JP6885422B2 - 樹脂基板および電子機器 - Google Patents
樹脂基板および電子機器 Download PDFInfo
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- JP6885422B2 JP6885422B2 JP2019115106A JP2019115106A JP6885422B2 JP 6885422 B2 JP6885422 B2 JP 6885422B2 JP 2019115106 A JP2019115106 A JP 2019115106A JP 2019115106 A JP2019115106 A JP 2019115106A JP 6885422 B2 JP6885422 B2 JP 6885422B2
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- Prior art keywords
- resin
- conductor
- resin substrate
- conductor pattern
- interlayer connecting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
11:表面
12:裏面
90:プリント配線板
100:本体
101,102,103,104,105,106:樹脂シート
201,202:外部接続導体
210,220:導体パターン
310,320:層間接続導体
901,902:ランド導体
P01:第1部分
P02:第2部分
V310,V320:穴
Claims (4)
- 平面状の導体パターンが形成された樹脂シートを備え、該樹脂シートを含む複数の樹脂シートが積層された長手方向を有する樹脂基板であって、
積層方向の他方端よりも一方端側に近い前記樹脂シートによって構成される第1部分と、
前記複数の樹脂シートにおける前記積層方向の前記一方端よりも前記他方端側に近い前記樹脂シートによって構成される第2部分と、
を備え、
前記第1部分の体積に対する前記第1部分の前記導体パターンの密度は、前記第2部分の体積に対する前記第2部分の前記導体パターンの密度よりも低く、
前記第1部分に形成される第1層間接続導体の径の平均は、前記第2部分に形成される第2層間接続導体の径の平均よりも大きく、
前記第1部分を構成する前記樹脂シートにおいて、隣り合う2つの樹脂シートの第1層間接続導体は、前記2つの樹脂シートのそれぞれにおいて前記導体パターンが形成されていない面で当該第1層間接続導体の面同士が接続され、
前記長手方向に延びる長尺状の外形を有し、
前記複数の樹脂シートは、同じ材料からなる、
樹脂基板。 - 前記第2部分の体積に対する前記第2部分の前記導体パターンと前記第2層間接続導体の密度を基準とした、前記第1部分の体積に対する前記第1部分の前記導体パターンと前記第1層間接続導体の密度の比は、0.5以上1.0以下である、
請求項1に記載の樹脂基板。 - 前記複数の樹脂シートは、熱可塑性樹脂からなる、
請求項1または請求項2に記載の樹脂基板。 - 平面状の導体パターンが形成された樹脂シートを備え、前記樹脂シートを含む複数の樹脂シートが積層された長手方向を有する樹脂基板であって、
前記樹脂基板は、
積層方向の他方端よりも一方端側に近い前記樹脂シートによって構成される第1部分と、
前記複数の樹脂シートにおける前記積層方向の前記一方端よりも前記他方端側に近い前記樹脂シートによって構成される第2部分と、
を備え、
前記第1部分の体積に対する前記第1部分の前記導体パターンの密度は、前記第2部分の体積に対する前記第2部分の前記導体パターンの密度よりも低く、
前記第1部分に形成される第1層間接続導体の径の平均は、前記第2部分に形成される第2層間接続導体の径の平均よりも大きく、
前記第1部分を構成する前記樹脂シートにおいて、隣り合う2つの樹脂シートの第1層間接続導体は、前記2つの樹脂シートのそれぞれにおいて前記導体パターンが形成されていない面で当該第1層間接続導体の面同士が接続され、
外部接続導体によって、他基板と接続し、
前記樹脂基板は、前記長手方向に延びる長尺状の外形を有し、
前記樹脂基板の前記複数の樹脂シートは、同じ材料からなる、
電子機器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016040554 | 2016-03-03 | ||
JP2016040554 | 2016-03-03 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018503097A Division JP6547898B2 (ja) | 2016-03-03 | 2017-02-24 | 樹脂基板および電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019153819A JP2019153819A (ja) | 2019-09-12 |
JP6885422B2 true JP6885422B2 (ja) | 2021-06-16 |
Family
ID=59742864
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018503097A Active JP6547898B2 (ja) | 2016-03-03 | 2017-02-24 | 樹脂基板および電子機器 |
JP2019115106A Active JP6885422B2 (ja) | 2016-03-03 | 2019-06-21 | 樹脂基板および電子機器 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018503097A Active JP6547898B2 (ja) | 2016-03-03 | 2017-02-24 | 樹脂基板および電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10257923B2 (ja) |
JP (2) | JP6547898B2 (ja) |
WO (1) | WO2017150361A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN215268953U (zh) * | 2018-09-27 | 2021-12-21 | 株式会社村田制作所 | 树脂多层基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009152282A (ja) * | 2007-12-19 | 2009-07-09 | Shinko Electric Ind Co Ltd | 集合配線基板及び半導体パッケージ |
JP5660462B2 (ja) | 2011-05-13 | 2015-01-28 | イビデン株式会社 | プリント配線板 |
JP5869058B2 (ja) * | 2014-06-30 | 2016-02-24 | 株式会社東芝 | 半導体装置およびシステム |
JP6375159B2 (ja) | 2014-07-07 | 2018-08-15 | 新光電気工業株式会社 | 配線基板、半導体パッケージ |
-
2017
- 2017-02-24 WO PCT/JP2017/007010 patent/WO2017150361A1/ja active Application Filing
- 2017-02-24 JP JP2018503097A patent/JP6547898B2/ja active Active
-
2018
- 2018-08-23 US US16/109,915 patent/US10257923B2/en active Active
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2019
- 2019-06-21 JP JP2019115106A patent/JP6885422B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2017150361A1 (ja) | 2017-09-08 |
JP2019153819A (ja) | 2019-09-12 |
US10257923B2 (en) | 2019-04-09 |
JP6547898B2 (ja) | 2019-07-24 |
US20180368254A1 (en) | 2018-12-20 |
JPWO2017150361A1 (ja) | 2018-10-25 |
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