JPH01165496A - Manufacture of file - Google Patents
Manufacture of fileInfo
- Publication number
- JPH01165496A JPH01165496A JP32639787A JP32639787A JPH01165496A JP H01165496 A JPH01165496 A JP H01165496A JP 32639787 A JP32639787 A JP 32639787A JP 32639787 A JP32639787 A JP 32639787A JP H01165496 A JPH01165496 A JP H01165496A
- Authority
- JP
- Japan
- Prior art keywords
- bag
- bags
- plate
- conductive
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000002985 plastic film Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 230000006698 induction Effects 0.000 claims abstract description 8
- 239000011265 semifinished product Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 6
- 239000011162 core material Substances 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Sheet Holders (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、合成樹脂シート製の表紙と複数の袋体とを
高周波接着するファイルの製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a file in which a cover made of a synthetic resin sheet and a plurality of bags are bonded together by high frequency.
従来、合成樹脂シート製の表紙と複数の袋体とを組み合
わせて高周波接着によりファイルを製造する場合、片方
表紙の裏側に袋体を高周波接着し、次いで上記表紙に接
着された袋体に次の袋体、更に次の袋体を一枚毎順次高
周波接着しながら所要枚数の袋体を積層し、然るのち最
終層の袋体にもう片方の表紙を高周波接着している。Conventionally, when manufacturing a file by high-frequency bonding by combining a cover made of a synthetic resin sheet and multiple bag bodies, the bag bodies are high-frequency bonded to the back side of one cover, and then the next bag body is bonded to the above-mentioned cover. The required number of bags are laminated while sequentially bonding the bag and the next bag one by one using high frequency, and then the other cover is bonded to the final layer of the bag by high frequency.
片方の表紙に袋体を、この袋体に一枚毎継ぎ足し袋体を
、継ぎ足し最終の袋体にもう片方の表紙を順次高周波接
着するので、著しく手数がかかって非能率となり、大型
生産できない問題があった。The bag body is attached to one cover, the bags are added to this bag one by one, and the other cover is sequentially bonded to the final bag by high frequency bonding, which is extremely time-consuming and inefficient, making large-scale production impossible. was there.
又表紙の裏側に袋体を高周波接着したとき、表紙の表面
に熱接着の接着部が現れるので、見苦しくなると共に、
品質が低下する問題があった。Also, when the bag body is high-frequency bonded to the back side of the cover, the adhesive part of the heat bond appears on the surface of the cover, making it unsightly and
There was a problem with quality deterioration.
Ｃ問題点を解決するための手段〕
上記の問題点を解決するために、この発明は対向する定
盤と加圧盤との間に、複数枚重ねた合わせたプラスチッ
クシート製の袋体を介在すると共に、この袋体には、導
電板のみ或は導電板及び袋体内の対向面の接着を阻害す
る不導電性のシートが挿入され、かつ上記所定の導電板
には、板面の少なくとも片面の接着部位に高周波誘導加
熱によって熱溶着させるよう設けてある突出染付が使用
され、加圧下の印加により袋体同志の重なり面を高周波
接着した中間袋体半製品を製造したのち、導電板やシー
トを抜き取り、その後に中間袋体半製品の所要数を積み
重ねて重なり無接着面を挾む両側の袋体に導電板が挿入
され、かつ上記少なくとも片方の４電様の片面に設けて
ある突出条を接着しようとする重なり面の方向に位置さ
せ、加圧下の印加により中間袋体半製品の重なり面を高
周波接着して袋体群を製造したのち、導電板やシートを
彷き取り、次いで袋体群の両サイドの袋体に裏面にポケ
ットを有するプラスチックシート製の表紙を重ね合せて
、−上記のポケット及び両サイドの袋体に導電板を挿入
すると共に、少なくとも片方の導電板の片面に設けてあ
る突出条を接着しようとする重なり面の方向に位置させ
、加圧下の印加により袋体群に表紙を高周波接着するこ
とを特徴とするファイルの製造方法、及び対向する定盤
と加圧盤との間に、複数枚重ね合わせたプラスチックシ
ー ト製の袋体を介在すると共に、この袋体には、導電
板のみ或は導電板及び袋体内の対向面の接着を阻害する
不導電性のシートが挿入され、かつ上記所定の導電板に
は、板面の少なくとも片面の接着部位に高周波誘導加熱
によって熱溶着させるよう設りである突出染付が使用さ
れ、加圧士の印加により袋体同志の重なり面を高周波接
着し、挿入導電板やシートを抜き取って製造した袋体群
の所要数を積み重ね、又積み重ねた袋体群を挾んで対向
するよう裏面にポケットを有するプラスチックシート製
の対の表紙を重ね合せ、無接着面を挾むそれぞれの重な
り合うポケットと袋体及び両袋体に導電板を挿入すると
共に、少なくとも片方の導電板の片面に設けてある突出
条を接着しようとする重なり面の方向に位置させ、加圧
下の印加によりポケットと袋体及び袋体群の重なる袋体
同志を高周波接着することを特（νとするファイルの製
造方法とから成る。Means for Solving Problem C] In order to solve the above problem, this invention interposes a bag body made of a plurality of stacked plastic sheets between the facing surface plate and the pressure plate. At the same time, a non-conductive sheet that inhibits adhesion between the conductive plate alone or the conductive plate and the opposing surfaces inside the bag is inserted into the bag, and the predetermined conductive plate has at least one side of the plate surface. A protruding dyeing system is used to heat-weld the bonding area using high-frequency induction heating, and after producing an intermediate bag semi-finished product by high-frequency bonding the overlapping surfaces of the bags by applying pressure, conductive plates and sheets are used. After that, the required number of semi-finished intermediate bags are stacked and overlapped, and a conductive plate is inserted into the bags on both sides sandwiching the non-adhesive surface, and a protruding strip is provided on one side of at least one of the four electric conductors. is positioned in the direction of the overlapping surfaces to be bonded, and the overlapping surfaces of the intermediate bag semi-finished products are high-frequency bonded by applying pressure to produce a bag group. After that, the conductive plate or sheet is removed, and then the bag is A plastic sheet cover with a pocket on the back is superimposed on the bags on both sides of the body group, and a conductive plate is inserted into the pocket and the bag on both sides, and at least one side of the conductive plate is A method for manufacturing a file, characterized in that the provided protruding stripes are positioned in the direction of the overlapping surfaces to be bonded, and a cover is high-frequency bonded to a group of bags by applying pressure, and a surface plate and a pressure plate facing each other. A bag made of multiple stacked plastic sheets is interposed between the bag and the bag, and the bag has a non-conductive material that inhibits adhesion between the conductive plate and the opposing surfaces inside the bag. The sheet is inserted, and the predetermined conductive plate is provided with a protruding dye that is designed to be thermally welded by high-frequency induction heating at the adhesive site on at least one side of the plate surface, and the bag body is The required number of bag groups manufactured by high-frequency bonding the overlapping surfaces of the comrades and removing the inserted conductive plates and sheets is stacked, and a pair of plastic sheets having pockets on the back side are made to sandwich the stacked bag groups and face each other. Overlap the covers of , insert a conductive plate into each of the overlapping pockets and the bag body sandwiching the non-adhesive surfaces, and insert a conductive plate into both bags, and adhere the protruding strips provided on one side of at least one conductive plate. A method for manufacturing a file, in which the pocket, the bag, and the overlapping bags of the group of bags are bonded to each other by high frequency by placing the bag in the direction of the surface and applying pressure.
〔実施例〕
次にこの発明に係るファイルの製造方法を添付図面に基
づいて説明する。[Example] Next, a method for manufacturing a file according to the present invention will be explained based on the accompanying drawings.
ファイルの製造に用いる表紙Ａ及び袋体Ｂは、プラスチ
ックシート製であり、上記の表紙Ａは、第２図で示した
ように厚紙等の芯材１と、この芯材１を包み込むプラス
チックシート２とで構成され、表紙Ａの裏側には、袋体
Ｂを高周波接着するためのプラスチックシート製のポケ
ット３が設けられている。The cover A and the bag body B used for manufacturing the file are made of plastic sheets, and the above-mentioned cover A consists of a core material 1 such as cardboard, and a plastic sheet 2 that wraps the core material 1, as shown in FIG. A pocket 3 made of a plastic sheet is provided on the back side of the cover A for bonding the bag B by high frequency bonding.
なお、上記のポケット３は、図示の場合表紙Ａの裏面全
体にプラスチックシートを重ねると共に、−辺に開口を
形成するよう残る三辺の縁をシート２に熱融着させて設
けたが、上記のポケットに限定されることなく袋体Ｂを
高周波接着する部分のみにシートを位置させたもの等で
あってもよい。In addition, in the case shown in the figure, the above-mentioned pocket 3 was provided by overlapping a plastic sheet over the entire back surface of the cover A and heat-sealing the remaining three edges to the sheet 2 so as to form an opening on the - side. The sheet is not limited to the pocket, but may be one in which the sheet is positioned only in the part where the bag body B is bonded by high frequency.
又袋体Ｂは、第１図で示したように二枚のプラスチック
シート４．４を重ね合わせて、−辺に開口を形成するよ
う残る三辺の縁を熱融着させて形成したが、その他の方
法で形成したものでよい。Bag B was formed by overlapping two plastic sheets 4.4 and heat-sealing the edges of the remaining three sides to form an opening on the - side, as shown in Figure 1. It may be formed by other methods.
５はポケット３に挿入する導電板である。5 is a conductive plate inserted into the pocket 3.
６は袋体Ｂに挿入して上記袋体Ｂ内の対向面の接着を阻
害するシートである。Reference numeral 6 denotes a sheet that is inserted into the bag body B to inhibit adhesion of the opposing surfaces within the bag body B.
上記のシート６は、厚紙やエポキシ樹脂製の板等が用い
られる。As the sheet 6, cardboard, an epoxy resin board, or the like is used.
父上記の導電板５は、フラットなものと、板面の両面及
び片面の接着部位に高周波誘導加熱によって熱融着させ
る突出束１０を設けたものとが使用され、−辺縁から突
出している把持部８を把持して抜き差しする。The above-mentioned conductive plate 5 is either flat or has protruding bundles 10 that are heat-sealed by high-frequency induction heating at bonding sites on both sides and one side of the plate, protruding from the edges. Grip the grip part 8 and insert/remove it.
次に表紙と袋体とを組み合わせたファイルの製造方法を
説明する。Next, a method of manufacturing a file combining a cover and a bag body will be explained.
第５図で示したように高周波ウエルダの一方の電極であ
る定盤１１と、他方の電極或は電極をかねる加圧盤１２
との間に、所要枚数重ね合わせた袋体Ｂを介在する。As shown in FIG. 5, a surface plate 11 is one electrode of the high-frequency welder, and a pressure plate 12 is the other electrode.
A required number of stacked bags B are interposed between the bag body B and the bag body B.
このとき、所要の袋体Ｂ内に突出束１０を有する導電板
５が残る袋体Ｂ内にはシート６がそれぞれ前もって挿入
されている。At this time, the sheets 6 are each previously inserted into the bag bodies B in which the conductive plates 5 with the protruding bundles 10 remain in the desired bag bodies B.
なお、上記突出束１０付の導電板５には、第５図で示し
たように中間の一つの袋体Ｂに挿入場合、両面に突出束
１０を設けてあるものを使用し、又片面に突出束１０を
設けてあるものを使用する場合、両サイドの袋体Ｂに突
出束１０が対向するよう挿入するとよい。When inserting the conductive plate 5 with the protruding bundles 10 into one bag B in the middle as shown in FIG. When using a bag provided with protruding bundles 10, it is preferable to insert the protruding bundles 10 into the bags B on both sides so that they face each other.
しかして、加圧盤１２を降下（シリンダの伸長操作等に
より）させながら定盤１１に袋体Ｂを押し付けて、加圧
下に印加（加圧盤１２の接触片１３を導電板５に接触さ
せる）すると、導電板５の突出束１０に対応する袋体Ｂ
の重なり面の部分が高周波誘導加熱によって熱溶着され
、中間袋体半製品Ｃ′が製造される。Then, when pressing the bag B against the surface plate 11 while lowering the pressure plate 12 (by extending the cylinder, etc.) and applying pressure (bringing the contact piece 13 of the pressure plate 12 into contact with the conductive plate 5), , a bag body B corresponding to the protruding bundle 10 of the conductive plates 5
The overlapping surfaces of the two are thermally welded by high frequency induction heating to produce an intermediate bag semi-finished product C'.
次に、上記の製造された（導電板５及びシーＩ・６は、
抜き取られている）中間袋体半製品Ｃ′の所要数を積み
重ね、そして第７図で示したように定盤１１と加圧盤１
２との間に介在する。Next, the above-manufactured (conductive plate 5 and sheet I/6 are
The required number of intermediate bag semi-finished products C' (which have been extracted) are piled up, and as shown in FIG.
It is interposed between 2 and 2.
このとき、積み重ねた中間袋体半製品Ｃ′の無接着面を
挾んで対向する両袋体Ｂには、導電板５が挿入（図示の
場合は、両袋体Ｂに突出束１０付の導電板５を使用）
が挿入されている。At this time, a conductive plate 5 is inserted into both bag bodies B which face each other with the non-adhesive surfaces of the stacked intermediate bag body semi-finished products C' sandwiched in between (in the case shown in the figure, a conductive plate 5 with a protruding bundle 10 is inserted into both bag bodies B). (using plate 5) is inserted.
又、突出束１０は、無接着面側に位置させである。Further, the protruding bundle 10 is positioned on the non-adhesive surface side.
しかして、加圧下に印加すると、中間袋体半製品Ｃ′の
対向する両袋体Ｂの重なり面が高周波接着されて、第８
図のような袋体群ｃ ”が製造される。When pressure is applied, the overlapping surfaces of both opposing bags B of the intermediate bag half-finished product C' are bonded by high frequency, and the eighth
A bag group c'' as shown in the figure is manufactured.
上記袋体群Ｃ″の製法は、図示の場合二個の中間袋体半
製品Ｃ′を接続したが、三個或は三個以上接続してもよ
い。In the manufacturing method of the bag group C'', two intermediate bag semi-finished products C' are connected in the illustrated case, but three or three or more intermediate bags may be connected.
なお、製造された袋体群Ｃ″の袋体Ｂに挿入しである導
電板５は抜き取る。Note that the conductive plate 5 inserted into the bag B of the manufactured bag group C'' is removed.
その後に袋体群Ｃｒｔの両サイドに表紙Ａ、Ａを重ねて
定盤１１と加圧盤１２との間に介在する。Thereafter, covers A and A are stacked on both sides of the bag group Crt and interposed between the surface plate 11 and the pressure plate 12.
このとき、ポケット３とこのポケット３に重なる袋体Ｂ
には、上述と同様に（中間袋体半製品Ｃ′の接続と同じ
条件）導電板５が挿入されている。At this time, pocket 3 and bag body B that overlaps this pocket 3
The conductive plate 5 is inserted in the same manner as described above (under the same conditions as the connection of the intermediate bag semi-finished product C').
しかるのち、加圧下に印加すると、袋体群Ｃ″に表紙Ａ
、Ａが高周波接着され、第３図で示したようなファイル
Ｃが製造される。After that, when pressure is applied, the cover A is applied to the bag group C''.
, A are high-frequency bonded, and a file C as shown in FIG. 3 is manufactured.
なお、図示のように両サイドの表紙へを同時に高周波接
着したが、片方を接着し、次いでもう片方を接着しても
よい。Note that, as shown in the figure, both sides of the cover were bonded by high frequency at the same time, but one side may be bonded, and then the other side may be bonded.
又第１０図で示したように、二個或は二個以上の中間袋
体半製品Ｃ′を積み重ね、かつ積み重ねた中間袋体半製
品Ｃ′の最下位（定盤１１側袋体Ｂと、最上位（加圧盤
１２側）袋体Ｂとに表紙Ａ、Ａを重ねる。Further, as shown in FIG. 10, two or more intermediate bag semi-finished products C' are stacked, and the lowest part of the stacked intermediate bag semi-finished products C' (with the bag B on the surface plate 11 side) , Covers A and A are stacked on top of the bag body B (on the pressure plate 12 side).
このとき、重なり合うポケット３と中間袋体半製品Ｃ′
の袋体Ｂ及び積み重ねた中間袋体半製品Ｃ′の無接着面
を挾んで対向する両袋体Ｂ、Ｂに導電板５を挿入する。At this time, the overlapping pocket 3 and intermediate bag half-finished product C'
The conductive plate 5 is inserted into the bag bodies B and B, which face each other with the non-adhesive surfaces of the bag body B and the stacked intermediate bag semi-finished products C' in between.
又導電板５は、片面に突出条１０を有し、かつ突出条１
０は、無接着面側に位置させである。Further, the conductive plate 5 has a protruding strip 10 on one side, and the protruding strip 1
0 means that it is located on the non-adhesive side.
なお、導電板５のみを使用したとき、片方には突出条１
０を有しないものを使用してもよい。Note that when only the conductive plate 5 is used, there is a protruding strip 1 on one side.
Those without 0 may also be used.
しかして、加圧下に印加すると、中間袋体半製品Ｃ′の
袋体Ｂにポケット３が、中間袋体半製品Ｃ′の重なり合
った袋体ＢＳＢ同志がそれぞれ熱溶着されて第３図で示
したようなファイルＣが製造される。When pressure is applied, the pocket 3 is thermally welded to the bag body B of the intermediate bag semi-finished product C', and the overlapping bags BSB of the intermediate bag semi-finished product C' are thermally welded, as shown in FIG. A file C like this is produced.
以上のように、この発明に係るファイルの製造方法によ
れば、表紙に袋体を、袋体に一枚毎袋体を、最後に袋体
に表紙を高周波接着する非能率的な作業が解消されて、
著しく製造能率を向上することができる。As described above, according to the file manufacturing method of the present invention, the inefficient work of bonding the bag to the cover, each bag to the bag, and finally the cover to the bag by high frequency bonding can be eliminated. Been,
Manufacturing efficiency can be significantly improved.
又表紙に袋体を高周波接着する場合、表紙の裏側にポケ
ットを設けて、このポケットに導電板を挿入しであるの
で、高周波誘導加熱によって熱融着される部分はポケッ
トと袋体との重なり面（接着型板の突出条に対応する部
分のみ）のみとなる。In addition, when bonding the bag to the cover using high frequency, a pocket is provided on the back side of the cover and a conductive plate is inserted into this pocket, so the part that is thermally fused by high frequency induction heating is the overlap between the pocket and the bag. Only the surface (only the part corresponding to the protruding stripes of the adhesive template) is included.
このため、表紙の表面に熱融着の接着痕が現れることが
ない。Therefore, no adhesive traces due to heat sealing appear on the surface of the cover.
又シートの使用によって袋体の内の対向面の接着をなく
することができる。Also, by using the sheet, it is possible to eliminate adhesion between opposing surfaces within the bag.
更に中間袋体半製品の使用個数によってファイルの袋体
の数を少なくしたり、多くしたりすることができる。Furthermore, the number of bags in the file can be decreased or increased depending on the number of semi-finished intermediate bags used.
図面はこの発明に係るファイルの製造方法の実施例を示
すもので、第１図は袋体の斜視図、第２図は表紙の斜視
図、第３図は製造されたファイルの斜面図、第４図は導
電板、シート、接着型板の斜視図、第５図は多数枚の袋
体を高周波接着する縦断側面図、第６図は同上で製造さ
れた中間袋体半製品の縦断側面図、第７図は中間袋体半
製品の継ぎ足し高周波接着の縦断側面図、第８図は同上
で製造された袋体群の縦断側面図、第９図は袋体群に表
紙を高周波接着する縦断側面図、第１０図は複数の中間
袋体半製品と表紙との高周波接着の縦断側面図である。
Ａ・・・・・・表紙、 Ｂ・・・・・・袋体、Ｃ
・・・・・・ファイル、
Ｃ′・・・・・・中間袋体半製品
ｃ ″・・・・・・袋体群、 １・・・・・・芯材、
２．４・・・・・・プラスチックシート、３・・・・・
・ポケット、 ５・・・・・・導電板、６・・・・
・・シート、 １０・・・・・・突出条、１１・
・・・・・定盤、 １２・・・・・・加圧盤、１３
・・・・・・接触片。
特許出願人 光 山 益 仏
間 代理人 鎌 １） 文 二笛５図
第７図
築８図
７σ′The drawings show an embodiment of the file manufacturing method according to the present invention, and FIG. 1 is a perspective view of the bag, FIG. 2 is a perspective view of the cover, and FIG. 3 is a perspective view of the manufactured file. Figure 4 is a perspective view of the conductive plate, sheet, and adhesive template; Figure 5 is a vertical cross-sectional side view of high-frequency bonding of multiple bags; Figure 6 is a vertical cross-sectional side view of the intermediate bag semi-finished product manufactured in the above manner. , Fig. 7 is a vertical cross-sectional side view of the high-frequency bonding of intermediate bag semi-finished products, Fig. 8 is a longitudinal cross-sectional side view of the bag group manufactured in the same way, and Fig. 9 is a longitudinal cross-sectional view of the high-frequency bonding of the cover to the bag group. The side view, FIG. 10, is a longitudinal cross-sectional side view of high-frequency bonding between a plurality of intermediate bag semi-finished products and a cover. A: Cover, B: Bag, C
...File, C'...Intermediate bag semi-finished product c''...Bag group, 1...Core material,
2.4...Plastic sheet, 3...
・Pocket, 5... Conductive plate, 6...
...Sheet, 10...Protruding strip, 11.
... Surface plate, 12 ... Pressure plate, 13
・・・・・・Contact piece. Patent applicant: Masu Mitsuyama, Butsuma, agent: Kama 1) Text: Nifue 5, 7, 8, 7σ'
Claims (2)
わせたプラスチックシート製の袋体を介在すると共に、
この袋体には、導電板のみ或は導電板及び袋体内の対向
面の接着を阻害する不導電性のシートが挿入され、かつ
上記所定の導電板には、板面の少なくとも片面の接着部
位に高周波誘導加熱によって熱溶着させるよう設けてあ
る突出条付が使用され、加圧下の印加により袋体同志の
重なり面を高周波接着した中間袋体半製品を製造したの
ち、導電板やシートを抜き取り、その後に中間袋体半製
品の所要数を積み重ねて重なり無接着面を挾む両側の袋
体に導電板が挿入され、かつ上記少なくとも片方の導電
板の片面に設けてある突出条を接着しようとする重なり
面の方向に位置させ、加圧下の印加により中間袋体半製
品の重なり面を高周波接着して袋体群を製造したのち、
導電板やシートを抜き取り、次いで袋体群の両サイドの
袋体に裏面にポケットを有するプラスチックシート製の
表紙を重ね合せて、上記のポケット及び両サイドの袋体
に導電板を挿入すると共に、少なくとも片方の導電板の
片面に設けてある突出条を接着しようとする重なり面の
方向に位置させ、加圧下の印加により袋体群に表紙を高
周波接着することを特徴とするファイルの製造方法。(1) A bag body made of a plurality of stacked plastic sheets is interposed between the facing surface plate and the pressure plate, and
A non-conductive sheet that inhibits adhesion of only the conductive plate or the conductive plate and the opposing surfaces inside the bag is inserted into the bag, and the predetermined conductive plate has an adhesive portion on at least one side of the plate surface. A protruding striation is used to heat-weld the bags by high-frequency induction heating, and after producing an intermediate bag semi-finished product by high-frequency bonding the overlapping surfaces of the bags by applying pressure, the conductive plate or sheet is extracted. After that, the required number of semi-finished intermediate bags are stacked and overlapped, and conductive plates are inserted into the bags on both sides sandwiching the non-adhesive surface, and the protruding strips provided on one side of at least one of the conductive plates are adhered. After producing a bag group by high-frequency bonding the overlapping surfaces of the intermediate bag semi-finished products by applying pressure,
The conductive plate or sheet is removed, and then a plastic sheet cover having a pocket on the back is superimposed on the bags on both sides of the bag group, and the conductive plates are inserted into the pockets and the bags on both sides, A method for manufacturing a file, characterized in that a protruding strip provided on one side of at least one conductive plate is positioned in the direction of an overlapping surface to be bonded, and a cover is bonded to a bag group by high frequency by applying pressure.
せたプラスチックシート製の袋体を介在すると共に、こ
の袋体には、導電板のみ或は導電板及び袋体内の対向面
の接着を阻害する不導電性のシートが挿入され、かつ上
記所定の導電板には、板面の少なくとも片面の接着部位
に高周波誘導加熱によって熱溶着させるよう設けてある
突出条付が使用され、加圧下の印加により袋体同志の重
なり面を高周波接着し、挿入導電板やシートを抜き取っ
て製造した袋体群の所要数を積み重ね、又積み重ねた袋
体群を挾んで対向するよう裏面にポケットを有するプラ
スチックシート製の対の表紙を重ね合せ、無接着面を挾
むそれぞれの重なり合うポケットと袋体及び両袋体に導
電板を挿入すると共に、少なくとも片方の導電板の片面
に設けてある突出条を接着しようとする重なり面の方向
に位置させ、加圧下の印加によりポケットと袋体及び袋
体群の重なる袋体同志を高周波接着することを特徴とす
るファイルの製造方法。(2) A bag made of a plurality of stacked plastic sheets is interposed between the facing surface plate and the pressure plate, and this bag includes only a conductive plate or a conductive plate and the opposing surface inside the bag. A non-conductive sheet that inhibits adhesion is inserted, and the predetermined conductive plate has protruding striations provided on at least one side of the plate surface to be thermally welded by high-frequency induction heating, The overlapping surfaces of the bags are bonded by high frequency by applying pressure, the inserted conductive plates and sheets are removed, the required number of bags are stacked up, and pockets are placed on the back side so as to sandwich the stacked bags and face each other. A pair of covers made of plastic sheets having the same structure are overlapped, and a conductive plate is inserted into each of the overlapping pockets and the bag bodies with the non-adhesive surfaces sandwiched between them, and both bag bodies, and a protrusion provided on one side of at least one of the conductive plates. A method for producing a file, characterized in that the strips are positioned in the direction of the overlapping surfaces to be bonded, and the pocket, the bag, and the overlapping bags of the group of bags are bonded together by high frequency by applying pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32639787A JPH01165496A (en) | 1987-12-22 | 1987-12-22 | Manufacture of file |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32639787A JPH01165496A (en) | 1987-12-22 | 1987-12-22 | Manufacture of file |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01165496A true JPH01165496A (en) | 1989-06-29 |
| JPH0411120B2 JPH0411120B2 (en) | 1992-02-27 |
Family
ID=18187341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32639787A Granted JPH01165496A (en) | 1987-12-22 | 1987-12-22 | Manufacture of file |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165496A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61175483U (en) * | 1985-04-22 | 1986-11-01 |
-
1987
- 1987-12-22 JP JP32639787A patent/JPH01165496A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61175483U (en) * | 1985-04-22 | 1986-11-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0411120B2 (en) | 1992-02-27 |
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