JPH04766U - - Google Patents

Info

Publication number
JPH04766U
JPH04766U JP4150390U JP4150390U JPH04766U JP H04766 U JPH04766 U JP H04766U JP 4150390 U JP4150390 U JP 4150390U JP 4150390 U JP4150390 U JP 4150390U JP H04766 U JPH04766 U JP H04766U
Authority
JP
Japan
Prior art keywords
light
emitting element
receiving element
optical
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4150390U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4150390U priority Critical patent/JPH04766U/ja
Publication of JPH04766U publication Critical patent/JPH04766U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Optical Couplings Of Light Guides (AREA)

Description

【図面の簡単な説明】
第１図は本考案による光リンクの一実施例を示
す正断面図、第２図は同実施例における光リンク
の側断面図である。 １１……発光素子、１２……受光素子、２……
インナーモールド成形部、３……レンズ部、４…
…アウターモールド成形部、６……光フアイバケ
ーブル、７，７１，７２，７３，７４……リード
フレーム。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電気信号を光信号に変換する発光素子または光
    信号を電気信号に変換する受光素子と光フアイバ
    ケーブルの端面とを対向させて光信号のやりとり
    を行なわせるように両者を接続する光リンクであ
    つて、発光素子と受光素子とを並設して、その発
    光素子における電気信号印加用およびアース用の
    各リードフレームを外部に引き出しながら、また
    受光素子におけるバイアス電圧印加用、アース用
    および光信号出力用の各リードフレームを外部に
    引き出しながら、発光素子および受光素子をそれ
    ぞれ光透過性の樹脂によつてモールド成形したイ
    ンナーモールド成形部と、その各インナーモール
    ド成形部を一まとめにして樹脂によつてモールド
    成形し、かつ発光素子と受光素子とにそれぞれ対
    向する各光フアイバケーブルの挿入孔が設けられ
    たアウターモールド成形部とからなり、発光素子
    と受光素子との各アース用のリードフレームが共
    通のリードフレーム構成となるようにしたことを
    特徴とする光リンク。
JP4150390U 1990-04-18 1990-04-18 Pending JPH04766U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4150390U JPH04766U (ja) 1990-04-18 1990-04-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4150390U JPH04766U (ja) 1990-04-18 1990-04-18

Publications (1)

Publication Number Publication Date
JPH04766U true JPH04766U (ja) 1992-01-07

Family

ID=31552229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4150390U Pending JPH04766U (ja) 1990-04-18 1990-04-18

Country Status (1)

Country Link
JP (1) JPH04766U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149410B2 (ja) * 1977-11-10 1986-10-29 Rhone Poulenc Textile

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149410B2 (ja) * 1977-11-10 1986-10-29 Rhone Poulenc Textile

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