JPH0363195B2 - - Google Patents
Info
- Publication number
- JPH0363195B2 JPH0363195B2 JP15211183A JP15211183A JPH0363195B2 JP H0363195 B2 JPH0363195 B2 JP H0363195B2 JP 15211183 A JP15211183 A JP 15211183A JP 15211183 A JP15211183 A JP 15211183A JP H0363195 B2 JPH0363195 B2 JP H0363195B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical components
- heating coil
- circuit board
- printed circuit
- magnetic flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 19
- 230000004907 flux Effects 0.000 claims description 7
- 230000006698 induction Effects 0.000 claims description 6
- 239000000696 magnetic material Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
Description
【発明の詳細な説明】
産業上の利用分野
本発明は高周波電流による誘導加熱装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an induction heating device using high frequency current.
従来例の構成とその問題点
従来の誘導加熱装置は、第１図に示すように、
筐体１内の上部に配置した加熱コイル２の下部に
各種電気部品３，５と、それらを相互に結線する
リード線６が配置されている。そして加熱コイル
２には高周波電流を流し、その近傍の被加熱物と
を磁気結合させることにより渦電流を被加熱物に
生じせしめ、その渦電流損を熱として利用してい
る。なお、４は電気部品（半導体部品）３の放熱
フインである。ここで問題となるのが加熱コイル
２から生ずる磁束７が下部にある半導体部品３や
各種電気部品５や、それらを結合するリード線６
に誘起電圧を発生させる。その結果それが電源ラ
インの端子雑音源となり、他の電気製品への雑音
障害として悪影響を与える欠点があつた。Configuration of conventional example and its problems As shown in Fig. 1, the conventional induction heating device has
Various electrical components 3 and 5 and lead wires 6 for interconnecting them are arranged below a heating coil 2 disposed in the upper part of the housing 1. A high-frequency current is passed through the heating coil 2 to magnetically couple it with a nearby object to be heated, thereby generating an eddy current in the object to be heated, and the eddy current loss is used as heat. Note that 4 is a heat dissipation fin of the electric component (semiconductor component) 3. The problem here is that the magnetic flux 7 generated from the heating coil 2 is applied to the semiconductor components 3 and various electrical components 5 located below, as well as the lead wires 6 that connect them.
generates an induced voltage. As a result, it becomes a source of terminal noise on the power supply line, which has the disadvantage of adversely affecting other electrical products as a noise disturbance.
発明の目的
本発明は前記従来の欠点を解消するもので、簡
単な構成で、雑音障害を低減することを目的とす
る。OBJECTS OF THE INVENTION The present invention solves the above-mentioned conventional drawbacks, and aims to reduce noise interference with a simple configuration.
発明の構成
上記目的を達するため、本発明の誘導加熱装置
は、放熱体を電気部品の冷却に供するのみなら
ず、アルミや銅等の非磁性体物質により形成し、
上部に位置する加熱コイルから発生する高周波磁
界より電気部品を遮蔽する構成とするものであ
り、これによつて電気部品に鎖交する磁束を低減
せしめ、そこに発生する雑音成分が低下し、他電
気製品への雑音障害が少なくなるという効果を有
するものである。Structure of the Invention In order to achieve the above object, the induction heating device of the present invention not only provides a heat sink for cooling electrical components, but also has a heat sink made of a non-magnetic material such as aluminum or copper,
The structure is such that the electrical components are shielded from the high-frequency magnetic field generated by the heating coil located at the top.This reduces the magnetic flux that interlinks with the electrical components, reduces the noise components generated there, and This has the effect of reducing noise interference to electrical products.
実施例の説明
以下、本発明の一実施例について添付図面に基
づいて説明する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings.
第２図〜第４図において、１１は筐体、１２は
筐体１１内上部に配置した加熱コイル、１３は筐
体１１に載置された鍋である。１４は半導体部
品、１５は半導体部品１４の放熱フイン、１６は
電気部品、１７は半導体部品１４および電気部品
１６を装着したプリント基板である。放熱フイン
１５は非磁性体であるアルミニウムあるいは銅等
により形成され、加熱コイル１２と半導体部品１
４やプリント基板１７との間に位置して半導体部
品１４、プリント基板１７を覆い、加熱コイル１
２から発生した磁束が半導体部品１４、プリント
基板１７電気部品１６にかからないようになつて
いる。 In FIGS. 2 to 4, 11 is a housing, 12 is a heating coil placed in the upper part of the housing 11, and 13 is a pot placed on the housing 11. 14 is a semiconductor component, 15 is a heat radiation fin for the semiconductor component 14, 16 is an electrical component, and 17 is a printed circuit board on which the semiconductor component 14 and the electrical component 16 are mounted. The heat radiation fin 15 is made of non-magnetic material such as aluminum or copper, and is connected to the heating coil 12 and the semiconductor component 1.
The heating coil 1 is located between the semiconductor component 14 and the printed circuit board 17 and covers the semiconductor component 14 and the printed circuit board 17.
The magnetic flux generated from the semiconductor component 14, printed circuit board 17, and electrical component 16 is prevented from being applied to the semiconductor component 14, printed circuit board 17, and electrical component 16.
従つて、加熱コイル１２から発生する磁束によ
つて半導体部品１４や電気部品１６、さらにはリ
ード線等に誘起電圧が発生せず、他の電気製品に
雑音障害として悪影響を与えることが少ない。 Therefore, the magnetic flux generated from the heating coil 12 does not generate induced voltage in the semiconductor components 14, the electrical components 16, or even the lead wires, so that other electrical products are less likely to be adversely affected by noise interference.
発明の効果
以上の説明から明らかなように、本発明によれ
ば、電気部品の放熱体によつて、加熱コイルから
発生する磁束が電気部品に及ばないようにしてな
るので、シールド用の特別な部材を用いなくても
誘起電圧の発生を抑えることができ、この結果、
他の電気製品に雑音障害として悪影響を及ぼすこ
とが少ない。また、各種電気部品をプリント基板
上に配してそのプリント基板上を放熱体により磁
気シールドしているため、不要な部分にまで放熱
体を延設することがなく、最小限の大きさで磁気
シールドを確実に行える。Effects of the Invention As is clear from the above explanation, according to the present invention, the magnetic flux generated from the heating coil is prevented from reaching the electrical components by the heat radiating body of the electrical components. The generation of induced voltage can be suppressed without using any parts, and as a result,
There is little negative impact on other electrical products as noise interference. In addition, various electrical components are arranged on a printed circuit board, and the printed circuit board is magnetically shielded by a heat sink, so there is no need to extend the heat sink to unnecessary areas, and the magnetic field is kept to a minimum size. Shielding can be done reliably.
第１図は従来の誘導加熱装置の概略断面図、第
２図は本発明の一実施例を示す誘導加熱装置の概
略断面図、第３図は同要部の一部欠截斜視図、第
４図は同要部斜視図である。
１２……筐体、１４……半導体部品、１５……
放熱フイン、１６……電気部品。
FIG. 1 is a schematic cross-sectional view of a conventional induction heating device, FIG. 2 is a schematic cross-sectional view of an induction heating device showing an embodiment of the present invention, FIG. Figure 4 is a perspective view of the same essential parts. 12... Housing, 14... Semiconductor parts, 15...
Heat dissipation fin, 16...Electrical component.
Claims (1)
に配置された整流器などの複数の電気部品と、前
記複数の電気部品のうち冷却を必要とする部品に
接触して設けられた非磁性物質からなる放熱体
と、前記複数の電気部品間を電気的に接続したプ
リント基板とを備え、前記放熱体は前記加熱コイ
ルと前記複数の電気部品およびプリント基板間に
位置し、かつ、前記加熱コイルからの磁束が前記
複数の電気部品およびプリント基板に及ばないよ
うに遮蔽する構成とした誘導加熱装置。1 Consisting of a heating coil, multiple electrical components such as a rectifier placed in the magnetic flux generation area of the heating coil, and a non-magnetic material provided in contact with the component that requires cooling among the multiple electrical components. A heat radiator and a printed circuit board that electrically connects the plurality of electrical components, the heat radiator is located between the heating coil and the plurality of electrical components and the printed circuit board, and the heat radiator is located between the heating coil and the plurality of electrical components and the printed circuit board, and An induction heating device configured to shield magnetic flux from reaching the plurality of electrical components and the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15211183A JPS6044994A (en) | 1983-08-20 | 1983-08-20 | Induction heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15211183A JPS6044994A (en) | 1983-08-20 | 1983-08-20 | Induction heater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6044994A JPS6044994A (en) | 1985-03-11 |
| JPH0363195B2 true JPH0363195B2 (en) | 1991-09-30 |
Family
ID=15533295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15211183A Granted JPS6044994A (en) | 1983-08-20 | 1983-08-20 | Induction heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6044994A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718159Y2 (en) * | 1988-12-09 | 1995-04-26 | 松下電器産業株式会社 | Induction heating cooker |
| JP4716942B2 (en) * | 2006-07-11 | 2011-07-06 | 三菱電機株式会社 | Induction heating cooker |
-
1983
- 1983-08-20 JP JP15211183A patent/JPS6044994A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6044994A (en) | 1985-03-11 |
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