JP6971991B2 - 回転式ウェーハ支持組立体のための温度感知システム - Google Patents
回転式ウェーハ支持組立体のための温度感知システム Download PDFInfo
- Publication number
- JP6971991B2 JP6971991B2 JP2018541108A JP2018541108A JP6971991B2 JP 6971991 B2 JP6971991 B2 JP 6971991B2 JP 2018541108 A JP2018541108 A JP 2018541108A JP 2018541108 A JP2018541108 A JP 2018541108A JP 6971991 B2 JP6971991 B2 JP 6971991B2
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- Japan
- Prior art keywords
- wafer support
- semiconductor processing
- support assembly
- processing apparatus
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
本願は、2016年2月8日出願の米国仮特許出願第62/292,614号の恩典を主張する。上記出願の開示をここに参考文献としてそっくりそのまま援用する。
12 ウェーハ支持組立体
14 温度感知システム
16 ウェーハ支持部
18 半導体処理チャンバ
20 シャフト
22 壁
24 ヒーター
25 ヒーター制御モジュール
26 温度センサ
28 感知制御ユニット
29 ワイヤ
30 誘導性電源充電モジュール
32 DC電源
34 インタラクティブWiFi接続モジュール
36 オペレーティングシステム電子モジュール
38 アクセス電子モジュール
39 冷却デバイス
40 走査感知電子入力モジュール
42 送信器
44 受信器
46 バッテリ
Claims (13)
- シャフトを含むウェーハ支持組立体と、
前記ウェーハ支持組立体に組み込まれ、前記ウェーハ支持組立体の温度を測定するための複数の温度センサであって、当該複数の温度センサによる前記ウェーハ支持組立体の温度測定値に関する第1信号を送信する、複数の温度センサと、
前記温度センサから離れて配置された感知制御ユニットであって、前記第1信号を受信し、前記第1信号を送信した前記複数の温度センサの場所を判断し、前記複数の温度センサによる前記温度測定値に関する前記第1信号と前記複数の温度センサの前記場所に関する第2信号とを無線パケットに変換する、感知制御ユニットと、
を備え、
前記感知制御ユニットが信号送信デバイスを有し、前記信号送信デバイスは、前記ウェーハ支持組立体の前記シャフト内に配置されて前記シャフトとともに回転可能とされ、且つ前記無線パケットを外部制御モジュールへ無線送信するようにされた、半導体加工装置。 - 前記信号送信デバイスが、WiFi接続モジュールを含んでいる、請求項1に記載の半導体加工装置。
- 前記ウェーハ支持組立体に組み込まれたDC電源と、前記ウェーハ支持組立体の外に配置されている誘導性電源充電モジュールと、を更に備えている、請求項1に記載の半導体加工装置。
- 前記誘導性電源充電モジュールが第1コイルを含み、前記DC電源が第2コイルを含み、前記第1コイルが磁場を生成して前記第2コイルに電流を誘導するようにされた、請求項3に記載の半導体加工装置。
- 前記ウェーハ支持組立体に組み込まれた感知電子入力モジュールを更に備えている、請求項1に記載の半導体加工装置。
- 前記ウェーハ支持組立体は、前記シャフトに接続されたウェーハ支持部を含んでおり、前記温度センサは前記ウェーハ支持部に配置され、前記信号送信デバイスは前記シャフト内に配置されている、請求項1に記載の半導体加工装置。
- 前記ウェーハ支持組立体の前記ウェーハ支持部の下に配置されているヒーターを更に備えている、請求項6に記載の半導体加工装置。
- 前記ウェーハ支持組立体は回転可能である、請求項6に記載の半導体加工装置。
- 前記外部制御モジュールが、ヒーターを前記温度測定値に基づいて制御するヒーター制御モジュールである、請求項1に記載の半導体加工装置。
- 感知電子入力モジュールとアクセス電子モジュールとオペレーティングシステム電子モジュールのうちの少なくとも1つを更に備えている、請求項1に記載の半導体加工装置。
- 処理チャンバと、上記請求項1に記載の半導体加工装置と、を備えている半導体加工システム。
- 前記ウェーハ支持組立体が、前記処理チャンバ内部に配置されていて前記シャフトに接続されているウェーハ支持部を含み、前記シャフトは前記処理チャンバの壁を貫いて延びている、請求項11に記載の半導体加工システム。
- 前記シャフトの周りに配置されている冷却デバイスを更に備えている、請求項12に記載の半導体加工システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662292614P | 2016-02-08 | 2016-02-08 | |
US62/292,614 | 2016-02-08 | ||
PCT/US2017/016975 WO2017139353A1 (en) | 2016-02-08 | 2017-02-08 | Temperature sensing system for rotatable wafer support assembly |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019511111A JP2019511111A (ja) | 2019-04-18 |
JP2019511111A5 JP2019511111A5 (ja) | 2020-03-12 |
JP6971991B2 true JP6971991B2 (ja) | 2021-11-24 |
Family
ID=58094524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018541108A Active JP6971991B2 (ja) | 2016-02-08 | 2017-02-08 | 回転式ウェーハ支持組立体のための温度感知システム |
Country Status (7)
Country | Link |
---|---|
US (1) | US20170229331A1 (ja) |
EP (1) | EP3414541B1 (ja) |
JP (1) | JP6971991B2 (ja) |
KR (1) | KR20180114088A (ja) |
CN (1) | CN108885139A (ja) |
TW (1) | TWI636519B (ja) |
WO (1) | WO2017139353A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102638073B1 (ko) * | 2018-03-06 | 2024-02-20 | 도쿄엘렉트론가부시키가이샤 | 액 처리 장치 및 액 처리 방법 |
WO2020059722A1 (ja) * | 2018-09-18 | 2020-03-26 | 株式会社Kokusai Electric | 基板処理装置、温度制御システム及び半導体装置の製造方法 |
CN110707035A (zh) * | 2019-10-16 | 2020-01-17 | 北京北方华创微电子装备有限公司 | 静电卡盘、半导体处理腔室及设备 |
FR3103314B1 (fr) * | 2019-11-14 | 2021-10-08 | Safran Electronics & Defense | Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant |
JP7411431B2 (ja) | 2020-01-31 | 2024-01-11 | 新光電気工業株式会社 | 静電チャック、基板固定装置 |
TWI755996B (zh) * | 2020-12-24 | 2022-02-21 | 天虹科技股份有限公司 | 用以產生均勻溫度的晶圓承載盤及應用該晶圓承載盤的薄膜沉積裝置 |
AT526503B1 (de) | 2022-12-15 | 2024-04-15 | Sensideon Gmbh | Vorrichtung zur in-situ Oberflächentemperaturmessung von Beschichtungsobjekten in einem Gasphasenabscheidungsverfahren |
CN116005136A (zh) * | 2023-01-16 | 2023-04-25 | 深圳市原速光电科技有限公司 | 原子层沉积设备 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4491173A (en) * | 1982-05-28 | 1985-01-01 | Temptronic Corporation | Rotatable inspection table |
JP3590341B2 (ja) * | 2000-10-18 | 2004-11-17 | 東京エレクトロン株式会社 | 温度測定装置及び温度測定方法 |
TW594455B (en) * | 2001-04-19 | 2004-06-21 | Onwafer Technologies Inc | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
US20050211385A1 (en) * | 2001-04-30 | 2005-09-29 | Lam Research Corporation, A Delaware Corporation | Method and apparatus for controlling spatial temperature distribution |
JP2002343696A (ja) * | 2001-05-11 | 2002-11-29 | Tokyo Electron Ltd | 基板の処理装置 |
US20050092246A1 (en) * | 2002-02-22 | 2005-05-05 | Peter Baumann | Device for depositing thin layers with a wireless detection of process parameters |
DE10207901A1 (de) * | 2002-02-22 | 2003-09-04 | Aixtron Ag | Vorrichtung zum Abschneiden dünner Schichten mit drahtloser Prozessparameter-Aufnahme |
JP2004111630A (ja) * | 2002-09-18 | 2004-04-08 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
JP2004207687A (ja) * | 2002-12-10 | 2004-07-22 | Sharp Corp | 半導体製造装置とそれを用いた半導体製造方法 |
JP2004334622A (ja) * | 2003-05-09 | 2004-11-25 | Hakko Electric Mach Works Co Ltd | 環境情報測定装置及びこれを用いた温度制御システム |
EP1787179A2 (en) * | 2004-08-31 | 2007-05-23 | Watlow Electric Manufacturing Company | Operations system distributed diagnostic system |
US20070095160A1 (en) * | 2005-11-03 | 2007-05-03 | The Boeing Company | Structural assessment and monitoring system and associated method |
US7826724B2 (en) * | 2006-04-24 | 2010-11-02 | Nordson Corporation | Electronic substrate non-contact heating system and method |
US7581876B2 (en) * | 2006-07-15 | 2009-09-01 | Cem Corporation | Dual energy source loss-on-drying instrument |
US7629184B2 (en) * | 2007-03-20 | 2009-12-08 | Tokyo Electron Limited | RFID temperature sensing wafer, system and method |
JP2009054993A (ja) * | 2007-08-02 | 2009-03-12 | Tokyo Electron Ltd | 位置検出用治具 |
US7993057B2 (en) * | 2007-12-20 | 2011-08-09 | Asm America, Inc. | Redundant temperature sensor for semiconductor processing chambers |
US20120020808A1 (en) * | 2009-04-01 | 2012-01-26 | Lawson Rick A | Wireless Monitoring of Pump Jack Sucker Rod Loading and Position |
US9297705B2 (en) * | 2009-05-06 | 2016-03-29 | Asm America, Inc. | Smart temperature measuring device |
CN201936433U (zh) * | 2009-11-16 | 2011-08-17 | 武汉阿米特科技有限公司 | 远程室温实时监测装置 |
US8930147B2 (en) * | 2010-02-05 | 2015-01-06 | Prima-Temp, Inc. | Multi-sensor patch and system |
CN201966669U (zh) * | 2011-02-22 | 2011-09-07 | 惠州Tcl移动通信有限公司 | 无线充电***及无线充电器 |
TWI467958B (zh) * | 2012-12-21 | 2015-01-01 | Leadot Innovation Inc | 溝通頻率低於WiFi訊號頻率的遠端控制系統 |
US20140263275A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Rotation enabled multifunctional heater-chiller pedestal |
US9698074B2 (en) * | 2013-09-16 | 2017-07-04 | Applied Materials, Inc. | Heated substrate support with temperature profile control |
JP6361495B2 (ja) * | 2014-12-22 | 2018-07-25 | 東京エレクトロン株式会社 | 熱処理装置 |
GB2539723A (en) * | 2015-06-25 | 2016-12-28 | Airspan Networks Inc | A rotable antenna apparatus |
-
2017
- 2017-02-08 EP EP17706363.3A patent/EP3414541B1/en active Active
- 2017-02-08 KR KR1020187025326A patent/KR20180114088A/ko not_active Application Discontinuation
- 2017-02-08 US US15/427,701 patent/US20170229331A1/en not_active Abandoned
- 2017-02-08 JP JP2018541108A patent/JP6971991B2/ja active Active
- 2017-02-08 TW TW106104152A patent/TWI636519B/zh active
- 2017-02-08 WO PCT/US2017/016975 patent/WO2017139353A1/en active Application Filing
- 2017-02-08 CN CN201780009778.0A patent/CN108885139A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3414541B1 (en) | 2020-09-30 |
EP3414541A1 (en) | 2018-12-19 |
TW201735216A (zh) | 2017-10-01 |
US20170229331A1 (en) | 2017-08-10 |
CN108885139A (zh) | 2018-11-23 |
JP2019511111A (ja) | 2019-04-18 |
KR20180114088A (ko) | 2018-10-17 |
TWI636519B (zh) | 2018-09-21 |
WO2017139353A1 (en) | 2017-08-17 |
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