JPH03200355A - Resin sealing semiconductor device - Google Patents

Resin sealing semiconductor device

Info

Publication number
JPH03200355A
JPH03200355A JP24129089A JP24129089A JPH03200355A JP H03200355 A JPH03200355 A JP H03200355A JP 24129089 A JP24129089 A JP 24129089A JP 24129089 A JP24129089 A JP 24129089A JP H03200355 A JPH03200355 A JP H03200355A
Authority
JP
Japan
Prior art keywords
heat radiation
exposed surface
radiation block
layer
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24129089A
Other languages
Japanese (ja)
Inventor
Tetsuo Muramatsu
哲雄 村松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP24129089A priority Critical patent/JPH03200355A/en
Publication of JPH03200355A publication Critical patent/JPH03200355A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To discharge gas efficiently and to improve bonding strength by exposing a partial surface of an internal heat radiation block to one end surface of a resin coating member, and proving a lattice-shaped continuous uneven part on the exposed surface of the heat radiation block. CONSTITUTION:A title device comprises a convex part 1 provided on a heat radiation block exposed surface, a resin coating member 2, an external electrode terminal 3, a printed board 4, a solder layer 5, a metallized layer 6, a groove 7, a semiconductor chip 8, and a connection wiring 9. The convex part 1 provided on the heat radiation block exposed surface is bonded with the metallized layers on the printed board 4 such that it bites the solder layer 5. Any gas produced upon bonding with the solder layer 5 is discharged through the groove 7 formed on a concave part between the convex parts. Thus, any void in the solder bonding layer produced upon mounting can be reduced and a heat radiation block exposed surface area can be increased. Hereby, bonding strength is improved and efficient gas discharge is attained.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は主に樹脂封止型半導体装置に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention mainly relates to a resin-sealed semiconductor device.

従来の技術 従来の半導体装置は、プリント基板への実装の際に、外
部電極端子のみを半田で接着して固定するのが通例であ
り、内部放熱ブロックの露出面はプリント基板とは逆の
面、すなわち、装置上面に位置させる形態が多かった。Conventional technology When a conventional semiconductor device is mounted on a printed circuit board, it is customary to bond and fix only the external electrode terminals with solder, and the exposed surface of the internal heat dissipation block is on the opposite side of the printed circuit board. In other words, it was often located on the top surface of the device.

最近、放熱ブロックの露出面を直接プリント基板に半田
接着し、放熱性を高める構造のものが提案された。Recently, a structure has been proposed in which the exposed surface of a heat dissipation block is directly soldered to a printed circuit board to improve heat dissipation.

発明が解決しようとする課題 放熱ブロック露出面をプリント基板に半田接着する場合
、 （１）放熱板面とプリント基板間の半田層内のガス抜き
がしにくい。Problems to be Solved by the Invention When the exposed surface of a heat dissipation block is soldered to a printed circuit board, (1) It is difficult to vent gas in the solder layer between the heat dissipation plate surface and the printed circuit board.

（２）半田接着強度が弱い。(2) Solder bond strength is weak.

という問題点があった。There was a problem.

課題を解決するための手段 本発明は放熱ブロック露出面に格子状に連続した凹凸を
設けることによって半田層内のガス抜きを容易にし、さ
らに接着面の増大により接着強度を高めることを可能に
したものである。Means for Solving the Problems The present invention makes it easy to vent gas in the solder layer by providing continuous unevenness in a grid pattern on the exposed surface of the heat dissipation block, and also makes it possible to increase the adhesive strength by increasing the adhesive surface. It is something.

作用 上記構造によれば、格子状に設けられた溝がガス抜きの
バスとなり、実装時に発生するガスを効率的に外部に放
出することができる。Effects According to the above structure, the grooves provided in a lattice shape serve as degassing buses, and the gas generated during mounting can be efficiently discharged to the outside.

また、前記ブロックの露出面の凹凸は露出面の面積を増
大させ、とくに凸部側面が半田接着強度を高めることに
役立つ。Moreover, the unevenness of the exposed surface of the block increases the area of the exposed surface, and the side surfaces of the convex portions in particular are useful for increasing the solder bonding strength.

実施例 以下に本発明の一実施例を図面に基づき説明する。Example An embodiment of the present invention will be described below based on the drawings.

第１図は本発明の実施例を示す半導体装置の斜視図であ
る。この図において、１は放熱ブロック露出面に設けら
れた凸部、２は樹脂被覆体、３は外部電極端子である。FIG. 1 is a perspective view of a semiconductor device showing an embodiment of the present invention. In this figure, 1 is a convex portion provided on the exposed surface of the heat dissipation block, 2 is a resin coating, and 3 is an external electrode terminal.

第２図は半導体装置をプリント基板４に半田付けしたと
きの接合部の断面図である。放熱ブロック露出面に設け
られた凸部１が、半田層５にくい込む型でプリント基板
４上のメタライズ層６に接着がなされている。また、半
田層２で接着する際に発生するガスは、凸部間の凹所で
形成された溝７を通してアウトガスがなされる。なお、
第２図中、８は半導体チップ、９は接続細線（ワイヤ）
である。FIG. 2 is a cross-sectional view of the joint portion when the semiconductor device is soldered to the printed circuit board 4. As shown in FIG. A convex portion 1 provided on the exposed surface of the heat dissipation block is bonded to a metallized layer 6 on a printed circuit board 4 by sinking into a solder layer 5. Furthermore, gas generated during bonding with the solder layer 2 is outgassed through the grooves 7 formed in the recesses between the convex parts. In addition,
In Figure 2, 8 is a semiconductor chip, 9 is a thin connection wire (wire)
It is.

発明の効果 本発明によれば、実装時の半田接着層のボイドを低減せ
しめ、放熱ブロック面の露出面積を大きくすることで、
接着の信頼性を高めると同時に効率の良い放熱性を安定
して得ることができる。Effects of the Invention According to the present invention, by reducing voids in the solder adhesive layer during mounting and increasing the exposed area of the heat dissipation block surface,
It is possible to improve the reliability of adhesion and at the same time to stably obtain efficient heat dissipation.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す半導体装置の斜視図、
第２図は同半導体装置とプリント基板との接合部断面図
である。 １・・・・・・凸部、２・・・・・・樹脂被覆体、３・
・・・・・外部電極端子、４・・・・・・プリント基板
、５・・・・・・半田層、６・・・・・・溝、７・・・
・・・メタライズ層。FIG. 1 is a perspective view of a semiconductor device showing an embodiment of the present invention;
FIG. 2 is a sectional view of a joint between the semiconductor device and a printed circuit board. 1...Convex portion, 2...Resin coating, 3.
...External electrode terminal, 4...Printed circuit board, 5...Solder layer, 6...Groove, 7...
...metalized layer.

Claims (2)

【特許請求の範囲】[Claims] （１）内部放熱ブロックを有し、この放熱ブロックの一
部の面が樹脂被覆体の一端面に露出するとともに、その
露出した放熱ブロックの面が格子状に連続した凹凸を有
することを特徴とする樹脂封止型半導体装置。(1) It has an internal heat dissipation block, a part of the surface of this heat dissipation block is exposed to one end surface of the resin coating, and the exposed surface of the heat dissipation block has a continuous unevenness in a grid pattern. Resin-sealed semiconductor device. （２）前記突起部の厚みを０．１ｍｍ〜５ｍｍの範囲に
設定された請求項１記載の樹脂封止型半導体装置。(2) The resin-sealed semiconductor device according to claim 1, wherein the thickness of the protrusion is set in a range of 0.1 mm to 5 mm.
JP24129089A 1989-09-18 1989-09-18 Resin sealing semiconductor device Pending JPH03200355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24129089A JPH03200355A (en) 1989-09-18 1989-09-18 Resin sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24129089A JPH03200355A (en) 1989-09-18 1989-09-18 Resin sealing semiconductor device

Publications (1)

Publication Number Publication Date
JPH03200355A true JPH03200355A (en) 1991-09-02

Family

ID=17072070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24129089A Pending JPH03200355A (en) 1989-09-18 1989-09-18 Resin sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPH03200355A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015056608A (en) * 2013-09-13 2015-03-23 株式会社東芝 Semiconductor package and semiconductor device
JP2015212733A (en) * 2014-05-01 2015-11-26 日本電信電話株式会社 Semiconductor substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015056608A (en) * 2013-09-13 2015-03-23 株式会社東芝 Semiconductor package and semiconductor device
JP2015212733A (en) * 2014-05-01 2015-11-26 日本電信電話株式会社 Semiconductor substrate

Similar Documents

Publication Publication Date Title
JP2881575B2 (en) Ball grid array semiconductor package with heat sink
JP2002076252A (en) Semiconductor device
US6930397B2 (en) Surface mounted package with die bottom spaced from support board
JPH06177295A (en) Hybrid integrated circuit
JP2784522B2 (en) Electronic component mounting substrate and method of manufacturing the same
JPS6042620B2 (en) Semiconductor device encapsulation
JPH03200355A (en) Resin sealing semiconductor device
JPH07130916A (en) Sealing case for electric product
JPH05211256A (en) Semiconductor device
JP2524482B2 (en) QFP structure semiconductor device
JPS63190363A (en) Power package
JPH07263618A (en) Hybrid integrated circuit device
JPH08148647A (en) Semiconductor device
JPH065769A (en) Laminated film base material and lead frame for mounting electronic circuit element employing the film base material
JP2612468B2 (en) Substrate for mounting electronic components
JPH04144162A (en) Semiconductor device
JPS63284831A (en) Manufacture of hybrid integrated circuit
JPH056714Y2 (en)
JP3136274B2 (en) Semiconductor device
JP3295987B2 (en) Method for manufacturing semiconductor device
JPH07226454A (en) Semiconductor device
JP2739349B2 (en) Substrate for mounting electronic components
JP2532400Y2 (en) Hybrid IC
JP3714808B2 (en) Semiconductor device
JP2504262Y2 (en) Semiconductor module