JP6850708B2 - アクチュエータの製造方法 - Google Patents
アクチュエータの製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 95
- 229920002595 Dielectric elastomer Polymers 0.000 claims description 236
- 239000000463 material Substances 0.000 claims description 105
- 230000002093 peripheral effect Effects 0.000 claims description 75
- 238000003780 insertion Methods 0.000 claims description 39
- 230000037431 insertion Effects 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 31
- 239000007772 electrode material Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 32
- 230000008569 process Effects 0.000 description 12
- 239000000243 solution Substances 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011162 core material Substances 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000004323 axial length Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/006—Electrostatic motors of the gap-closing type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
- H02N2/001—Driving devices, e.g. vibrators
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
- H02N2/04—Constructional details
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/22—Methods relating to manufacturing, e.g. assembling, calibration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Description
14…電極層 16…第1配線
18…第2配線 22…軸部
23…層形成治具 24…枠部材
28、60…誘電エラストマ材料 30…電極材料
44…板部 44b、70…挿通孔
74…第1円筒状部材 76…第2円筒状部材
Claims (5)
- 円筒状の誘電エラストマ層の内周面及び外周面のそれぞれに円筒状の電極層が臨むように、前記誘電エラストマ層と前記電極層とを同心円状に積層したアクチュエータの製造方法であって、
軸部を有する層形成治具の前記軸部の外周面に電極材料を設けて前記電極層を形成する第1電極層形成工程と、
前記電極層の外周面にシート状の誘電エラストマ材料を設けて前記誘電エラストマ層を形成する誘電エラストマ層形成工程と、
前記誘電エラストマ層の外周面に前記電極材料を設けて前記電極層を形成する第2電極層形成工程と、
を有し、
前記誘電エラストマ層形成工程では、
前記シート状の前記誘電エラストマ材料の面方向と前記軸部の軸方向とを互いに交わるように配置して、前記誘電エラストマ材料に当接させた前記軸部の先端面を支点に、前記誘電エラストマ材料に前記軸部の軸方向に沿う方向に引っ張り力を加えることで、前記電極層の外周面に前記誘電エラストマ材料を沿わせて前記誘電エラストマ層を形成すること、を特徴とするアクチュエータの製造方法。 - 請求項1記載のアクチュエータの製造方法において、
前記誘電エラストマ層形成工程と、前記第2電極層形成工程とを繰り返して、必要数の前記誘電エラストマ層と前記電極層とを積層することで積層体を形成した後、前記積層体の軸方向の両端を切断する切断工程をさらに有すること、を特徴とするアクチュエータの製造方法。 - 円筒状の誘電エラストマ層の内周面及び外周面のそれぞれに円筒状の電極層が臨むように、前記誘電エラストマ層と前記電極層とを同心円状に積層したアクチュエータの製造方法であって、
軸部を有する層形成治具の前記軸部の外周面に電極材料を設けて前記電極層を形成する第1電極層形成工程と、
前記電極層の外周面にペースト状の誘電エラストマ材料を設けて前記誘電エラストマ層を形成する誘電エラストマ層形成工程と、
前記誘電エラストマ層の外周面に前記電極材料を設けて前記電極層を形成する第2電極層形成工程と、
を有し、
前記誘電エラストマ層形成工程では、
前記電極層の外径よりも大きく且つ前記ペースト状の前記誘電エラストマ材料の塗布厚さに応じた大きさの径の挿通孔が設けられた板部の前記挿通孔上にペースト状の前記誘電エラストマ材料を配置して、前記挿通孔に前記軸部を挿通した状態で前記板部と前記軸部とを軸方向に沿って相対的に移動させることで、前記電極層の外周面に前記誘電エラストマ材料を塗布すること、を特徴とするアクチュエータの製造方法。 - 請求項1〜3の何れか1項に記載のアクチュエータの製造方法において、
同心円状に積層した前記誘電エラストマ層及び前記電極層の径方向の中心から外側に向かって、一つおきに隣接する前記電極層と第1配線とを電気的に接続するとともに、前記第1配線と接続しない前記電極層と第2配線とを電気的に接続する工程をさらに有すること、を特徴とするアクチュエータの製造方法。 - 請求項1〜4の何れか1項に記載のアクチュエータの製造方法において、
前記誘電エラストマ材料として、アクリル、シリコーン、ポリウレタンから選択した何れか一つを用いること、を特徴とするアクチュエータの製造方法。
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JP2017192080A JP6850708B2 (ja) | 2017-09-29 | 2017-09-29 | アクチュエータの製造方法 |
US16/139,253 US11031883B2 (en) | 2017-09-29 | 2018-09-24 | Method of manufacturing actuator |
DE102018216579.3A DE102018216579B4 (de) | 2017-09-29 | 2018-09-27 | Verfahren zur Herstellung eines Aktuators |
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Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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US5559387A (en) * | 1994-05-13 | 1996-09-24 | Beurrier; Henry R. | Piezoelectric actuators |
US7548015B2 (en) * | 2000-11-02 | 2009-06-16 | Danfoss A/S | Multilayer composite and a method of making such |
US7233097B2 (en) * | 2001-05-22 | 2007-06-19 | Sri International | Rolled electroactive polymers |
JP3861705B2 (ja) * | 2002-01-31 | 2006-12-20 | 松下電工株式会社 | 電歪アクチュエータ |
US7732998B2 (en) * | 2006-08-03 | 2010-06-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Telescoping cylindrical piezoelectric fiber composite actuator assemblies |
JP2008251833A (ja) | 2007-03-30 | 2008-10-16 | Tokai Rubber Ind Ltd | アクチュエータおよびアクチュエータ集束体 |
JP4922879B2 (ja) * | 2007-03-30 | 2012-04-25 | 東海ゴム工業株式会社 | アクチュエータ |
EP1976036A3 (en) * | 2007-03-30 | 2009-07-22 | Tokai Rubber Industries, Ltd. | Actuator |
JP5002425B2 (ja) * | 2007-11-15 | 2012-08-15 | 東海ゴム工業株式会社 | アクチュエーターの製造方法 |
JP5247123B2 (ja) * | 2007-11-15 | 2013-07-24 | 豊田合成株式会社 | アクチュエータ |
JP2012065426A (ja) * | 2010-09-15 | 2012-03-29 | Toyoda Gosei Co Ltd | アクチュエータの製造方法 |
US9147825B2 (en) * | 2012-03-07 | 2015-09-29 | Board of Regents of the Nevada System of Higher Education on behalf of the University of Nevado, Reno | Methods of fabricating multi-degree of freedom shaped electroactive polymer actuators/sensors for catheters |
GB201310578D0 (en) * | 2013-06-13 | 2013-07-31 | Univ Nottingham Trent | Electroactive actuators |
JP5847225B2 (ja) * | 2014-03-26 | 2016-01-20 | 住友理工株式会社 | 誘電膜およびその製造方法、並びにそれを用いたトランスデューサ |
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- 2017-09-29 JP JP2017192080A patent/JP6850708B2/ja active Active
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- 2018-09-24 US US16/139,253 patent/US11031883B2/en active Active
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Publication number | Publication date |
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JP2019068627A (ja) | 2019-04-25 |
US11031883B2 (en) | 2021-06-08 |
DE102018216579A1 (de) | 2019-04-04 |
DE102018216579B4 (de) | 2020-07-02 |
US20190103819A1 (en) | 2019-04-04 |
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