JP7026111B2 - 微細加工超音波トランスデューサのための電気接点配置 - Google Patents
微細加工超音波トランスデューサのための電気接点配置 Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/20—Application to multi-element transducer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
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- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
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Description
[0001] 本願は、米国特許法119条(e)項に従って、代理人整理番号B1348.70031US00のもとで2016年7月20日に出願された、「ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANSDUCER」という名称の米国仮特許出願第62/352,394号に基づく優先権を主張し、参照によりその全体が本明細書に組み込まれる。
Claims (11)
- 複数のトランスデューサセルを含む超音波オンチップデバイスであって、前記超音波オンチップデバイスは複数の空洞を有し、前記複数の空洞のうちのそれぞれの空洞が、前記複数のトランスデューサセルのうちの1つのトランスデューサセルに対応する、前記超音波オンチップデバイスと、
前記複数のトランスデューサセルの少なくとも1つのトランスデューサセルのために、前記超音波オンチップデバイスの第1の層と集積回路との間に配置された1つまたは複数の導電性接続部と、
前記超音波オンチップデバイスの複数の音響的不活性領域の少なくとも1つの音響的不活性領域に接続された単一の導電性接続部と
を含み、
前記第1の層は前記少なくとも1つのトランスデューサセルの空洞と、前記集積回路との間にあり、
前記単一の導電性接続部が前記第1の層と前記集積回路との間に配置され、前記複数の音響的不活性領域は、前記複数のトランスデューサセルの隣接する対のトランスデューサセルの間に配置されている、装置。 - 前記1つまたは複数の導電性接続部が、前記複数のトランスデューサセルのうちのトランスデューサセルの領域に対して実質的に均一に分散された、請求項1に記載の装置。
- 前記1つまたは複数の導電性接続部が、熱圧着接続部と、共晶接続部と、シリサイド接続部とのうちの1つまたは複数を含む、請求項1に記載の装置。
- 前記1つまたは複数の導電性接続部が、その第1の端部において前記第1の層の導電部と接触し、その第2の端部において前記集積回路の金属層と接触する、請求項1に記載の装置。
- 前記複数のトランスデューサセルが、前記第1の層の導電部上で、前記超音波オンチップデバイスに形成された分離トレンチによって互いに電気的に分離されている、請求項1に記載の装置。
- 前記分離トレンチが、前記複数のトランスデューサセルの個別トランスデューサセルに対応する八角形領域を形成する、請求項5に記載の装置。
- 前記音響的不活性領域が、4つの隣接する八角形領域間の境界によって画定される、請求項6に記載の装置。
- 前記1つまたは複数の接続部のそれぞれが、約100ミクロン(μm)以下の距離によって最も近い隣接接続部から離隔されている、請求項1に記載の装置。
- 前記複数のトランスデューサセルによって画定された超音波トランスデューサアレイを囲む封止リングをさらに含む、請求項1に記載の装置。
- 前記封止リングが、前記第1の層と前記集積回路との間に電気的接続をもたらす、請求項9に記載の装置。
- プローブをさらに備え、前記超音波オンチップデバイスは、前記プローブ内に配置される、請求項1に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662352394P | 2016-06-20 | 2016-06-20 | |
US62/352,394 | 2016-06-20 | ||
PCT/US2017/038105 WO2017222969A1 (en) | 2016-06-20 | 2017-06-19 | Electrical contact arrangement for microfabricated ultrasonic transducer |
Publications (3)
Publication Number | Publication Date |
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JP2019522449A JP2019522449A (ja) | 2019-08-08 |
JP2019522449A5 JP2019522449A5 (ja) | 2020-07-27 |
JP7026111B2 true JP7026111B2 (ja) | 2022-02-25 |
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JP2019518183A Active JP7026111B2 (ja) | 2016-06-20 | 2017-06-19 | 微細加工超音波トランスデューサのための電気接点配置 |
Country Status (9)
Country | Link |
---|---|
US (3) | US10497856B2 (ja) |
EP (1) | EP3471897B1 (ja) |
JP (1) | JP7026111B2 (ja) |
KR (1) | KR20190022644A (ja) |
CN (2) | CN113857023B (ja) |
AU (1) | AU2017281280B2 (ja) |
CA (1) | CA3026157A1 (ja) |
TW (1) | TWI721183B (ja) |
WO (1) | WO2017222969A1 (ja) |
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US10497856B2 (en) * | 2016-06-20 | 2019-12-03 | Butterfly Network, Inc. | Electrical contact arrangement for microfabricated ultrasonic transducer |
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US11515465B2 (en) * | 2018-02-26 | 2022-11-29 | Invensense, Inc. | EMI reduction in piezoelectric micromachined ultrasound transducer array |
KR102637666B1 (ko) * | 2018-05-14 | 2024-02-16 | 엑소 이미징, 인크. | 열압착 본딩, 공융 본딩, 및 솔더 본딩을 사용하는 마이크로머신 pMUT 어레이들 및 전자기기들을 위한 통합 기법들 |
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US11440051B2 (en) | 2020-02-26 | 2022-09-13 | General Electric Company | Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing |
IT202000004777A1 (it) | 2020-03-06 | 2021-09-06 | St Microelectronics Srl | Trasduttore ultrasonico microlavorato piezoelettrico |
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CN111884647B (zh) * | 2020-08-13 | 2023-09-29 | 中国工程物理研究院电子工程研究所 | 一种压电微机械声波换能器阵列耦合隔离方法 |
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AU2017281280B2 (en) | 2022-01-06 |
US20170365774A1 (en) | 2017-12-21 |
AU2017281280A1 (en) | 2018-12-06 |
US10497856B2 (en) | 2019-12-03 |
KR20190022644A (ko) | 2019-03-06 |
CN113857023B (zh) | 2022-08-02 |
TW201808786A (zh) | 2018-03-16 |
EP3471897A4 (en) | 2020-01-15 |
EP3471897A1 (en) | 2019-04-24 |
EP3471897C0 (en) | 2023-08-02 |
US20200066966A1 (en) | 2020-02-27 |
CN109414727B (zh) | 2021-09-28 |
TWI721183B (zh) | 2021-03-11 |
CA3026157A1 (en) | 2017-12-28 |
CN113857023A (zh) | 2021-12-31 |
WO2017222969A1 (en) | 2017-12-28 |
EP3471897B1 (en) | 2023-08-02 |
US20240122073A1 (en) | 2024-04-11 |
CN109414727A (zh) | 2019-03-01 |
US11672179B2 (en) | 2023-06-06 |
JP2019522449A (ja) | 2019-08-08 |
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