JP7343220B2 - レジストインク - Google Patents
レジストインク Download PDFInfo
- Publication number
- JP7343220B2 JP7343220B2 JP2021573054A JP2021573054A JP7343220B2 JP 7343220 B2 JP7343220 B2 JP 7343220B2 JP 2021573054 A JP2021573054 A JP 2021573054A JP 2021573054 A JP2021573054 A JP 2021573054A JP 7343220 B2 JP7343220 B2 JP 7343220B2
- Authority
- JP
- Japan
- Prior art keywords
- reflectance
- deep ultraviolet
- zirconium oxide
- resist ink
- oxide powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 239000000843 powder Substances 0.000 claims description 50
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 39
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 39
- 239000002245 particle Substances 0.000 claims description 33
- 229920001296 polysiloxane Polymers 0.000 claims description 11
- 230000007423 decrease Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 38
- 239000000976 ink Substances 0.000 description 28
- 230000001681 protective effect Effects 0.000 description 18
- 239000011521 glass Substances 0.000 description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000010954 inorganic particle Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 230000001954 sterilising effect Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 241000894006 Bacteria Species 0.000 description 2
- 230000006750 UV protection Effects 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000588724 Escherichia coli Species 0.000 description 1
- 241000589517 Pseudomonas aeruginosa Species 0.000 description 1
- 229920000995 Spectralon Polymers 0.000 description 1
- 241000700605 Viruses Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000004887 air purification Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
レジストインクに硬化剤(ジオクチル錫(日東化成株式会社))を1wt%添加し、#325のメッシュを使用してスクリーン印刷によりガラス基板へ印刷した。印刷層数を変化させることで膜厚を調整した。印刷後180℃で2時間硬化させてレジストインクを塗布した深紫外線高反射保護膜付きガラス基板を作製した。
作製した深紫外線高反射保護膜付きガラス基板に、波長265nmの紫外線を37mW/cm2に調整し、1000時間照射した。照射前後での波長265nmにおける反射率変化を測定した。
作製した深紫外線反射基板および紫外線照射後の該基板について、分光光度計を用いて深紫外線反射率を測定した。ベースとしてスペクトラロン(labsphere製)を用い、積分球を用いて拡散反射率を測定した。
2・・・封止樹脂
3・・・深紫外線LEDチップ
4・・・金線
5・・・保護膜(高反射絶縁膜)
6・・・金属基板
7・・・シリコーン
8・・・酸化ジルコニウム粉末
Claims (2)
- レジストインクであって、必須成分としてシリコーンと、平均粒子径(D50)が0.5μm以上1μm以下の酸化ジルコニウム粉末を32wt%以上37wt%以下含有し、基材上に30μm以上100μm以下の膜厚で塗布され架橋硬化されたときに、250~280nmの波長領域における拡散反射率が85%以上であることを特徴とするレジストインク。
- 波長265nmの深紫外線を1000時間照射したあとの、波長265nmにおける反射率低下が5%以下であることを特徴とする請求項1に記載のレジストインク。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020007148 | 2020-01-20 | ||
JP2020007148 | 2020-01-20 | ||
PCT/JP2021/000293 WO2021149497A1 (ja) | 2020-01-20 | 2021-01-07 | レジストインク |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021149497A1 JPWO2021149497A1 (ja) | 2021-07-29 |
JP7343220B2 true JP7343220B2 (ja) | 2023-09-12 |
Family
ID=76992584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021573054A Active JP7343220B2 (ja) | 2020-01-20 | 2021-01-07 | レジストインク |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7343220B2 (ja) |
CN (1) | CN114762135A (ja) |
TW (1) | TWI821629B (ja) |
WO (1) | WO2021149497A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN219676409U (zh) | 2023-02-15 | 2023-09-12 | 光森科技有限公司 | 光源模组 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006104061A1 (ja) | 2005-03-29 | 2006-10-05 | Kyocera Corporation | 反射部材、これを用いた発光装置および照明装置 |
JP2011258611A (ja) | 2010-06-04 | 2011-12-22 | Sharp Corp | 発光装置 |
WO2012144492A1 (ja) | 2011-04-18 | 2012-10-26 | イビデン株式会社 | Led基板、発光モジュール、led基板の製造方法、及び発光モジュールの製造方法 |
WO2013154133A1 (ja) | 2012-04-13 | 2013-10-17 | シャープ株式会社 | 光散乱体、光散乱体膜、光散乱体基板、光散乱体デバイス、発光デバイス、表示装置、および照明装置 |
JP2014135400A (ja) | 2013-01-10 | 2014-07-24 | Konica Minolta Inc | 発光装置及び波長変換素子 |
JP6089144B1 (ja) | 2016-03-30 | 2017-03-01 | 日本タングステン株式会社 | 銅張積層板およびその製造方法 |
US20190044033A1 (en) | 2017-08-03 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Component Having Boundary Element |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7864425B2 (en) * | 2005-09-16 | 2011-01-04 | Panasonic Corporation | Composite material and optical component using the same |
KR101853598B1 (ko) * | 2010-03-23 | 2018-04-30 | 가부시키가이샤 아사히 러버 | 실리콘 수지제 반사 기재, 그 제조 방법, 및 그 반사 기재에 이용하는 원재료 조성물 |
JP6656607B2 (ja) * | 2017-08-04 | 2020-03-04 | 住友大阪セメント株式会社 | 分散液、組成物、封止部材、発光装置、照明器具、表示装置および発光装置の製造方法 |
-
2021
- 2021-01-07 JP JP2021573054A patent/JP7343220B2/ja active Active
- 2021-01-07 CN CN202180006773.9A patent/CN114762135A/zh active Pending
- 2021-01-07 WO PCT/JP2021/000293 patent/WO2021149497A1/ja active Application Filing
- 2021-01-14 TW TW110101385A patent/TWI821629B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006104061A1 (ja) | 2005-03-29 | 2006-10-05 | Kyocera Corporation | 反射部材、これを用いた発光装置および照明装置 |
JP2011258611A (ja) | 2010-06-04 | 2011-12-22 | Sharp Corp | 発光装置 |
WO2012144492A1 (ja) | 2011-04-18 | 2012-10-26 | イビデン株式会社 | Led基板、発光モジュール、led基板の製造方法、及び発光モジュールの製造方法 |
WO2013154133A1 (ja) | 2012-04-13 | 2013-10-17 | シャープ株式会社 | 光散乱体、光散乱体膜、光散乱体基板、光散乱体デバイス、発光デバイス、表示装置、および照明装置 |
JP2014135400A (ja) | 2013-01-10 | 2014-07-24 | Konica Minolta Inc | 発光装置及び波長変換素子 |
JP6089144B1 (ja) | 2016-03-30 | 2017-03-01 | 日本タングステン株式会社 | 銅張積層板およびその製造方法 |
US20190044033A1 (en) | 2017-08-03 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Component Having Boundary Element |
Also Published As
Publication number | Publication date |
---|---|
WO2021149497A1 (ja) | 2021-07-29 |
JPWO2021149497A1 (ja) | 2021-07-29 |
CN114762135A (zh) | 2022-07-15 |
TW202128894A (zh) | 2021-08-01 |
TWI821629B (zh) | 2023-11-11 |
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