JPH02271977A - Method for curing cement product - Google Patents

Method for curing cement product

Info

Publication number
JPH02271977A
JPH02271977A JP9118689A JP9118689A JPH02271977A JP H02271977 A JPH02271977 A JP H02271977A JP 9118689 A JP9118689 A JP 9118689A JP 9118689 A JP9118689 A JP 9118689A JP H02271977 A JPH02271977 A JP H02271977A
Authority
JP
Japan
Prior art keywords
cement products
curing
stacked
piled
cement product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9118689A
Other languages
Japanese (ja)
Inventor
Masashi Koizumi
昌士 小泉
Noboru Takagi
登 高木
Takanori Shirahama
白浜 隆徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kubota Corp
Original Assignee
Kubota Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kubota Corp filed Critical Kubota Corp
Priority to JP9118689A priority Critical patent/JPH02271977A/en
Publication of JPH02271977A publication Critical patent/JPH02271977A/en
Pending legal-status Critical Current

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Landscapes

  • Curing Cements, Concrete, And Artificial Stone (AREA)

Abstract

PURPOSE:To enable uniform curing by piling up unhardened plate-shaped cement products, interposing heat conductive hollow metallic plates every time a proper number of the cement products are piled up and subjecting the cement products to wet heat curing. CONSTITUTION:Unhardened plate-shaped cement products P are piled up and heat conductive hollow metallic plates B each having plural through holes A, A pierced in the longitudinal direction are interposed every time a proper number of the cement products P are piled up. The cement products P are then subjected to wet heat curing.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はセメント製品の養生方法に関する。[Detailed description of the invention] [Industrial application field] This invention relates to a method for curing cement products.

〔従来の技術〕[Conventional technology]

従来、セメントを主原料として建築用板材を製造するこ
とが広く行なわれているが、これら板材は最終的に強度
発現を行なわせるため、温熱養生することが一般的に行
われる。
Conventionally, building boards have been widely manufactured using cement as the main raw material, and these boards are generally heat-cured in order to develop their final strength.

そして、これら温熱養生を行なう場合、−時に大量の板
材を養生する必要上、養生室内に多数の板材を積重して
搬入される。
When carrying out such thermal curing, it is sometimes necessary to cure a large amount of board materials, so a large number of board materials are stacked and brought into the curing chamber.

【従来技術の問題点〕[Problems with conventional technology]

しかしながら、養生すべき板材の数を多用とするため、
積重枚数を増加させると、板材の積み重ね中段部分の中
央部には板材の熱容量に起因して温度が充分に行き渡ら
ず、均一な養生が行なえない問題があり、大量生産には
一定の限界が生じる問題があった。
However, due to the large number of boards to be cured,
When the number of stacked boards is increased, there is a problem that the temperature is not sufficiently distributed in the center of the middle part of the stack due to the heat capacity of the boards, making it impossible to achieve uniform curing, and there is a certain limit to mass production. There were problems that arose.

(発明が解決しようとする課題〕 この発明は上記問題点に鑑み、多量の板材であっても、
−時に、しかも均一な条件で養生可能な効率の良いセメ
ント製品の養生方法を得ることを目的としてなされたも
のである。
(Problems to be solved by the invention) In view of the above-mentioned problems, this invention solves the problem even when a large amount of plate material is used.
- This was developed with the aim of obtaining an efficient curing method for cement products that can be cured under uniform conditions.

(課題を解決するに至った技術〕 即ち、この発明のセメント製品の養生方法は未硬化の板
状セメント製品を積重して温熱養生する際、適当な積重
枚数毎に良伝熱性の中空金属板を介挿することを特徴と
するものである。
(Technology that has solved the problem) That is, in the cement product curing method of the present invention, when unhardened plate-shaped cement products are stacked and cured under heat, a hollow hole with good heat conductivity is inserted into each stack for each suitable number of stacked cement products. It is characterized by the insertion of a metal plate.

〔作用〕[Effect]

一時に多数の板材を積重した場合、これらは、全体で一
つの熱容量を有する固形物と実質的に同じ物体となる。
When a large number of plates are stacked on top of each other at the same time, they form an object that is substantially the same as a solid object that has a total heat capacity of one.

従って、積重板材の積重厚さを薄くずれば、これらの熱
容用を著るしく低下させることが出来る。
Therefore, by reducing the stacking thickness of the stacked plates, these heat capacities can be significantly reduced.

そごで、積重板材の一昨位ごとの積重Jγさを小とし、
これらの間に伝熱性の良い中空金属板を介挿すれば、全
体への執伝導が図られ、均一条件での養生が達成される
So, the stacking load Jγ of each stacked board material is made small,
If a hollow metal plate with good heat conductivity is inserted between these, the conduction throughout the whole can be achieved and curing under uniform conditions can be achieved.

また、中空金属板を所定枚数毎に介挿すれば何層もの板
材を積I]iシても均一な条件で養生が可能となるので
ある。
Furthermore, if a predetermined number of hollow metal plates are inserted, it is possible to cure under uniform conditions even if many layers of plate materials are stacked.

〔実施例〕〔Example〕

次に、この発明の詳細な説明する。 Next, the present invention will be explained in detail.

縦300cm、 、1黄90cm、厚さ12mmの未硬
化セメント板材Pを第1図に示すように、30枚づつ積
み重ね、間に厚さ2cm、 N 330cm、横100
cm 、長さ方向に肉厚内を貫通する中空孔A、Aを5
fiI11おきに隣接して穿設した中空洞仮日を介挿し
て、最終的に190cmの高さとなるよう積重し、オー
トフレイブにて、60℃×20時間の温熱養生を行なっ
た。
As shown in Figure 1, 30 uncured cement boards P, each 300 cm long and 90 cm thick and 12 mm thick, are stacked one on top of the other, with a thickness of 2 cm between them, N 330 cm, and 100 cm wide.
cm, hollow hole A penetrating through the wall thickness in the length direction, A is 5
Hollow tubes bored adjacent to each other were inserted every 11 fiI, and the stacks were stacked to a final height of 190 cm, and heat-cured at 60° C. for 20 hours in an autoflave.

なお、比較例として、中空m仮Bを全く用いずに、未硬
化板材150枚積重したものを同時に養生を行なった。
As a comparative example, 150 uncured board materials were stacked and cured at the same time without using any hollow m temporary B.

板材積重部中央部の温瓜センサによる温度上昇は第2図
に示す通りであった。
The temperature rise measured by the warm melon sensor at the center of the stacked plate area was as shown in Figure 2.

〔効果〕〔effect〕

この発明は以上説明したように、良伝熱体を積重板材間
に介挿するため、積重体全体に熱が行き渡りやすく、均
一な養生が可能となり、品質管理が非常に容易となるの
である。
As explained above, in this invention, a good heat conductor is inserted between the stacked plates, so heat is easily distributed throughout the stack, enabling uniform curing, and making quality control extremely easy. .

【図面の簡単な説明】[Brief explanation of drawings]

Claims (1)

【特許請求の範囲】[Claims] (1)未硬化の板状セメント製品を積重して湿熱養生す
る際、適当な積重枚数毎に良伝熱性の中空金属板を介挿
することを特徴とするセメント製品の養生方法。
(1) A method for curing cement products, which is characterized in that when stacking uncured cement products in the form of moist heat, a hollow metal plate with good heat conductivity is inserted between an appropriate number of stacked cement products.
JP9118689A 1989-04-11 1989-04-11 Method for curing cement product Pending JPH02271977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9118689A JPH02271977A (en) 1989-04-11 1989-04-11 Method for curing cement product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9118689A JPH02271977A (en) 1989-04-11 1989-04-11 Method for curing cement product

Publications (1)

Publication Number Publication Date
JPH02271977A true JPH02271977A (en) 1990-11-06

Family

ID=14019420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9118689A Pending JPH02271977A (en) 1989-04-11 1989-04-11 Method for curing cement product

Country Status (1)

Country Link
JP (1) JPH02271977A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183382A (en) * 1981-04-30 1982-11-11 Matsushita Electric Works Ltd Manufacture of inorganic hardened board
JPS6342135B2 (en) * 1983-04-04 1988-08-22 Atsugi Jidosha Buhin Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183382A (en) * 1981-04-30 1982-11-11 Matsushita Electric Works Ltd Manufacture of inorganic hardened board
JPS6342135B2 (en) * 1983-04-04 1988-08-22 Atsugi Jidosha Buhin Kk

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