JPH03181204A - Band-pass filter - Google Patents
Band-pass filterInfo
- Publication number
- JPH03181204A JPH03181204A JP31999589A JP31999589A JPH03181204A JP H03181204 A JPH03181204 A JP H03181204A JP 31999589 A JP31999589 A JP 31999589A JP 31999589 A JP31999589 A JP 31999589A JP H03181204 A JPH03181204 A JP H03181204A
- Authority
- JP
- Japan
- Prior art keywords
- resonators
- conductors
- transmission line
- ground
- capacitors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 15
- 239000003990 capacitor Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 230000008878 coupling Effects 0.000 abstract description 8
- 238000010168 coupling process Methods 0.000 abstract description 8
- 238000005859 coupling reaction Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種通信機器やコードレス電話等に用いられ
る高周波用のバンドパスフィルタに関する？
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a high frequency bandpass filter used in various communication devices, cordless telephones, etc. It is something.
従来の技術
従来のスプリット・リング共振器を用いた高周波用のバ
ンドパスフィルタについて、第２図（ａ）。2. Description of the Related Art FIG. 2(a) shows a high frequency bandpass filter using a conventional split ring resonator.
（ｂｌと第３図を用いて簡単に説明する。絶縁基板１３
の片方の全面を接地導体１６とし、他方の面に複数の伝
送線路１，２を形成し、その両開放端々々に共振用コン
デンサ３．４を接続して共振回路を形成し、前記伝送線
路１，２の一開放端近傍と接地導体１６６各々にインピ
ーダンス整合用コンデンサ７．８を接続して共振器５．
６を形成し、前記伝送線路１．２各々の一辺を近接結合
させた構成となっている。この高周波用バンドパスフィ
ルタの周波数応答特性を第３図の点線１７に示す。(This will be briefly explained using BL and FIG. 3.
A ground conductor 16 is formed on one entire surface of the transmission line, a plurality of transmission lines 1 and 2 are formed on the other surface, and a resonant capacitor 3.4 is connected to each open end of the transmission line 1 to form a resonant circuit. An impedance matching capacitor 7.8 is connected near one open end of the resonator 5.1, 2 and the ground conductor 166, respectively.
6 is formed, and one side of each of the transmission lines 1.2 is closely coupled. The frequency response characteristic of this high frequency bandpass filter is shown by the dotted line 17 in FIG.
発明が解決しようとする課題
上述の従来の構成では、第３図の点線１７に示す通り周
波数応答特性の高域側の減衰特性が良好とは言えない。Problems to be Solved by the Invention In the conventional configuration described above, the attenuation characteristic on the high frequency side of the frequency response characteristic cannot be said to be good, as shown by the dotted line 17 in FIG.
これは共振器５と６間の容量結合が強いためであり共振
器５と６の距離を離せば改善されるが挿入損失も増大す
る。This is because the capacitive coupling between the resonators 5 and 6 is strong, and although this can be improved by increasing the distance between the resonators 5 and 6, the insertion loss also increases.
本発明は、上記課題の対策として挿入損失を増大させる
ことなく周波数応答特性の高域側の減衰特性を改善する
ために容量結合を小さくしたバンドパスフィルタを提供
するものである。The present invention provides a bandpass filter in which capacitive coupling is reduced in order to improve the attenuation characteristic on the high frequency side of the frequency response characteristic without increasing the insertion loss as a countermeasure to the above-mentioned problem.
課題を解決するための手段
上記課題を解決するために本発明は、絶縁基板の片側の
接地導体を他面に形成した各々の共振回路に対応するよ
うに構成したものである。Means for Solving the Problems In order to solve the above problems, the present invention is configured to correspond to each resonant circuit in which the ground conductor on one side of an insulating substrate is formed on the other side.
作用
上述のように、接地導体を分離することによって、一方
の共振器から接地導体を経由して他方の共振器へ結合し
ていた容量結合がなくなるので共振器間の容量結合が小
さくなり周波数応答特性の高域側の減衰特性が改善され
たバンドパスフィルタが可能となる。Effect As mentioned above, by separating the ground conductor, the capacitive coupling from one resonator to the other resonator via the ground conductor is eliminated, which reduces the capacitive coupling between the resonators and improves the frequency response. A bandpass filter with improved attenuation characteristics on the high frequency side becomes possible.
実施例
以下、本発明の一実施例について図面を用いて説明する
。第１図の（ａ）は、本発明の一実施例におけるバンド
パスフィルタの平面図、（ｂ）は平面図のＡ−Ａ’断面
図であり、第３図は周波数応答特性を示す図面である。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1(a) is a plan view of a bandpass filter according to an embodiment of the present invention, FIG. 1(b) is a sectional view taken along line AA' of the plan view, and FIG. 3 is a drawing showing frequency response characteristics. be.
絶縁基板１３の片方の面に形成した複数の多重スパイラ
ルの伝送線路１．２の各々の両開放端に共振用コンデン
サ３．４を接続した共振回路を複数形成し、他方の面に
は前記共振回路と各々対向する部分に分離された接地導
体１４．１５を設け、伝送線路１．２各々の一開放端近
傍を対向する接地導体１４．１５間にインピーダンス整
合用コンデンサ７．８を各々接続し、このインピーダン
ス整合用コンデンサ７．８の接地導体１４．１５側の近
傍にアース端子１１．１２を各々設け、伝送線路１，２
の略中間点に入出力端子９．１０を各々設けてなる複数
の共振器５，６を形成し、伝送線路１，２の各々の一辺
を近傍結合させて高周波用のバンドパスフィルタを構成
したものである。A plurality of resonant circuits are formed in which resonant capacitors 3.4 are connected to both open ends of each of a plurality of multi-spiral transmission lines 1.2 formed on one surface of the insulating substrate 13, and the resonant circuits are connected to the resonant capacitors 3.4 on the other surface. Separate grounding conductors 14.15 are provided in portions facing the circuit, and impedance matching capacitors 7.8 are connected between the opposing grounding conductors 14.15 near one open end of each transmission line 1.2. , ground terminals 11.12 are provided near the ground conductor 14.15 side of the impedance matching capacitor 7.8, and transmission lines 1, 2 are connected to each other.
A plurality of resonators 5 and 6 each having an input/output terminal 9 and 10 are formed at approximately the midpoint of , and one side of each of the transmission lines 1 and 2 is closely coupled to form a high-frequency bandpass filter. It is something.
つまり、接地導体を１４と１５に分離させて共振器５と
６に対向させる構成とすることで、共振器５と６間の接
地導体を経由する容量結合を低減することができるため
周波数応答特性の高域側の減衰特性を第３図の点線１７
から実線１８のように改善することができる。In other words, by configuring the ground conductor to be separated into 14 and 15 and facing the resonators 5 and 6, capacitive coupling via the ground conductor between the resonators 5 and 6 can be reduced, resulting in frequency response characteristics. The attenuation characteristics on the high frequency side are shown by the dotted line 17 in Figure 3.
can be improved as shown by the solid line 18.
発明の効果
以上のような本発明は、複数の共振器と対向する部分に
形成する接地導体を分離した構成のバンドパスフィルタ
とすることで、共振器間の電磁結合を低減させることな
く容量結合を低減させ周波数応答特性の高域側の減衰特
性を簡単に改善させられることになり、工業的価値の大
なるものである。Effects of the Invention The present invention, as described above, has a bandpass filter in which the ground conductor formed in the part facing the plurality of resonators is separated, thereby reducing capacitive coupling without reducing electromagnetic coupling between the resonators. This makes it possible to easily improve the attenuation characteristics on the high frequency side of the frequency response characteristics, which is of great industrial value.
第１図のｆａｌは本発明の一実施例におけるバンドパス
フィルタの平面図、第１図のｆｂｌは第１図（ａｌのＡ
−Ａ’の断面図、第２図の（ａｌは従来例のバンド１．
２・・・・・・伝送回路、３．４・・・・・・共振用コ
ンデンサ、５．６・・・・・・共振器、７．８・・・・
・・インピーダンスマツチング用コンデンサ、９．１０
・・・・・・入出力端子、１１．１２・・・・・・アー
ス端子、１３・・・・・・絶縁基板、１４．１５・・・
・・・接地導体、１７．１８・・・・・・周波数応答特
性。fal in FIG. 1 is a plan view of a bandpass filter in one embodiment of the present invention, and fbl in FIG.
-A' cross-sectional view of FIG. 2 (al is the conventional band 1.
2...Transmission circuit, 3.4...Resonance capacitor, 5.6...Resonator, 7.8...
... Impedance matching capacitor, 9.10
...Input/output terminal, 11.12... Earth terminal, 13... Insulating board, 14.15...
...Grounding conductor, 17.18...Frequency response characteristics.
Claims (1)
の伝送線路を形成し、前記伝送線路の両開放端に共振用
コンデンサを接続した共振回路を複数個形成し、絶縁基
板の他方の面には前記共振回路と各々対向する部分に分
離された接地導体を設け、前記伝送線路の一開放端近傍
と対向する接地導体間に各々インピーダンス整合用コン
デンサを接続し、このインピーダンス整合用コンデンサ
の接地導体側の近傍に各々アース端子を設け、前記伝送
線路の略中間点に入出力端子を各々設けて成る共振器を
複数形成し、前記両伝送線路の一辺を近傍結合させたバ
ンドパスフィルタ。A substantially U-shaped or multi-spiral transmission line is formed on one side of the insulating substrate, a plurality of resonant circuits are formed with resonance capacitors connected to both open ends of the transmission line, and a plurality of resonant circuits are formed on the other side of the insulating substrate. Separate ground conductors are provided on the surface at portions facing the resonant circuit, and impedance matching capacitors are connected between the ground conductors facing near one open end of the transmission line, and the impedance matching capacitors are A bandpass filter in which a plurality of resonators are formed, each having a ground terminal near the grounding conductor side and an input/output terminal provided approximately at the midpoint of the transmission line, and one side of both of the transmission lines are closely coupled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31999589A JPH0738524B2 (en) | 1989-12-08 | 1989-12-08 | Bandpass filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31999589A JPH0738524B2 (en) | 1989-12-08 | 1989-12-08 | Bandpass filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03181204A true JPH03181204A (en) | 1991-08-07 |
| JPH0738524B2 JPH0738524B2 (en) | 1995-04-26 |
Family
ID=18116576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31999589A Expired - Fee Related JPH0738524B2 (en) | 1989-12-08 | 1989-12-08 | Bandpass filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0738524B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012500583A (en) * | 2008-08-19 | 2012-01-05 | クリー インコーポレイテッド | Integrated circuit with parallel sets of transistor amplifiers with different turn-on power levels |
-
1989
- 1989-12-08 JP JP31999589A patent/JPH0738524B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012500583A (en) * | 2008-08-19 | 2012-01-05 | クリー インコーポレイテッド | Integrated circuit with parallel sets of transistor amplifiers with different turn-on power levels |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0738524B2 (en) | 1995-04-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |