JPH0290411A - Zero resistance element - Google Patents
Zero resistance elementInfo
- Publication number
- JPH0290411A JPH0290411A JP24136988A JP24136988A JPH0290411A JP H0290411 A JPH0290411 A JP H0290411A JP 24136988 A JP24136988 A JP 24136988A JP 24136988 A JP24136988 A JP 24136988A JP H0290411 A JPH0290411 A JP H0290411A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- resistance element
- zero
- zero resistance
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 150000002739 metals Chemical class 0.000 claims abstract description 6
- 239000011810 insulating material Substances 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 3
- 229910052737 gold Inorganic materials 0.000 claims abstract description 3
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 3
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 3
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 3
- 229910052718 tin Inorganic materials 0.000 claims abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 229910052715 tantalum Inorganic materials 0.000 claims abstract 2
- 229910052719 titanium Inorganic materials 0.000 claims abstract 2
- 229910052720 vanadium Inorganic materials 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 2
- -1 metals such as n Chemical class 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 239000007769 metal material Substances 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 239000012212 insulator Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、基板上の配線を簡素化する配線材料に関する
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a wiring material that simplifies wiring on a substrate.
（従来の技術）
従来、プリント基板上の配線は銅張り基板を使用し、こ
れに配線のパターニングを行ないエツチングして製作さ
れている。(Prior Art) Conventionally, wiring on a printed circuit board has been manufactured by using a copper-clad board, patterning the wiring thereon, and etching the wiring.
配線の信頼性を向上させるために銅の上にニッケルある
いは金等をメシキして使用することもある。In order to improve the reliability of wiring, nickel or gold may be coated on top of copper.
しかし、近年、基板上の配線が高密度化され、従来の配
線技術では一枚の基板の中に配線が収容しきれなくなり
、多層配線技術、モジュール化による立体配線技術等が
開発され多用されるようになった。However, in recent years, the density of wiring on boards has become higher, and conventional wiring technology can no longer accommodate all the wiring on a single board, so multilayer wiring technology, three-dimensional wiring technology based on modularization, etc. have been developed and are often used. It became so.
一方、基板上の配線の高密度化に対応するため零抵抗素
子を用いて配線の短縮化が行なわれている。On the other hand, in order to cope with the increase in the density of wiring on a substrate, wiring is being shortened by using zero-resistance elements.
これは配、線間に他の配線が形成されているような場合
、この他の配線に接触させないように複雑に迂回した配
線を形成しなければならないことが多い。この場合、邪
魔になる配線の上を絶縁された零抵抗素子でブリッジ接
続すれば、複雑に迂回した配線の必要がなく配線の短縮
化が可能であり配線の高密度化に対応できる。This is because, in cases where other wiring is formed between wiring lines, it is often necessary to form wiring lines with complicated detours so as not to come into contact with these other wiring lines. In this case, if an insulated zero-resistance element is bridge-connected over the wiring that gets in the way, there is no need for complicated wiring detours, the wiring can be shortened, and it is possible to cope with higher wiring density.
このような目的を達成するために零抵抗素子が、使用さ
れいてる。Zero resistance elements are used to achieve this purpose.
一般に、５抵抗素子はセラミックスの碍子の表面に抵抗
被膜を着膜したのち、キャッピングを行ない外装を絶縁
塗装して製造されている。□当然のことであるが、抵抗
素子には一定の抵抗値が必要である。Generally, a 5-resistance element is manufactured by depositing a resistance coating on the surface of a ceramic insulator, capping it, and coating the exterior with an insulating coating. □Of course, the resistance element must have a certain resistance value.
しかし、零抵抗素子の用途は一種の配線材料であるため
、その抵抗は限りなく零であることが好ましい。したが
って、現在の零抵抗素子はセラミックスの碍子の表面に
ニッケルメッキの皮膜を着膜し、かつ、抵抗値を下げる
ために膜厚を極めて厚くしたものを使用している。However, since the zero-resistance element is used as a kind of wiring material, it is preferable that its resistance be as close to zero as possible. Therefore, current zero-resistance elements use ceramic insulators with a nickel plating film deposited on the surface, and the film thickness is extremely thick in order to lower the resistance value.
しかし、皮膜を厚くすると皮膜内部に歪が発生し、その
歪によって碍子から皮膜が剥離し易く素子の信頼性に欠
ける欠点がある。However, when the film is made thicker, distortion occurs inside the film, and the film tends to peel off from the insulator due to the distortion, resulting in a disadvantage that the device lacks reliability.
また、皮膜を厚く着膜するためには、極めて長い着脱時
間が必要であり、そのため製造コストが高くなる欠点が
ある。Furthermore, in order to deposit a thick film, an extremely long time is required for attachment and detachment, which has the disadvantage of increasing manufacturing costs.
（解決しようとする問題点）
本発明は、上記の欠点を除去し、極めて安価な零抵抗素
子を提供しようとするものである。(Problems to be Solved) The present invention aims to eliminate the above-mentioned drawbacks and provide an extremely inexpensive zero-resistance element.
（問題を解決するための手段）
本発明は、碍子に抵抗皮膜を厚く着膜する方法ではなく
、元素、抵抗値が小さい金属あるいは合金を零抵抗素子
として使用することによって目的を達成しようとするも
のである。(Means for Solving the Problem) The present invention attempts to achieve the object by using an element, a metal or an alloy with a small resistance value as a zero-resistance element, rather than by depositing a thick resistance film on an insulator. It is something.
次に本発明になる零抵抗素子の製造方法を詳細に説明す
る。Next, a method for manufacturing a zero resistance element according to the present invention will be explained in detail.
所定寸法の径の棒状金属材料あるいは合金材料を所定寸
法にカッティングする。カッティングされたこれらの材
料は抵抗器キャップに挿入される形状に研磨したのちキ
ャッピングする。キャップにはリード線を溶接すること
もあるが、リード線をつけない場合もある。A rod-shaped metal material or alloy material with a predetermined diameter is cut into a predetermined size. These cut materials are ground into a shape that will be inserted into the resistor cap, and then capped. Sometimes a lead wire is welded to the cap, but sometimes no lead wire is attached.
このようにして製造された素子は表面を樹脂、ガラス等
の絶縁物で絶縁塗装する。The surface of the element manufactured in this manner is coated with an insulating material such as resin or glass.
零抵抗素子として使用し得る金属材料は、ＡＱ。A metal material that can be used as a zero resistance element is AQ.
ＡＩ、Ａｕ、Ｃｏ、Ｃｒ、Ｃｕ、Ｆｅ、Ｍｎ。AI, Au, Co, Cr, Cu, Fe, Mn.
ＭＯｌＮｌ、Ｐｄ、Ｐｔ、Ｓｎ、Ｔａ１Ｔｉ、ＶＷ、Ｚ
ｎ等の金属あるいはこれらの金属を含む二種以上の合金
である。MOLNl, Pd, Pt, Sn, Ta1Ti, VW, Z
It is a metal such as n or an alloy of two or more types containing these metals.
これらの金属材料はできる限り抵抗値が小さく安価なも
のが好ましい。It is preferable that these metal materials have as low a resistance value as possible and are inexpensive.
第１図は基板上に作成された従来の配線図の一例である
。FIG. 1 is an example of a conventional wiring diagram created on a board.
配線は他の配線と接触しないようにＩＣや抵抗器、コン
デンサ等の受動素子の下面を複雑に迂回して配線されて
いる。また、ＡＢ間はどうしても配線が横切って交叉す
るため、ＡとＢをスルホールとし基板の裏側に配線しで
ある。The wiring is routed around the lower surface of passive elements such as ICs, resistors, and capacitors in a complicated manner so as not to come into contact with other wiring. Furthermore, since the wiring inevitably crosses between AB, A and B are made through holes and wired on the back side of the substrate.
第２図は第１図の配線図を本発明になる零抵抗素子を用
いて配線した配線図である。FIG. 2 is a wiring diagram in which the wiring diagram of FIG. 1 is wired using a zero resistance element according to the present invention.
自由に配線の交叉が可能で極めて配線を簡素化すること
ができる。また、スルホールの必要もなくなる。Wiring can be freely crossed, and wiring can be extremely simplified. Also, there is no need for through holes.
実際の配線図はもつと複雑なものであり、配線が複雑に
なればなる捏水発明の効果は大きくなる。Actual wiring diagrams are complicated, and the more complicated the wiring, the greater the effect of the invention.
（実施例１）
１．２ｍｍφの銅の棒を５ｍｍの長さにカットした。抵
抗器キャップに挿入し得る形状に研磨したのち、深さ１
ｍｍのキャップを素子の両端に圧入した。さらに外装と
してエポキシ樹脂で絶縁塗装した。(Example 1) A copper rod with a diameter of 1.2 mm was cut into a length of 5 mm. After polishing into a shape that can be inserted into the resistor cap,
mm caps were press-fitted onto both ends of the device. Furthermore, the exterior was insulated with epoxy resin.
このようにして製造した零抵抗素子の抵抗値は０．４ｍ
Ω以下であった。The resistance value of the zero resistance element manufactured in this way is 0.4 m.
It was less than Ω.
一般に、この形状の零抵抗素子の抵抗値は１０ｍΩ以下
とされているので、充分に実用に供し得る零抵抗素子で
あることがわかった。Generally, the resistance value of a zero-resistance element of this shape is set to be 10 mΩ or less, so it was found that the zero-resistance element is sufficiently usable for practical use.
（実施例２）
１．２ｍｍφのニクロム（Ｎ ｉ ： Ｃｒ＝８０ ：
２０ｗｔ％）の棒を５ｍｍの長さにカットした。(Example 2) 1.2 mmφ nichrome (N i : Cr=80:
(20 wt%) was cut into a length of 5 mm.
抵抗器キャップに挿入し得る形状に研磨したのち、深さ
１ｍｍのキャップを素子の両端に圧入した。After polishing into a shape that could be inserted into a resistor cap, caps with a depth of 1 mm were press-fitted onto both ends of the element.
さらに外装としてエポキシ樹脂で絶縁塗装した。Furthermore, the exterior was insulated with epoxy resin.
このようにして製造した零抵抗素子の抵抗値は６ｍΩ以
下であり、充分に実用に供し得るものであることがわか
った。It was found that the resistance value of the zero-resistance element manufactured in this manner was 6 mΩ or less, and that it was sufficiently usable for practical use.
（発明の効果）
本発明によれば、零抵抗皮膜として厚い皮膜を使用せず
、抵抗値が極めて低い金属あるいは合金を使用している
ため、素子の信頼性が高い特徴がある。(Effects of the Invention) According to the present invention, a metal or alloy having an extremely low resistance value is used instead of using a thick film as a zero-resistance film, so that the device has a feature of high reliability.
また、セラミックスの碍子はキャップを圧入す４゜
るときよく折れる欠点があるが、本発明になる素子はじ
ん性が大きいためこのよう欠点がない特徴がある。Furthermore, ceramic insulators have the disadvantage that they often break when the cap is press-fitted by 4 degrees, but the element of the present invention has a characteristic of not having such defects because of its high toughness.
さらに、皮膜の着膜工程が不用であるため、製造コスト
が極めて安価である利点がある。Furthermore, since a step of forming a film is unnecessary, there is an advantage that the manufacturing cost is extremely low.
第１図は基板上に作成された従来の配線図である。
図において、１−１．１−２はＩＣ，２−１，２−２，
２−３，２−４，２−５は抵抗器、コンデンサ等の受動
素子である。
第２図は第１図の配線図を本発明になる零抵抗素子を用
いて配線した配線図である。
図において、３−１．３−２．３−３．３−４は零抵抗
素子である。FIG. 1 is a conventional wiring diagram created on a board. In the figure, 1-1.1-2 is IC, 2-1, 2-2,
2-3, 2-4, and 2-5 are passive elements such as resistors and capacitors. FIG. 2 is a wiring diagram in which the wiring diagram of FIG. 1 is wired using a zero resistance element according to the present invention. In the figure, 3-1.3-2.3-3.3-4 is a zero resistance element.
Claims (1)
ｏ、Ｎｉ、Ｐｄ、Ｐｔ、Ｓｎ、Ｔａ、Ｔｉ、Ｖ、Ｗ、Ｚ
ｎ等の金属のうち一種あるいはこれらの金属を含む二種
以上の合金を零抵抗素子とし、当該素子をキャッピング
し、絶縁物で塗装したことを特徴とする零抵抗素子。Ag, Al, Au, Co, Cr, Cu, Fe, Mn, M
o, Ni, Pd, Pt, Sn, Ta, Ti, V, W, Z
A zero-resistance element is characterized in that the zero-resistance element is made of one kind of metals such as metals such as n, or an alloy of two or more kinds containing these metals, and the element is capped and coated with an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24136988A JPH0290411A (en) | 1988-09-27 | 1988-09-27 | Zero resistance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24136988A JPH0290411A (en) | 1988-09-27 | 1988-09-27 | Zero resistance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0290411A true JPH0290411A (en) | 1990-03-29 |
Family
ID=17073266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24136988A Pending JPH0290411A (en) | 1988-09-27 | 1988-09-27 | Zero resistance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0290411A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57211203A (en) * | 1981-06-22 | 1982-12-25 | Sumitomo Electric Industries | Fixed resistor type resistanceless part automatically attachable to printed board |
| JPS6323780B2 (en) * | 1979-11-21 | 1988-05-18 | Tokyo Shibaura Electric Co |
-
1988
- 1988-09-27 JP JP24136988A patent/JPH0290411A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6323780B2 (en) * | 1979-11-21 | 1988-05-18 | Tokyo Shibaura Electric Co | |
| JPS57211203A (en) * | 1981-06-22 | 1982-12-25 | Sumitomo Electric Industries | Fixed resistor type resistanceless part automatically attachable to printed board |
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