JPH04131024U - surface mount electronic components - Google Patents

surface mount electronic components

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Publication number
JPH04131024U
JPH04131024U JP4635691U JP4635691U JPH04131024U JP H04131024 U JPH04131024 U JP H04131024U JP 4635691 U JP4635691 U JP 4635691U JP 4635691 U JP4635691 U JP 4635691U JP H04131024 U JPH04131024 U JP H04131024U
Authority
JP
Japan
Prior art keywords
lead
chip
electronic components
electrodes
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4635691U
Other languages
Japanese (ja)
Inventor
幹雄 中島
穂積 中田
Original Assignee
株式会社大真空
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社大真空 filed Critical 株式会社大真空
Priority to JP4635691U priority Critical patent/JPH04131024U/en
Publication of JPH04131024U publication Critical patent/JPH04131024U/en
Pending legal-status Critical Current

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

(57)【要約】 【目的】 熱的あるいは機械的歪を緩和吸収できる薄型
の表面実装型電子部品を提供することを目的とする。 【構成】 表面に引出し電極が設けられた薄型のチップ
型電子部品の引出し電極に、弾力性に富んだリード端子
を接合した構成である。また、上面に引出し電極11〜
14が設けられた薄型のチップ型水晶振動子1の前記引
出し電極に、リード端子21〜24を電気的機械的に接
合し、このリード端子は下方に約90度折り曲げられ、
さらにこのチップ型水晶振動子1の底面とほぼ同一平面
の位置にて外方に約90度折り曲げられている構成であ
る。
(57) [Summary] [Purpose] The purpose is to provide a thin surface-mounted electronic component that can relax and absorb thermal or mechanical strain. [Structure] This is a structure in which highly elastic lead terminals are bonded to the lead electrodes of a thin chip-type electronic component with lead electrodes provided on the surface. In addition, the extraction electrodes 11 to 11 are provided on the top surface.
The lead terminals 21 to 24 are electrically and mechanically connected to the lead-out electrodes of the thin chip-type crystal resonator 1 provided with the lead terminal 14, and the lead terminals are bent approximately 90 degrees downward.
Further, it is bent outward at approximately 90 degrees at a position substantially flush with the bottom surface of the chip-type crystal resonator 1.

Description

【考案の詳細な説明】[Detailed explanation of the idea]

【0001】0001

【産業上の利用分野】[Industrial application field]

本考案は薄型の表面実装型電子部品に関し、特にプリント配線基板への実装を 考慮した電子部品に関するものである。 This invention relates to thin surface-mounted electronic components, especially for mounting on printed wiring boards. It is related to the electronic components considered.

【0002】0002

【従来の技術】[Conventional technology]

電子機器の小型化に伴い、電子部品はその全高が低くかつプリント配線基板上 に高密度に実装されることが要求され、しかもその実装は自動機によって行うこ とが要求されている。この要求に応えるべく電子部品を薄型でリードレス化した チップタイプとする動きが急となっていた。図7に示すようなチップタイプの電 子部品7は、図8に示すような普及型の水晶振動子9に代表されるハーメチック シール型の容器を用いた電子部品に較べて、全高を始めとする体積を小さくする ことができる。なお、8はプリント配線基板である。図7に示すようなチップ化 された電子部品はその下面に引出し電極が設けられており、この引出し電極によ りプリント配線基板等の外部電極と接続を行っていた。この接続は電子機器のア ッセンブリーの自動化の流れで、プリント配線基板への電子部品の電気的機械的 接合を、リフローソルダリングにより行うことが多くなってきている。リフロー ソルダリングとは、あらかじめ接合箇所に適量の半田を供給しておき、外部から の熱源によって半田を溶融させ、半田付けを行う方法である。 As electronic devices become smaller, electronic components have a lower overall height and are mounted on printed wiring boards. high-density mounting is required, and the mounting can be done by automatic machines. is required. To meet this demand, we have made electronic components thinner and leadless. There was a sudden movement towards chip type. Chip-type electricity as shown in Figure 7 The child component 7 is a hermetic crystal oscillator 9 typified by a popular type crystal oscillator 9 as shown in FIG. Compared to electronic components that use sealed containers, the overall height and volume are smaller. be able to. Note that 8 is a printed wiring board. Chip formation as shown in Figure 7 The extracted electronic components have an extraction electrode on the bottom surface, and this extraction electrode It was connected to external electrodes such as printed wiring boards. This connection is In the trend of assembly automation, electrical and mechanical attachment of electronic components to printed wiring boards Bonding is increasingly performed by reflow soldering. reflow Soldering is a process in which an appropriate amount of solder is supplied to the joint in advance, and then solder is applied from the outside. This method uses a heat source to melt the solder and perform soldering.

【0003】0003

【考案が解決しようとする課題】[Problem that the idea aims to solve]

チップ型電子部品は、一般的に薄型化、低背化が可能であり、上記したように 半田等によりプリント配線基板に堅固に電気的機械的接合される。ところがリー ドレスであるがために、半田の硬化時における収縮歪、あるいは基板の変形等に よる歪が緩和される部分を有していない。例えば、電子機器によっては電子部品 をプリント配線基板に実装後、この基板の変形を矯正する場合がある。また、電 子部品ではほとんどの場合、信頼性を確保しあるいは確認するために、ヒートサ イクル試験やエージング試験が行なわれている。ヒートサイクル試験とは電子部 品の周囲環境温度を、例えば−40℃→25℃を3分→100℃を30分→25 ℃を3分→−40℃を30分のサイクルを数百回繰り返すものである。ところが 、このようなサイクルの繰り返しにより半田等の接合材が膨張収縮を起こす。チ ップ型電子部品であると、これらのような場合歪を緩和する部分を有していない 。このため、電子部品側のパッケージにひびが入ったり、あるいは各部品との接 合面が剥がれたりして、導電状態が不安定になることがあった。 Chip-type electronic components can generally be made thinner and lower in profile, and as mentioned above, It is firmly electrically and mechanically bonded to the printed wiring board by soldering or the like. However, Lee Because it is a dress, there is no risk of shrinkage distortion during solder curing or deformation of the board. It does not have a part where the strain caused by the strain is alleviated. For example, some electronic devices have electronic components. After mounting on a printed wiring board, deformation of this board may be corrected. Also, electric Most subcomponents are equipped with a heat support to ensure or verify reliability. Cycle tests and aging tests are being conducted. What is heat cycle test?Electronic section Change the ambient temperature of the product, for example -40℃ → 25℃ for 3 minutes → 100℃ for 30 minutes → 25℃ A cycle of 3 minutes at Celsius and 30 minutes at -40C is repeated several hundred times. However By repeating such a cycle, the bonding material such as solder expands and contracts. blood In cases like these, top-type electronic components do not have parts that alleviate strain. . As a result, the package on the electronic component side may be cracked, or the contact with each component may be damaged. The conductive state could become unstable due to peeling of the mating surface.

【0004】 本考案は上記問題点を解決するためになされたもので、熱的あるいは機械的歪 を緩和吸収できる薄型の表面実装型電子部品を提供することを目的とするもので ある。0004 This invention was devised to solve the above problems, and is designed to prevent thermal or mechanical strain. The purpose is to provide a thin surface-mounted electronic component that can absorb and absorb be.

【0005】[0005]

【課題を解決するための手段】[Means to solve the problem]

上記問題点を解決するために、本考案による表面実装型電子部品は、表面に引 出し電極が設けられた薄型のチップ型電子部品の引出し電極に、弾力性に富んだ リード端子を接合したことを特徴とするものである。 In order to solve the above problems, the surface-mounted electronic component according to the present invention is A highly elastic material is used as the lead-out electrode of a thin chip-type electronic component equipped with a lead-out electrode. It is characterized in that lead terminals are joined.

【0006】 水晶振動子を実装した表面実装型電子部品の例として、上面に引出し電極が設 けられた薄型のチップ型水晶振動子の前記引出し電極に、リード端子を接合し、 このリード端子は下方に約90度折り曲げられ、さらに約90度折り曲げられて いる構成をあげることができる。[0006] As an example of a surface-mounted electronic component that has a crystal resonator mounted on it, an extraction electrode is installed on the top surface. A lead terminal is joined to the extraction electrode of the thin chip-type crystal resonator that has been cut, This lead terminal is bent down about 90 degrees, and then bent again about 90 degrees. I can list some configurations.

【0007】[0007]

【作用】[Effect]

薄型のチップ型電子部品の引出し電極部に弾力性に富んだリード端子を接合し 、このリード端子先端でプリント配線基板の電極と接合するので、チップ型電子 部品とプリント配線基板間に介在するリード端子が熱的、機械的歪を緩和する。 リード端子をチップ型電子部品の上方に大きくはみ出して設けない限り、低背状 態を損なうことはない。 Highly elastic lead terminals are bonded to the lead electrodes of thin chip-type electronic components. , since the tip of this lead terminal connects to the electrode of the printed wiring board, chip-type electronic Lead terminals interposed between the component and the printed wiring board alleviate thermal and mechanical strain. As long as the lead terminals do not protrude significantly above the chip-type electronic components, low-profile The condition will not be affected.

【0008】[0008]

【実施例】 次に、本考案について水晶振動子を例にとり、図面を参照して説明する。 図1は本考案の第1の実施例を示す斜視図であり、図2は図1の正面図である 。チップ型水晶振動子1は、内部空間には電極形成された水晶振動片が収納され ており、そこから引き出された電極は引出し電極11,12,13,14に電気 的につながっている。この引出し電極11,12,13,14はチップ型水晶振 動子1の上面に設けられている(一般的にチップ型水晶振動子はその下面に引出 し電極を有しているが、このようなチップ型水晶振動子を天地逆にして使用して もよい。)。リード端子21,22,23,24は、それぞれ板状の金属板が約 90度下方に折り曲げられ、かつチップ型水晶振動子の底面と同一面の位置で、 当該折り曲げ方向と異なった方向に約90度折り曲げられた構成を有している。 これらリード端子は、前記引出し電極にろう接等により接合される。なお、これ らリード端子の折り曲げ方向は電子部品の搭載形態あるいはスペースに応じて決 定すればよく、最終的にプリント配線基板と並行な部分を作り出せばよい。【Example】 Next, the present invention will be explained using a crystal resonator as an example with reference to the drawings. FIG. 1 is a perspective view showing a first embodiment of the present invention, and FIG. 2 is a front view of FIG. 1. . In the chip-type crystal resonator 1, a crystal resonator piece with electrodes formed therein is housed in the internal space. The electrodes drawn out from there are electrically connected to the lead-out electrodes 11, 12, 13, and 14. are connected to each other. These extraction electrodes 11, 12, 13, 14 are chip-type crystal It is provided on the top surface of the actuator 1 (generally chip-type crystal units have a drawer on the bottom surface). However, when such a chip-type crystal resonator is used upside down, Good too. ). The lead terminals 21, 22, 23, and 24 each have a plate-shaped metal plate approximately It is bent 90 degrees downward and is flush with the bottom of the chip type crystal resonator. It has a configuration in which it is bent approximately 90 degrees in a direction different from the bending direction. These lead terminals are joined to the extraction electrodes by brazing or the like. Furthermore, this The direction in which the lead terminals are bent is determined depending on the mounting form or space available for electronic components. All you need to do is to set the area and finally create a part that is parallel to the printed wiring board.

【0009】 第2の実施例をチップ型水晶発振器を例に取り説明する。図3は他の実施例を 示す斜視図、図4は図3の正面図である。チップ型水晶発振器3はその内部に電 極形成された水晶振動片と必要な回路部品が収納されている。そしてこの実施例 では引出し電極31,32(一部省略)がチップ型水晶発振器の側面に設けられ ている。リード端子41,42,43,44は引出し電極との接続部分が鈎型を しており、プリント配線基板接続部分は外方に折り曲げられた構成をしている。 これらリード端子は、前記引出し電極にろう接等により接合される。[0009] The second embodiment will be explained by taking a chip type crystal oscillator as an example. Figure 3 shows another embodiment. FIG. 4 is a front view of FIG. 3. The chip type crystal oscillator 3 has a voltage inside it. Contains a pole-formed crystal vibrating piece and necessary circuit components. And this example In this case, extraction electrodes 31 and 32 (partially omitted) are provided on the side surface of a chip-type crystal oscillator. ing. The lead terminals 41, 42, 43, and 44 have hook-shaped connecting parts with the extraction electrodes. The printed wiring board connection part is bent outward. These lead terminals are joined to the extraction electrodes by brazing or the like.

【0010】 第3の実施例を図5、図6とともに説明する。図5は斜視図、図6は図5の正 面図である。チップ型水晶発振器5は第2の実施例と同じくその内部に電極形成 された水晶振動片と必要な回路部品が収納されている。そしてこの実施例では引 出し電極51,52,53,54がチップ型水晶発振器の上面に設けられている 。リード端子61,62,63,64はコ字型をしており、前記引出し電極にろ う接等により接合される。リード端子が取り付けられた状態においてはリード端 子の先端部分がチップ型水晶発振器の下部に延びた構成をしている。0010 A third embodiment will be described with reference to FIGS. 5 and 6. Figure 5 is a perspective view, Figure 6 is a normal view of Figure 5. It is a front view. The chip type crystal oscillator 5 has electrodes formed inside it as in the second embodiment. Contains a crystal vibrating piece and necessary circuit parts. And in this example, Output electrodes 51, 52, 53, and 54 are provided on the top surface of the chip type crystal oscillator. . The lead terminals 61, 62, 63, and 64 are U-shaped, and are connected to the lead electrodes. Joined by welding etc. When the lead terminal is attached, the lead end The tip of the crystal oscillator extends below the chip-type crystal oscillator.

【0011】 なお、本考案は上記実施例に限定されるものではなく、チップ型電子部品に広 く適用できるものである。また、リード端子の延出方向もチップ型電子部品の上 方に大きくはみ出して設けない限り、低背状態を損なうことはないので多様な構 成を取ることができる。[0011] Note that the present invention is not limited to the above embodiments, but can be applied to chip-type electronic components. It is widely applicable. Also, the direction in which the lead terminals extend is also above the chip-type electronic component. As long as it does not protrude too much towards the side, the low profile will not be compromised, so it can be used in a variety of configurations. can be achieved.

【0012】0012

【考案の効果】[Effect of the idea]

薄型のチップ型電子部品の引出し電極部に弾力性に富んだリード端子を接合し 、このリード端子先端でプリント配線基板の電極と接合するので、チップ型電子 部品とプリント配線基板間に介在するリード端子が熱的、機械的歪を緩和する。 よって、電子部品とプリント配線基板の接続状態が不安定になったり、あるいは 電子部品側に大きな歪が生じることにより、部品がひび割れる等の損傷を受ける ことはなくなった。また、薄型のチップ型電子部品を用いているので、リード端 子を取り付けたとしても厚みが大きく増えることはなく、プリント配線基板に搭 載される電子部品に必要な低背化を確保できる。 Highly elastic lead terminals are bonded to the lead electrodes of thin chip-type electronic components. , since the tip of this lead terminal connects to the electrode of the printed wiring board, chip-type electronic Lead terminals interposed between the component and the printed wiring board alleviate thermal and mechanical strain. Therefore, the connection between the electronic components and the printed wiring board may become unstable, or Large strains on electronic components can cause damage such as cracking of the components. That's no longer the case. In addition, since thin chip-type electronic components are used, the lead end Even if a child is attached, the thickness will not increase significantly, and it can be mounted on a printed wiring board. It is possible to ensure the low profile required for the electronic components mounted thereon.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本考案によるチップ型電子部品の第1の実施例
を示す斜視図。
FIG. 1 is a perspective view showing a first embodiment of a chip-type electronic component according to the present invention.

【図2】図2の正面図。FIG. 2 is a front view of FIG. 2.

【図3】本考案によるチップ型電子部品の第2の実施例
を示す斜視図。
FIG. 3 is a perspective view showing a second embodiment of the chip-type electronic component according to the present invention.

【図4】図3の正面図。FIG. 4 is a front view of FIG. 3.

【図5】本考案によるチップ型電子部品の第3の実施例
を示す斜視図。
FIG. 5 is a perspective view showing a third embodiment of the chip-type electronic component according to the present invention.

【図6】図5の正面図。FIG. 6 is a front view of FIG. 5.

【図7】従来例を示す斜視図。FIG. 7 is a perspective view showing a conventional example.

【図8】他の従来例を示す斜視図。FIG. 8 is a perspective view showing another conventional example.

【符号の説明】[Explanation of symbols]

1 チップ型水晶振動子 11,12,13,14,31,32 引出し電極 21,22,23,24,41,42,43,44,6
1,62,63,64リード端子 3,5 チップ型水晶発振器 7 チップ型電子部品 8 プリント配線基板 9 水晶振動子
1 Chip type crystal oscillator 11, 12, 13, 14, 31, 32 Extraction electrode 21, 22, 23, 24, 41, 42, 43, 44, 6
1, 62, 63, 64 lead terminals 3, 5 Chip-type crystal oscillator 7 Chip-type electronic component 8 Printed wiring board 9 Crystal resonator

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 表面に引出し電極が設けられた薄型のチ
ップ型電子部品の引出し電極に、弾力性に富んだリード
端子を接合したことを特徴とする表面実装型電子部品。
1. A surface-mounted electronic component characterized in that a lead terminal with high elasticity is bonded to a lead-out electrode of a thin chip-type electronic component having a lead-out electrode on its surface.
【請求項2】 上面に引出し電極が設けられた薄型のチ
ップ型水晶振動子の前記引出し電極に、リード端子を接
合し、このリード端子は下方に約90度折り曲げられ、
さらに約90度折り曲げられていることを特徴とする表
面実装型電子部品。
2. A lead terminal is bonded to the lead-out electrode of a thin chip-type crystal resonator having lead-out electrodes provided on the upper surface, and the lead terminal is bent downward by about 90 degrees,
A surface-mounted electronic component characterized by being bent by about 90 degrees.
JP4635691U 1991-05-22 1991-05-22 surface mount electronic components Pending JPH04131024U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4635691U JPH04131024U (en) 1991-05-22 1991-05-22 surface mount electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4635691U JPH04131024U (en) 1991-05-22 1991-05-22 surface mount electronic components

Publications (1)

Publication Number Publication Date
JPH04131024U true JPH04131024U (en) 1992-12-01

Family

ID=31925884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4635691U Pending JPH04131024U (en) 1991-05-22 1991-05-22 surface mount electronic components

Country Status (1)

Country Link
JP (1) JPH04131024U (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216663A (en) * 1975-07-29 1977-02-08 Hitachi Ltd Integrated circuit device
JPS52156559A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Small electronic device packaging package
JPS61269346A (en) * 1985-05-24 1986-11-28 Hitachi Ltd Surface-formed electronic part
JPH025452A (en) * 1988-06-24 1990-01-10 Hitachi Ltd Semiconductor device
JPH029420B2 (en) * 1980-12-09 1990-03-01 Toshiba Electric Equip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216663A (en) * 1975-07-29 1977-02-08 Hitachi Ltd Integrated circuit device
JPS52156559A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Small electronic device packaging package
JPH029420B2 (en) * 1980-12-09 1990-03-01 Toshiba Electric Equip
JPS61269346A (en) * 1985-05-24 1986-11-28 Hitachi Ltd Surface-formed electronic part
JPH025452A (en) * 1988-06-24 1990-01-10 Hitachi Ltd Semiconductor device

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