JPH04274610A - Structure for mounting piezoelectric resonator - Google Patents
Structure for mounting piezoelectric resonatorInfo
- Publication number
- JPH04274610A JPH04274610A JP5950991A JP5950991A JPH04274610A JP H04274610 A JPH04274610 A JP H04274610A JP 5950991 A JP5950991 A JP 5950991A JP 5950991 A JP5950991 A JP 5950991A JP H04274610 A JPH04274610 A JP H04274610A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric resonator
- bonding
- mounting board
- mounting
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 12
- 238000000605 extraction Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、チップ状圧電共振子
等、部品の外面に外部電極を形成した電子部品の実装構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for electronic components such as chip-shaped piezoelectric resonators in which external electrodes are formed on the outer surface of the component.
【０００２】0002
【従来の技術】圧電共振子の圧電素子は図８に示すよう
に、圧電基板１の両面に振動電極２，２を有し、基板１
の一方端面に上面の振動電極２に連なる内部引出電極３
が設けられており、下面の振動電極２と連なる内部引出
電極３は他方端面に引出された構造を有している。2. Description of the Related Art A piezoelectric element of a piezoelectric resonator has vibrating electrodes 2, 2 on both sides of a piezoelectric substrate 1, as shown in FIG.
An internal extraction electrode 3 connected to the vibrating electrode 2 on the upper surface is provided on one end surface of the
is provided, and has a structure in which an internal extraction electrode 3 connected to the vibrating electrode 2 on the lower surface is extracted from the other end surface.
【０００３】この圧電基板１の両面を図９のように両面
を封止基板４，４により挟んで積層し、積層体５を構成
した後、スパッタリングやメッキ等の方法で外部引出電
極６，６を形成する。この外部電極６は圧電基板１の端
面を通じてそれぞれ内部引出電極３と導通することとな
る。After forming a laminate 5 by sandwiching both sides of the piezoelectric substrate 1 between sealing substrates 4, 4 as shown in FIG. form. The external electrodes 6 are electrically connected to the internal lead-out electrodes 3 through the end surfaces of the piezoelectric substrate 1, respectively.
【０００４】このようにして得られた圧電共振子は、そ
の外部電極６を実装基板の回路配線に半田付けされるこ
とにより回路配線と導通するとともに実装基板に実装固
定される。The piezoelectric resonator thus obtained is electrically connected to the circuit wiring by soldering its external electrode 6 to the circuit wiring of the mounting board, and is mounted and fixed to the mounting board.
【０００５】[0005]
【発明が解決しようとする課題】上記のような従来の圧
電共振子の実装構造は、外部引出電極６を実装基板へ半
田付けを行なうことにより実装していたため、その外部
電極６は、半田付けを考慮した一定の大きさが必要であ
り、電子部品全体の小型化に限界があった。[Problems to be Solved by the Invention] In the conventional piezoelectric resonator mounting structure as described above, the external lead electrode 6 was mounted by soldering to the mounting board. A certain size was required to take into account the above, and there was a limit to the miniaturization of the entire electronic component.
【０００６】又、実装基板にストレスがかかると、半田
を通じてそのストレスが直接外部引出電極６へ加わるた
め、電極剥離等の問題が生じるおそれがあった。Furthermore, when stress is applied to the mounting board, the stress is applied directly to the external lead electrode 6 through the solder, which may cause problems such as electrode peeling.
【０００７】この発明は、上記のような課題を解決する
ためになされたものであり、部品の小型化が可能で、実
装時の信頼性を向上させた圧電共振子の実装構造を提供
することを目的とする。The present invention was made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a mounting structure for a piezoelectric resonator that enables miniaturization of components and improves reliability during mounting. With the goal.
【０００８】[0008]
【課題を解決するための手段】上記のような課題を解決
するためこの発明は、表面にボンディングパッド又はボ
ンディングバンプを設けた圧電共振子を実装基板に接着
し、ボンディングパッド又はボンディングバンプと実装
基板の回路配線とを適宜手段で接続導通させた圧電共振
子の実装構造である。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention adheres a piezoelectric resonator having bonding pads or bonding bumps on its surface to a mounting board, and connects the bonding pads or bonding bumps to the mounting board. This is a mounting structure of a piezoelectric resonator which is connected and electrically connected to the circuit wiring by appropriate means.
【０００９】[0009]
【作用】圧電共振子と実装基板は接着剤で接合され、内
部の振動電極と実装基板の回路との電気的導通は表面に
設けられたボンディングパッドまたはボンディングバン
プを利用してワイヤーボンディング等適宜手段で行なわ
れるので、圧電共振子に半田付けを考慮した大きな外部
電極が不要となり、又、実装基板のストレスが直接圧電
共振子の外部電極に加わらなくなる。[Operation] The piezoelectric resonator and the mounting board are bonded with adhesive, and electrical continuity between the internal vibrating electrode and the circuit of the mounting board is established by appropriate means such as wire bonding using bonding pads or bonding bumps provided on the surface. This eliminates the need for large external electrodes to be soldered to the piezoelectric resonator, and also prevents stress from the mounting board from being directly applied to the external electrodes of the piezoelectric resonator.
【００１０】0010
【実施例】以下、この発明の実施例を添付図面の図１乃
至図７に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to FIGS. 1 to 7 of the accompanying drawings.
【００１１】図１はこの発明に係る圧電共振子１１を示
し、圧電基板１２を絶縁体からなる封止基板１３，１３
で挟んで積層し、積層体１４を形成している。FIG. 1 shows a piezoelectric resonator 11 according to the present invention, in which a piezoelectric substrate 12 is connected to sealing substrates 13 and 13 made of an insulator.
They are sandwiched and stacked to form a laminate 14.
【００１２】この上部の封止基板１３の表面に圧電基板
１２の上面の内部引出電極（図示せず）と導通し、積層
体１４の上面へ連なる外部引出電極１５を印刷等適宜手
段で形成し、その先端に微小面積の電極であるボンディ
ングパッド１６を形成する。[0012] On the surface of the upper sealing substrate 13, an external lead electrode 15 is formed by an appropriate means such as printing, which is electrically connected to the internal lead electrode (not shown) on the top surface of the piezoelectric substrate 12 and extends to the top surface of the laminate 14. A bonding pad 16, which is an electrode with a minute area, is formed at the tip thereof.
【００１３】一方、圧電基板１２の下面の内部引出電極
に連なる外部引出電極１７は圧電基板１２と上部封止基
板１３の端面に形成され、積層体１４の上面に連なる。
この電極１７の先端にボンディングパッド１８を形成す
る。On the other hand, external extraction electrodes 17 connected to internal extraction electrodes on the lower surface of the piezoelectric substrate 12 are formed on the end surfaces of the piezoelectric substrate 12 and the upper sealing substrate 13, and are connected to the upper surface of the laminate 14. A bonding pad 18 is formed at the tip of this electrode 17.
【００１４】このボンディングパッド１６，１８はＡｕ
，Ａｇ，Ａｌ，Ｃｕ，Ｓｎ等の材料で構成され、その形
状、位置等は任意であるが、電子部品を小型化する目的
があるので電極面積は一般的には１ｍｍ２ 以下が望ま
しい。The bonding pads 16 and 18 are made of Au.
, Ag, Al, Cu, Sn, etc., and its shape, position, etc. are arbitrary, but since the purpose is to miniaturize electronic components, it is generally desirable that the electrode area be 1 mm 2 or less.
【００１５】また、ボンディングパッドに代えて、Ａｕ
，Ａｇ，Ａｌ，Ｃｕ，Ｓｎ等同種の材料からなる突起状
のボンディングバンプを形成してもよい。[0015] Also, instead of the bonding pad, Au
, Ag, Al, Cu, Sn, or other similar materials may be formed into protruding bonding bumps.
【００１６】この圧電共振子１１の実装構造は、図２に
示すように、実装基板１９に接着剤等を用いて圧電共振
子１１を固定した後、圧電共振子のボンディングパッド
１６，１８と実装基板上の回路配線２１とをＡｕ，Ａｇ
，Ｃｕ等からなるワイヤー２０でワイヤボンディングを
行ない、実装基板上の回路との電気的導通を得る。As shown in FIG. 2, the mounting structure of the piezoelectric resonator 11 is such that after the piezoelectric resonator 11 is fixed to a mounting board 19 using an adhesive or the like, bonding pads 16 and 18 of the piezoelectric resonator are mounted. The circuit wiring 21 on the board is made of Au, Ag.
, Cu, etc., to establish electrical continuity with the circuit on the mounting board.
【００１７】尚、実装基板への実装は、上記の例に限ら
れず、ボンディングパッドと実装基板上の電極とを直接
表面同志で対向させて密着しボンディングを行なうフェ
ースボンディングや、インナーリードへのボンディング
を行なうインナーリードボンディングを行なってもよい
。[0017] The mounting on the mounting board is not limited to the above example, and may include face bonding, in which bonding pads and electrodes on the mounting board are directly opposed to each other on their surfaces, and bonded in close contact, and bonding to inner leads. Inner lead bonding may also be performed.
【００１８】図３に示すように、このボンディングパッ
ド２２は、外部引出電極２３を利用して圧電共振子１１
の表面の任意の位置に配置することができ、実装基板の
回路配線やボンディングの作業性を考慮した位置に設定
することができる。As shown in FIG. 3, this bonding pad 22 connects the piezoelectric resonator 11 using an external lead electrode 23.
It can be placed at any position on the surface of the board, and can be set at a position that takes into account the workability of circuit wiring and bonding of the mounting board.
【００１９】更に図４に示すように、電子部品が複数の
素子や多数の積層構造からなり、多くの機能が含まれ多
数の種類の電極が必要な場合でも、電子部品を大型化す
ることなく多数のパッド２２を設けることで対応するこ
とができる。Furthermore, as shown in FIG. 4, even if an electronic component is composed of multiple elements or multiple laminated structures, includes many functions, and requires many types of electrodes, it is possible to eliminate the need to increase the size of the electronic component. This can be handled by providing a large number of pads 22.
【００２０】又、図５のようにボンディングパッド２４
を半田付け用の電極と共用できる程度の大きさの構成に
してもよい。Furthermore, as shown in FIG. 5, the bonding pad 24
The size of the electrode may be such that it can also be used as a soldering electrode.
【００２１】図６のものは実装性の向上とコストダウン
を図るため、圧電素子２５そのものを直接実装基板に装
着するものであり、この場合圧電素子の上面に上部電極
と連なるボンディングパッド２６を設ける。下面の電極
は引出電極２７を利用して圧電素子２５の上面に設けた
もう一方のボンディングパッド２８に連なるようにすれ
ばよい。In the case shown in FIG. 6, the piezoelectric element 25 itself is directly attached to the mounting board in order to improve mounting performance and reduce costs. In this case, a bonding pad 26 connected to the upper electrode is provided on the upper surface of the piezoelectric element. . The electrode on the lower surface may be connected to the other bonding pad 28 provided on the upper surface of the piezoelectric element 25 using the lead electrode 27.
【００２２】図７は圧電共振子の上面にワイヤボンディ
ング用のパッド２９を、下面にフェースボンディング用
のパッド３０を設けたものであり、このように電子部品
自体を大型化することなく別の目的を持ったパッドを複
数種類設けることもできる。FIG. 7 shows a piezoelectric resonator in which a pad 29 for wire bonding is provided on the top surface and a pad 30 for face bonding is provided on the bottom surface. It is also possible to provide multiple types of pads with .
【００２３】[0023]
【発明の効果】以上のように、この発明によると半田付
けを考慮した面積の外部電極が不要となり、外部電極を
極めて小さく設定できるため、圧電共振子の小型化とコ
ストダウンを図ることができる。[Effects of the Invention] As described above, according to the present invention, there is no need for external electrodes with an area that takes into account soldering, and the external electrodes can be set extremely small, making it possible to miniaturize the piezoelectric resonator and reduce costs. .
【００２４】又、圧電共振子は実装基板に接着剤で固定
され、電気的な接続はボンディングパッドあるいはボン
ディングバンプを通じワイヤボンディング等適宜手段で
導通が行なわれているので、実装基板のストレスが直接
共振子の外部電極に加わらなくなり、素子の取扱い、保
管等において破損等が生じにくく、信頼性の向上が図れ
る。Furthermore, the piezoelectric resonator is fixed to the mounting board with adhesive, and the electrical connection is made by appropriate means such as wire bonding through bonding pads or bonding bumps, so that stress on the mounting board directly resonates. Since the element is not applied to the external electrode of the element, damage is less likely to occur during handling, storage, etc. of the element, and reliability can be improved.
【００２５】更に、ボンディングパッド等の形状やその
設定位置は任意に形成できるため、回線との接続や設計
が容易となる。又、多機能の電子部品で外部電極数が多
いものであっても部品を大型化する必要がなくなる。Furthermore, since the shape and position of the bonding pad etc. can be formed arbitrarily, connection with a line and design are facilitated. Further, even if the electronic component is multifunctional and has a large number of external electrodes, there is no need to increase the size of the component.
【図１】この発明に係る圧電共振子の斜視図である。FIG. 1 is a perspective view of a piezoelectric resonator according to the present invention.
【図２】この発明に係る圧電共振子の実装構造を示す正
面図である。FIG. 2 is a front view showing a mounting structure of a piezoelectric resonator according to the present invention.
【図３】この発明に係る圧電共振子の他の例を示す斜視
図である。FIG. 3 is a perspective view showing another example of the piezoelectric resonator according to the present invention.
【図４】この発明に係る圧電共振子の他の例を示す斜視
図である。FIG. 4 is a perspective view showing another example of the piezoelectric resonator according to the present invention.
【図５】この発明に係る圧電共振子の他の例を示す斜視
図である。FIG. 5 is a perspective view showing another example of the piezoelectric resonator according to the present invention.
【図６】この発明に係る圧電共振子の他の例を示す斜視
図である。FIG. 6 is a perspective view showing another example of the piezoelectric resonator according to the present invention.
【図７】この発明に係る圧電共振子の他の例を示す斜視
図である。FIG. 7 is a perspective view showing another example of the piezoelectric resonator according to the present invention.
【図８】従来の圧電共振子の圧電基板の斜視図である。FIG. 8 is a perspective view of a piezoelectric substrate of a conventional piezoelectric resonator.
【図９】従来の圧電共振子の斜視図である。FIG. 9 is a perspective view of a conventional piezoelectric resonator.
１１ 圧電共振子
１６，１８，２２，２４，２６，２８，２９，３０
ボンディングパッド
１８ 回路配線11 Piezoelectric resonator 16, 18, 22, 24, 26, 28, 29, 30
Bonding pad 18 Circuit wiring
Claims (1)
グパッド又はボンディングバンプを形成した圧電共振子
が実装基板に接着固定され、ボンディングパッド又はボ
ンディングバンプを通じて実装基板の回路配線と導通接
続されていることを特徴とする圧電共振子の実装構造。Claim 1: A piezoelectric resonator having bonding pads or bonding bumps formed thereon that are electrically connected to internal electrodes is adhesively fixed to a mounting board, and electrically connected to circuit wiring on the mounting board through the bonding pads or bonding bumps. Features a piezoelectric resonator mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5950991A JPH04274610A (en) | 1991-02-28 | 1991-02-28 | Structure for mounting piezoelectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5950991A JPH04274610A (en) | 1991-02-28 | 1991-02-28 | Structure for mounting piezoelectric resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04274610A true JPH04274610A (en) | 1992-09-30 |
Family
ID=13115300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5950991A Pending JPH04274610A (en) | 1991-02-28 | 1991-02-28 | Structure for mounting piezoelectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04274610A (en) |
-
1991
- 1991-02-28 JP JP5950991A patent/JPH04274610A/en active Pending
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