JPH01151972A - Spin coating device - Google Patents
Spin coating deviceInfo
- Publication number
- JPH01151972A JPH01151972A JP30943087A JP30943087A JPH01151972A JP H01151972 A JPH01151972 A JP H01151972A JP 30943087 A JP30943087 A JP 30943087A JP 30943087 A JP30943087 A JP 30943087A JP H01151972 A JPH01151972 A JP H01151972A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- coated
- air
- guide plate
- forced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004528 spin coating Methods 0.000 title claims description 14
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 53
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- 239000007789 gas Substances 0.000 description 25
- 239000011344 liquid material Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は半導体基板、光デイスク用ガラス原盤それに液
晶デイスプレー用ガラス基板などへのフォトレジスト等
の液状体の塗布装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for applying a liquid material such as a photoresist to a semiconductor substrate, a glass master disk for an optical disk, a glass substrate for a liquid crystal display, and the like.
（従来の技術）
従来、半導体基板や光デイスク用ガラス原盤それに液晶
デイスプレー用ガラス基板等へのフォトレジスト等の液
状体の塗布にはスピンコーティング装置が使用されてき
た（例えば特公昭６２−１５４７号公報、特開昭６２−
４６５１９号公報）。(Prior Art) Conventionally, spin coating equipment has been used to apply liquid materials such as photoresists to semiconductor substrates, glass master disks for optical disks, glass substrates for liquid crystal displays, etc. No. Publication, JP-A-62-
46519).
第３図に従来のスピンコーティング装置を示し、第４図
に該装置の蓋を示す。FIG. 3 shows a conventional spin coating apparatus, and FIG. 4 shows a lid of the apparatus.
モータ（８）の回転軸（３ａ）に結合する回転テーブル
（２）は、真空吸着孔を有し被塗布基板（１）を吸着固
定する。被塗布基板（１）上のほぼ中心部にレジスト等
の液状体が滴下される。被塗布基板（１）は回転テーブ
ル（２）と一体になって回転するので、前記液状体は、
前記回転により発生する遠心力により被塗布基板（１）
上の全体に広がって塗布され、塗布膜となる。A rotary table (2) coupled to a rotating shaft (3a) of a motor (8) has a vacuum suction hole and suctions and fixes a substrate to be coated (1). A liquid material such as resist is dropped approximately at the center of the substrate to be coated (1). Since the substrate to be coated (1) rotates together with the rotary table (2), the liquid material is
The centrifugal force generated by the rotation causes the substrate to be coated (1)
It is spread over the entire surface and becomes a coating film.
容器（１６）内部には円筒状部材（１７）が設けられて
おり、容器（１６）の底面と円筒状部材（１７）とで仕
切られた塗布室（４）の気体は排気装置（８）により排
気配管（工２）を経て排出される。容器（１Ｂ）に着脱
自在の蓋（９）には複数の気体吸入孔（ｌＯ）が穿たれ
ており、塗布室（４）内の気流を制御し塗布液中の溶媒
成分の蒸発を制御し被塗布基板上に均一の塗布膜を形成
することが試みられていた。A cylindrical member (17) is provided inside the container (16), and the gas in the coating chamber (4) partitioned by the bottom surface of the container (16) and the cylindrical member (17) is removed by an exhaust device (8). It is discharged through the exhaust pipe (work 2). The lid (9), which can be attached and detached from the container (1B), has a plurality of gas suction holes (lO), which control the air flow inside the coating chamber (4) and control the evaporation of the solvent component in the coating liquid. Attempts have been made to form a uniform coating film on a substrate to be coated.
（発明が解決しようとする問題点）
しかし、第３図に示された従来のスピンコーティング装
置による塗布膜形成には、被塗布基板（１）の回転によ
り発生する気流と排気装置（８）による排気流とが関与
し、その上、排気装置（８）の排気能力が変動するため
、被塗布基板ごとの塗布膜の平均膜厚や塗布膜内の膜厚
分布にバラツキが生じ再現性の良い塗布が困難であった
。(Problems to be Solved by the Invention) However, in forming a coating film using the conventional spin coating apparatus shown in FIG. In addition, since the exhaust flow is involved, and the exhaust capacity of the exhaust device (8) fluctuates, the average thickness of the coated film for each substrate to be coated and the film thickness distribution within the coated film vary, resulting in good reproducibility. Application was difficult.
本発明は、上記従来の技術の問題点を解決したスピンコ
ーティング装置の提供を目的とする。An object of the present invention is to provide a spin coating apparatus that solves the problems of the above-mentioned conventional techniques.
（問題点を解決するための手段）
本発明によれば、被塗布基板を回転させることにより該
基板上の液状体を該基板に塗布する装置に、気体の強制
的供給口を被塗布基板の中心部に存し回転中の前記基板
の塗布面近傍に略平行に配した気流案内板を備えたこと
を特徴とするスピンコーティング装置により上記目的が
達成できる。(Means for Solving Problems) According to the present invention, a forced gas supply port is connected to a device that applies a liquid on a substrate by rotating the substrate. The above object can be achieved by a spin coating apparatus characterized in that it is equipped with an airflow guide plate located in the center and arranged approximately parallel to the coating surface of the rotating substrate.
気流案内板の被塗布基板の被塗布面に対する間隔を制御
し得ることは好ましい。It is preferable to be able to control the distance between the airflow guide plate and the surface of the substrate to be coated.
本発明のスピンコーティング装置は上記構成であるから
、被塗布基板の回転、排気装置による排気及び排気装置
の排気能力変化により被塗布基板の塗布面近傍の気流に
変動が生じない。このため塗布直後の膜からの溶媒成分
の蒸発は常に一定の条件下で行なわれ、溶媒成分の蒸発
速度を一定にできる。Since the spin coating apparatus of the present invention has the above-described configuration, the airflow near the coating surface of the substrate to be coated does not fluctuate due to the rotation of the substrate to be coated, the exhaust by the exhaust device, and the change in the exhaust capacity of the exhaust device. Therefore, the evaporation of the solvent component from the film immediately after coating is always carried out under constant conditions, and the evaporation rate of the solvent component can be kept constant.
従って、１枚の被塗布基板に塗布された塗布膜内の膜厚
を一定にでき、かつ一定の膜厚を何枚もの基板にわたり
塗布することができる。Therefore, the thickness of the coating film applied to one substrate to be coated can be made constant, and the same thickness can be applied to a number of substrates.
（好適な実施態様）
強制気体供給口から供給される気体は、塗布される液状
体の溶媒成分を蒸発せしめるものを適宜選択して用いる
ことができ、塗布される液状体が通常のフォトレジスト
である場合には空気又は窒素で足りる。(Preferred Embodiment) The gas supplied from the forced gas supply port can be appropriately selected and used to evaporate the solvent component of the liquid to be applied. In some cases, air or nitrogen may be sufficient.
強制気体供給口から供給される気体の発生源としては、
エアーコンプレッサーや、圧縮気体入りボンベ等を用い
ることができる。The source of the gas supplied from the forced gas supply port is:
An air compressor, a cylinder containing compressed gas, etc. can be used.
強制気体供給口を気流案内板に設けることは好ましい。Preferably, forced gas supply ports are provided in the airflow guide plate.
（実施例）
本発明のスピンコーティング装置の一実施例を図面の第
１図及び第２図により説明する。(Example) An example of the spin coating apparatus of the present invention will be described with reference to FIGS. 1 and 2 of the drawings.
フォトレジスト等の液状体が均一に塗布される被塗布基
板（１）は、モータ（３）の回転軸（３ａ）と結合し真
空吸着孔を有する回転テーブル（２）に。A substrate to be coated (1) to which a liquid material such as photoresist is uniformly applied is placed on a rotary table (2) that is connected to a rotating shaft (3a) of a motor (3) and has a vacuum suction hole.
真空吸着により着脱自在に吸着固定される。被塗布基板
（１）の上方には被塗布基板（１）の被塗布面全体を覆
うように気流案内板（５）が被塗布基板（１）の被塗布
面と平行に被塗布基板（１）と離れて設けられており９
強制送気装置（７）からの気体を被塗布基板（１）の被
塗布面に案内する。気流案内板（５）は、その中央部が
柱状に突起した突起部を有しており、容器（１６）の蓋
（９）の中心部に穿たれた孔の内壁と前記突起部外周面
とが摺動可能に設けられているので、被塗布基板（１）
との間隔を任意に変更し設定することができる。It is removably attached and fixed by vacuum suction. Above the substrate to be coated (1), an airflow guide plate (5) is installed parallel to the surface to be coated of the substrate to be coated (1) so as to cover the entire surface to be coated of the substrate to be coated (1). ) and is set apart from 9
Gas from the forced air supply device (7) is guided to the coated surface of the coated substrate (1). The airflow guide plate (5) has a columnar protrusion at its center, and the inner wall of the hole bored in the center of the lid (9) of the container (16) and the outer peripheral surface of the protrusion is provided so that it can slide, so that the substrate to be coated (1)
You can arbitrarily change and set the interval.
気流案内板（５）の前記突起部の中央部には孔が穿たれ
ている。A hole is bored in the center of the protrusion of the airflow guide plate (5).
強制送気装置（ア）と連絡する強制送気配管（１１）は
前記突起部の孔と接続しているので、前記孔は強制気体
供給口（５ａ）となっている。強制気体供給口（５ａ）
は被塗布基板（１）の回転軸上にある。強制送気配管（
１１）には２強制送気される気体の流れの上流から順に
１強制送気される気体の流量を調節するための気体流量
調節弁（１５）。Since the forced air piping (11) communicating with the forced air feeding device (A) is connected to the hole in the protrusion, the hole serves as a forced gas supply port (5a). Forced gas supply port (5a)
is on the rotation axis of the substrate to be coated (1). Forced air piping (
11) includes two gas flow rate control valves (15) for adjusting the flow rate of the forced gas, starting from the upstream side of the forced gas flow;
強制送気される気体の流量を測定する気体流量計（１４
）が設けられている。A gas flow meter (14) that measures the flow rate of forced gas
) is provided.
容器（１Ｂ）の内部には、被塗布基板を周囲から囲むよ
うに円筒状部材（１７）が設けられている。A cylindrical member (17) is provided inside the container (1B) so as to surround the substrate to be coated.
容器（ＩＢ）の底面と９円筒状部材（１７）と、気流案
内板（５）とによって仕切られて、塗布室（４）は形成
される。容器（１６）の底面に穿たれた排気口は排気装
置（８）と連絡する排気配管（１２）と接続している。A coating chamber (4) is formed by being partitioned by the bottom surface of the container (IB), the nine cylindrical member (17), and the airflow guide plate (5). An exhaust port bored in the bottom of the container (16) is connected to an exhaust pipe (12) that communicates with an exhaust device (8).
強制送気配管（１１）は屈曲自在であり、蓋（９）は容
器（１６）と着脱自在に設けられている。The forced air piping (11) is bendable, and the lid (9) is detachably attached to the container (16).
被塗布基板（１）上のほぼ中心部に滴下されたレジスト
等の液状体は９回転テーブル（２）の回転により発生す
る遠心力により被塗布基板（１）上の全面に渡って塗布
され、被塗布基板（１）上には塗布膜が形成される。こ
の際１強制送気装置（７）から送気された気体は強制送
気配管（１１）及び気流案内板（５）の前記強制気体供
給口（５ａ）を経て気流案内板（５）により被塗布基板
（１）と気流案内板（５）とによって仕切られた空間（
６）へ十分に供給されている。一方、被塗布基板（１）
が存在する塗布室（４）の気体は排気装置（８）により
排気配管（１２）を経て排出されており、また、被塗布
基板（１）等の回転により気流も発生する。しかしなが
ら、被塗布基板（１）と気流案内板（５）とによって仕
切られた空間（６）には気体が十分に継続して供給され
ているので、排気装置（８）の排気能力の変動や被塗布
基板（１）等の回転により生ずる気流の影響を受けない
一定の気体の流れが前記空間（６）に生じる。従って、
？ｔＬ塗布基板ごとの塗布膜の平均膜厚や塗布膜内の膜
厚分布は影響を受けず、再現性の良い塗布が可能となる
。強制気体供給口（５ａ）から供給される気体の供給量
は被塗布基板（１）の回転速度、排気装置の（８）の排
気能力。A liquid such as a resist dropped onto the approximate center of the substrate to be coated (1) is applied over the entire surface of the substrate to be coated (1) by the centrifugal force generated by the rotation of the nine-turn table (2). A coating film is formed on the substrate to be coated (1). At this time, the gas supplied from the first forced air supply device (7) passes through the forced air piping (11) and the forced gas supply port (5a) of the air flow guide plate (5), and is covered by the air flow guide plate (5). A space partitioned by a coating substrate (1) and an airflow guide plate (5) (
6) are sufficiently supplied. On the other hand, the substrate to be coated (1)
The gas in the coating chamber (4) where the coating chamber (4) exists is exhausted by the exhaust device (8) through the exhaust pipe (12), and an air current is also generated by the rotation of the substrate to be coated (1) and the like. However, since gas is continuously and sufficiently supplied to the space (6) partitioned by the substrate to be coated (1) and the airflow guide plate (5), fluctuations in the exhaust capacity of the exhaust device (8) may occur. A constant gas flow is generated in the space (6) that is not affected by the air flow generated by the rotation of the substrate to be coated (1) or the like. Therefore,
? The average film thickness of the coating film for each tL-coated substrate and the film thickness distribution within the coating film are not affected, allowing coating with good reproducibility. The amount of gas supplied from the forced gas supply port (5a) depends on the rotation speed of the substrate to be coated (1) and the exhaust capacity of the exhaust device (8).
被塗布基板（１）と気流案内板（５）との間隔等にもよ
るが２例えば、基板との間隔が５〜ｌＯＩＩＩｍの場合
０．０５ｊ！ ／ｓｉｎ 〜５１ ／ｗｉｎ好ましくは
０．１１ ／ｓｉｎ 〜２ｉ！／ｍ１ｎ程度である。It depends on the distance between the substrate to be coated (1) and the airflow guide plate (5), etc. 2For example, if the distance between the substrate and the substrate is 5 to lOIIIm, 0.05j! /sin ~51 /win preferably 0.11 /sin ~2i! /m1n.
尚、気流案内板（５）の柱状に突起した突起部外周はＭ
（９）の中心部に穿たれた孔の内壁面と摺動可能である
ので、被塗布基板（１）に対する気流案内板（５）の位
置を制御する制御装置（Ｉ８）の連結ロッド（１９）に
より第２図に示すように気流案内板（５）を上方へ引上
げ被塗布基板（１）との間隔を広げて、気流案内板（５
）と被塗布基板（１）との間に水平方向に移動可能な塗
布液滴下ノズル（１３）を容器（１Ｇ）の側面から差入
れることもできる。In addition, the outer circumference of the columnar protrusion of the airflow guide plate (5) is M.
The connecting rod (19) of the control device (I8) that controls the position of the airflow guide plate (5) with respect to the substrate (1) to be coated is connected to the connecting rod (19), which can slide on the inner wall surface of the hole bored in the center of the rod (9). ), as shown in Figure 2, pull the airflow guide plate (5) upward to widen the distance between it and the substrate to be coated (1).
) and the substrate to be coated (1), a horizontally movable coating liquid dropping nozzle (13) can also be inserted from the side of the container (1G).
尚、前記連結ロッド（１９）は気流案内板（５）と結合
している。塗布液滴下ノズル（１３）によりレジスト等
の液状体を被塗布基板（１）上のほぼ中心部に滴下した
後、塗布液滴下ノズル（１３）は水平方向に移動して気
流案内板（５）と被塗布基板（ｌ〉との間（６）から退
く。その後、気流案内板（５）は前記制御装置（１８）
の連結ロッド（１９）により所定の位置まで降下し前述
のような回転塗布が行なわれる。従って、蓋（９）を開
閉することなく塗布液を被塗布基板に滴下できる。Note that the connecting rod (19) is coupled to the airflow guide plate (5). After the coating liquid dropping nozzle (13) drops a liquid material such as a resist onto the approximately center portion of the substrate to be coated (1), the coating liquid dropping nozzle (13) moves horizontally to the air flow guide plate (5). and the substrate to be coated (l) (6).Then, the airflow guide plate (5) is removed from the control device (18).
is lowered to a predetermined position by the connecting rod (19), and the above-mentioned rotational coating is performed. Therefore, the coating liquid can be dripped onto the substrate to be coated without opening or closing the lid (9).
（発明の効果）
本発明のスピンコーティング装置は被塗布基板の塗布膜
内の膜厚を一定に塗布でき、かつ一定の膜厚を何枚もの
基板にわたり塗布することができる。(Effects of the Invention) The spin coating apparatus of the present invention can coat a coated substrate with a constant film thickness, and can coat a number of substrates with a constant film thickness.
第１図及び第２図は本発明の一実施例のスピンコーティ
ング装置の概略部分断面図、第３図は第４図の■−■線
に沿った従来のスピンコーティング装置の概略部分断面
図、第４図は従来のスピンコーティング装置の蓋の平面
図である。
１・・・被塗布基板 ２・・・回転テーブル５・
・・気流案内板 ５ａ・・・強制気体供給ロア・
・・強制送気装置 １１・・・強制送気配管１３・
・・塗布液滴下ノズル
出願人 富士写真フィルム株式会社代理人 弁
理士 加 藤 朝 道（外１名）
１１１ 図
第２図
第３図
第４図1 and 2 are schematic partial cross-sectional views of a spin coating apparatus according to an embodiment of the present invention, and FIG. 3 is a schematic partial cross-sectional view of a conventional spin coating apparatus taken along the line ■-■ in FIG. 4. FIG. 4 is a plan view of a lid of a conventional spin coating apparatus. 1... Substrate to be coated 2... Rotary table 5.
・Airflow guide plate 5a...Forced gas supply lower・
... Forced air supply device 11... Forced air piping 13.
...Coating liquid dripping nozzle Applicant Fuji Photo Film Co., Ltd. Agent Patent attorney Asami Kato (1 other person) 111 Figure 2 Figure 3 Figure 4
Claims (2)
状体を該基板に塗布する装置に、気体の強制的供給口を
被塗布基板の中心部に有し回転中の前記基板の塗布面近
傍に略平行に配した気流案内板を備えたことを特徴とす
るスピンコーティング装置。(1) A device for coating a liquid on a substrate by rotating the substrate, having a forced gas supply port in the center of the substrate to be coated, and the coating surface of the substrate being rotated. A spin coating apparatus characterized by comprising an airflow guide plate arranged approximately parallel to the vicinity.
する間隔を制御し得ることを特徴とする特許請求の範囲
第１項記載のスピンコーティング装置。(2) The spin coating apparatus according to claim 1, wherein the distance between the airflow guide plate and the surface of the substrate to be coated can be controlled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30943087A JPH01151972A (en) | 1987-12-09 | 1987-12-09 | Spin coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30943087A JPH01151972A (en) | 1987-12-09 | 1987-12-09 | Spin coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01151972A true JPH01151972A (en) | 1989-06-14 |
Family
ID=17992911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30943087A Pending JPH01151972A (en) | 1987-12-09 | 1987-12-09 | Spin coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01151972A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130430U (en) * | 1991-05-17 | 1992-11-30 | ヤマハ株式会社 | Rotary coating device |
| JP2004160336A (en) * | 2002-11-12 | 2004-06-10 | Seiko Epson Corp | Film forming apparatus, film forming method, manufacturing method for organic el device and liquid discharge device |
| JP2008257087A (en) * | 2007-04-09 | 2008-10-23 | Hoya Corp | Manufacturing methods of mask blank and photomask |
-
1987
- 1987-12-09 JP JP30943087A patent/JPH01151972A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130430U (en) * | 1991-05-17 | 1992-11-30 | ヤマハ株式会社 | Rotary coating device |
| JP2004160336A (en) * | 2002-11-12 | 2004-06-10 | Seiko Epson Corp | Film forming apparatus, film forming method, manufacturing method for organic el device and liquid discharge device |
| JP2008257087A (en) * | 2007-04-09 | 2008-10-23 | Hoya Corp | Manufacturing methods of mask blank and photomask |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5705223A (en) | Method and apparatus for coating a semiconductor wafer | |
| US5254367A (en) | Coating method and apparatus | |
| JPH06262125A (en) | Spin coating method and device | |
| JPH02119974A (en) | Method and apparatus for equally coating substrate with resin | |
| US6761930B2 (en) | Method of coating solution on substrate surface using a slit nozzle | |
| JPH01151972A (en) | Spin coating device | |
| US6576055B2 (en) | Method and apparatus for controlling air over a spinning microelectronic substrate | |
| JPH0929158A (en) | Rotary coater | |
| JP3461068B2 (en) | Rotating cup type liquid supply device | |
| JPH0722361A (en) | Coater | |
| JPS59217329A (en) | Spinner apparatus | |
| JPH04156974A (en) | Spinner device | |
| JPH01151973A (en) | Spin coating device | |
| JPH0632674Y2 (en) | Photoresist coating device | |
| JPH02198131A (en) | Removal of unnecessary resist adhering to substrate and spin-coat apparatus | |
| JP2649156B2 (en) | Resist coating apparatus and method | |
| JPH01159080A (en) | Rotary coating device | |
| JPS6085524A (en) | Resist applying method | |
| JP2736769B2 (en) | Coating device | |
| JP3004824U (en) | Fluid coating device | |
| JPH0461955A (en) | Rotary coating device | |
| JPH04171072A (en) | Substrate coater | |
| JPS63294965A (en) | Rotary coating device | |
| JPS60152029A (en) | Coating device | |
| JPS63119236A (en) | Applying method of resist |