molding conditions may be known molding conditions depending on the molding method, the type of plastic to be molded, the use of the molded product, and the like. Also,
In addition to the resin component, components such as a filler and a filler may be added to the molding material.
【００２１】実施例 １ リブプレートを成形するための金型のスチール製入子キ
ャビティに、公知の複合メッキ法を用いて、ニッケル−
コバルトを被メッキ母相とし、ダイヤモンド微粒子を３
５％（容量）含有させたものをメッキしたものと、メッ
キを施さないスチール製入子をそのまま使用したものと
によってそれぞれ成形を行ない、比較を行なった。成形
機には、横型射出成形機を使用し、金型温度４０℃とし
た。Example 1 A steel insert cavity of a die for forming a rib plate was nickel-plated by a known composite plating method.
Cobalt is used as the base metal for plating, and 3 diamond particles are used.
5% (capacity) content was plated, and a steel insert that was not plated was used as it was, and molding was performed for comparison. A horizontal injection molding machine was used as the molding machine, and the mold temperature was 40 ° C.
【００２２】使用樹脂は、ポリフェニレンオキサイド
で、図２及び図３に示すリブプレートを成形し、その後
１００℃で２４時間熱処理した後、クラック発生の程度
を評価した。クラックの評価は、成形開始後数ショット
を経過し、成形条件が安定したと思われる時点から同一
サイクル時間で連続で２０ショットサンプリングした。
なお、両図中のａはゲート位置を示す。The resin used was polyphenylene oxide, and the rib plates shown in FIGS. 2 and 3 were molded and then heat-treated at 100 ° C. for 24 hours, after which the degree of cracking was evaluated. For the evaluation of cracks, several shots passed after the start of molding and 20 shots were continuously sampled at the same cycle time from the time when the molding conditions seemed to be stable.
In addition, a in both figures shows a gate position.
【００２３】これらの成形品を上記条件によるエージン
グ（熱処理）を行なう前後に、１０倍のルーペにより観
察した。内容は、クラックの有無を確認すると共に、ク
ラックの大きいものを３点、中程度のものを２点、小さ
いものを１点として採点した。その結果は表１の通りで
ある。These molded products were observed with a 10 × magnifying glass before and after aging (heat treatment) under the above conditions. Regarding the contents, the presence or absence of cracks was confirmed, and a score of 3 with a large crack, a score of 2 with a medium crack, and a score of 1 with a small crack were given. The results are shown in Table 1.
【００２４】 [0024]
【００２５】表１の結果より、キャビティ面にダイヤモ
ンド微粒子をニッケル、コバルト等と共に、分散させた
複合メッキ被膜を形成した実施例においては、金型温度
１０℃においても、成形品にクラックが生じなかった。
さらに、複合メッキ被膜を形成した金型を用いて成形し
た実施例の場合、比較例に比して、成形圧力が１０％程
度小さくて済み、成形品表面にも艶があって良好な表面
状態となっていた。From the results shown in Table 1, in the example in which the composite plating film in which the fine diamond particles were dispersed on the cavity surface together with nickel, cobalt and the like was formed, the molded product was not cracked even at the mold temperature of 10 ° C. It was
Further, in the case of the example in which the mold formed with the composite plating film is used, the molding pressure can be reduced by about 10% as compared with the comparative example, and the surface of the molded product is glossy and has a good surface condition. It was.
【００２６】実施例 ２ 実施例１と同様のリフ゛プレート金型を用いて、スチー
ル製入子のキャビティ面に、表２に示すようにさまざま
のダイヤモンド微粒子共析量および被膜厚さを変化させ
たニッケルメッキ被膜を形成し、上記実施例１と同様の
成形機により金型温度３０℃にて実施例１と同様に成形
し、評価を行なった。Example 2 Using the same rib plate mold as in Example 1, various amounts of diamond fine particles were co-deposited and the film thickness was changed on the cavity surface of the steel insert as shown in Table 2. A nickel-plated film was formed, and molding was performed in the same manner as in Example 1 at a mold temperature of 30 ° C. using the same molding machine as in Example 1 above, and evaluation was performed.
【００２７】表３は、これらの実施例Ａ，Ｂ，Ｃ，Ｄと
比較例Ｆとにおける評価結果を表１と同様の方法により
表わしたものである。Table 3 shows the evaluation results of Examples A, B, C, D and Comparative Example F in the same manner as in Table 1.
【００２８】 [0028]
【００２９】 [0029]
【００３０】以上のように、複合メッキ被膜の形成によ
り、耐クラック性を顕著に改善させることが確認され
た。この理由は、種々考えられるが、その一つとしてダ
イヤモンド共析した複合被膜が、極めて良好な熱伝導性
を示すため、充填された樹脂が保有する熱量を素早く複
合メッキ被膜層に伝達させ、樹脂の急激な冷却過程が緩
和され、内部応力が緩和されるためであると考えられ
る。また、ダイヤモンドのもつ潤滑性が樹脂の流動性を
良好にし、さらに成形品の離型抵抗が減少する結果、離
型歪を減少させることもその理由であるものと考えられ
る。As described above, it was confirmed that the formation of the composite plating film significantly improves the crack resistance. There are various possible reasons for this, but one of them is that the diamond eutectoid composite coating exhibits extremely good thermal conductivity, so the amount of heat possessed by the filled resin can be quickly transferred to the composite plating coating layer. It is considered that this is because the rapid cooling process of is relaxed and the internal stress is relaxed. It is also considered that the reason is that the lubricity of diamond improves the fluidity of the resin, and the mold release resistance of the molded product decreases, resulting in a decrease in mold release strain.
【００３１】[0031]
【発明の効果】本発明にかかる樹脂成形用金型は、その
キャビティ面が従来技術にかかる金型のキャビティ面に
比して潤滑性ならびに熱伝導性に優れた複合メッキ被膜
層として形成されている。この複合メッキ被膜層は、耐
摩耗性にも優れており、優れた効果を長期間にわたり持
続せしめることができる。The resin molding die according to the present invention has a cavity surface formed as a composite plating film layer having excellent lubricity and thermal conductivity as compared with the cavity surface of the die according to the prior art. There is. This composite plating film layer also has excellent wear resistance, and can maintain its excellent effect for a long period of time.
【００３２】上記のような構成を有する樹脂成形用金型
により低い金型温度で成形された成形品は、残留応力が
少なく、ソリ、曲がり、クラック等の欠陥が少なくな
る。そのため、高機能性樹脂特有の特性が有効に発揮さ
れ、種々の工業用品に幅広く適応せしめることができ
る。The molded product molded at a low mold temperature by the resin molding mold having the above-mentioned structure has a small residual stress, and has few defects such as warpage, bending, and cracks. Therefore, the characteristics peculiar to the high-performance resin are effectively exhibited, and it can be widely applied to various industrial products.
【００３３】なお、このように形成された金型は、溶融
樹脂流路面への樹脂成分の付着を防止または大幅に低減
することができる。その結果、金型の清掃が不要または
簡単になり、樹脂替えまたは色替え時の作業が極めて容
易になる。The mold thus formed can prevent or significantly reduce the adhesion of the resin component to the surface of the flow path of the molten resin. As a result, cleaning of the mold becomes unnecessary or easy, and the work at the time of resin change or color change becomes extremely easy.
【図１】本発明にかかる樹脂成形用金型の構成を示す断
面図である。FIG. 1 is a cross-sectional view showing a configuration of a resin molding die according to the present invention.
【図２】本発明にかかる高機能性樹脂成形品の製造方法
において成形された評価用成形品の表面を示す斜視図で
ある。FIG. 2 is a perspective view showing a surface of an evaluation molded product molded in the method for producing a highly functional resin molded product according to the present invention.
【図３】本発明にかかる高機能性樹脂成形品の製造方法
において成形された評価用成形品の裏面を示す斜視図で
ある。FIG. 3 is a perspective view showing the back surface of a molded article for evaluation molded by the method for producing a highly functional resin molded article according to the present invention.
１０ 樹脂成形用金型 １２ キャビティ １４ 複合メッキ被膜層 10 Mold for Resin Molding 12 Cavity 14 Composite Plating Layer
Claims (2)
って、樹脂成形品を得るための金型において、そのキャ
ビティ面にダイヤモンド微粒子を分散共析させたことを
特徴とする、樹脂成形用金型。1. A metal mold for resin molding, characterized in that a mold for obtaining a resin molded product by filling with a molten resin composition has diamond particles dispersed and co-deposited on the cavity surface thereof. .
散共析させた複合メッキ被膜を形成した樹脂成形用金型
のキャビティに溶融した高機能性樹脂成形材料を充填
し、金型温度１０ないし６０℃において高機能性樹脂製
成形品を成形することを特徴とする、高機能製樹脂製成
形品の製造方法。2. The molten high-performance resin molding material is filled in the cavity of a resin molding die having a composite plating film in which diamond fine particles are dispersed and co-deposited on the cavity surface, and the mold temperature is 10 to 60 ° C. A method for producing a highly functional resin molded product, which comprises molding a highly functional resin molded product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8537093A JPH06270154A (en) | 1993-03-19 | 1993-03-19 | Resin molding die and manufacture of high functional resin molded form |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8537093A JPH06270154A (en) | 1993-03-19 | 1993-03-19 | Resin molding die and manufacture of high functional resin molded form |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06270154A true JPH06270154A (en) | 1994-09-27 |
Family
ID=13856834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8537093A Pending JPH06270154A (en) | 1993-03-19 | 1993-03-19 | Resin molding die and manufacture of high functional resin molded form |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06270154A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000051805A1 (en) * | 1999-03-02 | 2000-09-08 | Feinwerktechnik Wetzlar Gmbh | Injection moulding device and method for preparing precision-optical and precision-mechanical parts from a thermoplastic |
| EP1048432A1 (en) * | 1999-04-28 | 2000-11-02 | Shin-Etsu Chemical Co., Ltd. | Mold and method for producing molded fluoroelastomer parts |
| CN103589895A (en) * | 2013-11-21 | 2014-02-19 | 北京科技大学 | Method for preparing high-precision diamond/Cu composite part at low cost |
-
1993
- 1993-03-19 JP JP8537093A patent/JPH06270154A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000051805A1 (en) * | 1999-03-02 | 2000-09-08 | Feinwerktechnik Wetzlar Gmbh | Injection moulding device and method for preparing precision-optical and precision-mechanical parts from a thermoplastic |
| EP1048432A1 (en) * | 1999-04-28 | 2000-11-02 | Shin-Etsu Chemical Co., Ltd. | Mold and method for producing molded fluoroelastomer parts |
| US6468463B1 (en) | 1999-04-28 | 2002-10-22 | Shin-Etsu Chemical Co., Ltd. | Method for producing molded fluoroelastomer parts |
| CN103589895A (en) * | 2013-11-21 | 2014-02-19 | 北京科技大学 | Method for preparing high-precision diamond/Cu composite part at low cost |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102905843B (en) | Amorphous alloy seal and conjunction | |
| CN105603269B (en) | A kind of manufacture method of aluminum automobile gear box casing | |
| CN103029368B (en) | A kind of Composite metal shell and preparation method thereof | |
| WO1993006980A1 (en) | Metallic mold for molding synthetic resin | |
| JPH04314506A (en) | Adiabatic mold structure with multilayer metal surface layers | |
| US20050247426A1 (en) | Method for manufacturing a mold core coating | |
| CN101168844A (en) | Treatment method for increasing die self-demouding performance | |
| JPH06270154A (en) | Resin molding die and manufacture of high functional resin molded form | |
| CN109261972A (en) | A kind of bimetallic extruder barrel and preparation method thereof | |
| JPS6258289B2 (en) | ||
| CN115044842A (en) | Production system for preparing high-specific-rigidity aluminum silicon carbide structural part | |
| JP3363500B2 (en) | Mold and injection molding method using the same | |
| JPS642487B2 (en) | ||
| CN106350751B (en) | Liquid metal handset and preparation method thereof | |
| TWI660690B (en) | Manufacturing method of combination of mold for a sole | |
| JP2002361352A (en) | Forming method for magnesium alloy product | |
| JP3231460B2 (en) | Mold for liquid resin molding | |
| JP2794184B2 (en) | Graphite mold for plastic molding | |
| KR101086319B1 (en) | Method for manufacturing metal tool using thermal spray | |
| JP6418619B1 (en) | Mold, mold manufacturing method, resin molding apparatus and molded product molding method | |
| JPH1067032A (en) | Manufacture of hollow injection-molded product | |
| JPS642488B2 (en) | ||
| CN108149058A (en) | A kind of copper alloy glass mold materials and preparation method thereof | |
| WO1997038845A1 (en) | Multi-layered blow molded body and multi-layered blow molding method | |
| CN1328407C (en) | Method for preparing microu-crystal copper-aluminium-nickle shape memory alloy cube material |