JPH04766U - - Google Patents
Info
- Publication number
- JPH04766U JPH04766U JP4150390U JP4150390U JPH04766U JP H04766 U JPH04766 U JP H04766U JP 4150390 U JP4150390 U JP 4150390U JP 4150390 U JP4150390 U JP 4150390U JP H04766 U JPH04766 U JP H04766U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- receiving element
- optical
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000013307 optical fiber Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第1図は本考案による光リンクの一実施例を示
す正断面図、第2図は同実施例における光リンク
の側断面図である。 11……発光素子、12……受光素子、2……
インナーモールド成形部、3……レンズ部、4…
…アウターモールド成形部、6……光フアイバケ
ーブル、7,71,72,73,74……リード
フレーム。
す正断面図、第2図は同実施例における光リンク
の側断面図である。 11……発光素子、12……受光素子、2……
インナーモールド成形部、3……レンズ部、4…
…アウターモールド成形部、6……光フアイバケ
ーブル、7,71,72,73,74……リード
フレーム。
Claims (1)
- 電気信号を光信号に変換する発光素子または光
信号を電気信号に変換する受光素子と光フアイバ
ケーブルの端面とを対向させて光信号のやりとり
を行なわせるように両者を接続する光リンクであ
つて、発光素子と受光素子とを並設して、その発
光素子における電気信号印加用およびアース用の
各リードフレームを外部に引き出しながら、また
受光素子におけるバイアス電圧印加用、アース用
および光信号出力用の各リードフレームを外部に
引き出しながら、発光素子および受光素子をそれ
ぞれ光透過性の樹脂によつてモールド成形したイ
ンナーモールド成形部と、その各インナーモール
ド成形部を一まとめにして樹脂によつてモールド
成形し、かつ発光素子と受光素子とにそれぞれ対
向する各光フアイバケーブルの挿入孔が設けられ
たアウターモールド成形部とからなり、発光素子
と受光素子との各アース用のリードフレームが共
通のリードフレーム構成となるようにしたことを
特徴とする光リンク。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4150390U JPH04766U (ja) | 1990-04-18 | 1990-04-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4150390U JPH04766U (ja) | 1990-04-18 | 1990-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04766U true JPH04766U (ja) | 1992-01-07 |
Family
ID=31552229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4150390U Pending JPH04766U (ja) | 1990-04-18 | 1990-04-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04766U (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149410B2 (ja) * | 1977-11-10 | 1986-10-29 | Rhone Poulenc Textile |
-
1990
- 1990-04-18 JP JP4150390U patent/JPH04766U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149410B2 (ja) * | 1977-11-10 | 1986-10-29 | Rhone Poulenc Textile |