JP6594930B2 - ウェーハを加工する方法およびウェーハ加工システム - Google Patents
ウェーハを加工する方法およびウェーハ加工システム Download PDFInfo
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Description
4 前面(片面)
6 背面(片面と反対のウェーハの面)
8 粘着テープ
10 第1の環状フレーム
12 中央開口部
14 支持面
16 支持部材
16a 中央部
16b 周縁部
18 面取りされた、またはテーパ状の周縁部分
20 ダイ
22 第2の環状フレーム
24 中央開口部
26 切断手段
28 押圧手段
LB レーザー光線
Claims (10)
- 複数のデバイスが複数の分割線によって仕切られているデバイス領域を片面(4)に有するウェーハ(2)を加工する方法であって、
前記ウェーハ(2)が第1の環状フレーム(10)の中央開口部(12)内に配置されるように、前記ウェーハ(2)の前記片面(4)または前記片面(4)と反対の前記ウェーハ(2)の面(6)を、前記第1の環状フレーム(10)によって支持される粘着テープ(8)に貼着することと、
改質領域を前記ウェーハ(2)内に前記分割線に沿って形成するために、レーザー光線(LB)を前記分割線に沿って前記ウェーハ(2)に照射することと、
前記ウェーハ(2)に貼着される前記粘着テープ(8)の面と反対の前記粘着テープ(8)の面が支持部材(16)の支持面(14)と接触しているように、前記レーザー光線(LB)を前記ウェーハ(2)に照射する前または後に、前記粘着テープ(8)に貼着された前記ウェーハ(2)を支持部材(16)の前記支持面(14)上に置くことであって、前記支持面(14)の平面における前記支持部材(16)の外径が前記第1の環状フレーム(10)の内径よりも小さい、置くことと、
前記レーザー光線(LB)を前記ウェーハ(2)に照射した後、前記粘着テープ(8)を前記支持面(14)の平面上において放射状に伸張させ、それにより前記ウェーハ(2)を前記分割線に沿って複数のダイ(20)に分割するために、前記第1の環状フレーム(10)および前記支持部材(16)の少なくとも周縁部を前記支持面(14)の平面に垂直の方向に互いに対して移動させることと、
第2の環状フレーム(22)を、前記支持部材(16)の前記周縁部に配置された前記伸張された粘着テープ(8)の一部分に貼着することであって、前記第2の環状フレーム(22)が、前記ウェーハ(2)に貼着される前記粘着テープ(8)の面に貼着され、前記複数のダイ(20)に分割された前記ウェーハ(2)が、前記第2の環状フレーム(22)の中央開口部(24)内に配置される、貼着することと、備え、
前記第2の環状フレーム(22)の内径が、前記支持面(14)の平面における前記支持部材(16)の前記外径よりも小さく、かつ前記第1の環状フレーム(10)の前記内径よりも小さく、
前記第2の環状フレーム(22)が、半導体サイズの環状フレームであり、
前記第1の環状フレーム(10)の外径が、前記第2の環状フレーム(22)の外径と実質的に同じである、方法。 - 前記粘着テープ(8)に貼着された前記ウェーハ(2)が、前記レーザー光線(LB)を前記ウェーハ(2)に照射する前に、前記支持部材(16)の前記支持面(14)上に置かれ、
前記改質領域を前記ウェーハ(2)内に前記分割線に沿って形成するために、前記レーザー光線(LB)が、前記支持面(14)上に置かれた前記ウェーハ(2)に前記分割線に沿って照射される、請求項1に記載の方法。 - 前記粘着テープ(8)に貼着された前記ウェーハ(2)が、前記レーザー光線(LB)を前記ウェーハ(2)に照射した後に、前記支持部材(16)の前記支持面(14)上に置かれる、請求項1に記載の方法。
- 前記粘着テープ(8)を前記支持面(14)の平面上において放射状に伸張させ、それにより前記ウェーハ(2)を前記分割線に沿って前記複数のダイ(20)に分割するために、前記第1の環状フレーム(10)および前記支持部材(16)全体が、前記支持面(14)の平面に垂直の方向に互いに対して移動される、請求項1から3のいずれか一項に記載の方法。
- 前記支持部材(16)が、中央部(16a)および前記中央部(16a)を囲む環状の周縁部(16b)を備え、
前記支持部材(16)の前記周縁部(16b)が、前記支持部材(16)の前記中央部(16a)に対して、前記支持面(14)の前記平面に垂直の方向に移動可能であり、
前記粘着テープ(8)を、前記支持面(14)の前記平面上において放射状に伸張させ、それにより前記ウェーハ(2)を前記分割線に沿って前記複数のダイ(20)に分割するために、前記第1の環状フレーム(10)および前記支持部材(16)の前記周縁部(16b)が、前記支持面(14)の前記平面に垂直の方向に互いに対して移動される、請求項1から3のいずれか一項に記載の方法。 - 前記第2の環状フレーム(22)を前記伸張された粘着テープ(8)に貼着した後、前記第2の環状フレーム(22)に貼着される前記粘着テープ(8)の部分の外側に配置される位置で、前記粘着テープ(8)を周方向に切断することをさらに備える、請求項1から5のいずれか一項に記載の方法。
- 前記粘着テープ(8)を切断した後、前記粘着テープ(8)が切断された位置と、前記第2の環状フレーム(22)に貼着される前記粘着テープ(8)の前記部分との間に配置される前記粘着テープ(8)の部分を、前記第2の環状フレーム(22)に貼着することをさらに備える、請求項6に記載の方法。
- 前記第2の環状フレーム(22)の前記内径が、前記支持面(14)の前記平面における前記支持部材(16)の前記外径よりも小さく、および/または前記第1の環状フレーム(10)の前記内径よりも20mm以上小さい、請求項1から7のいずれか一項に記載の方法。
- 複数のデバイスが複数の分割線によって仕切られているデバイス領域を片面(4)に有するウェーハ(2)を加工するためのウェーハ加工システムであって、
前記ウェーハ(2)を上に置くための支持面(14)を有する支持部材(16)と、
第1の環状フレーム(10)を保持するための第1のフレーム保持手段と、
レーザー光線(LB)を前記ウェーハ(2)に前記分割線に沿って照射するためのレーザー光線照射手段と、
半導体サイズの第2の環状フレーム(22)を保持するための第2のフレーム保持手段と、を備え、
前記支持部材(16)および前記第1のフレーム保持手段が、前記第1のフレーム保持手段および前記支持部材(16)の少なくとも周縁部が前記支持面(14)の平面に垂直の方向に互いに対して移動可能であるように、構成され、
前記支持部材(16)および前記第2のフレーム保持手段が、前記第2のフレーム保持手段および前記支持部材(16)の少なくとも前記周縁部が前記支持面(14)の平面に垂直の方向に互いに対して移動可能であるように、構成され、
前記支持面(14)の前記平面における前記支持部材(16)の外径が、前記半導体サイズの第2の環状フレーム(22)の内径よりも大きく、
前記第1の環状フレーム(10)の外径が、前記第2の環状フレーム(22)の外径と実質的に同じである、ウェーハ加工システム。 - 前記第1の環状フレーム(10)をさらに備え、前記支持面(14)の前記平面における前記支持部材(16)の前記外径が、前記第1の環状フレーム(10)の内径よりも小さい、請求項9に記載のウェーハ加工システム。
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JP7012559B2 (ja) * | 2018-02-27 | 2022-01-28 | 株式会社ディスコ | テープ貼着方法及びテープ貼着装置 |
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JP2007081037A (ja) * | 2005-09-13 | 2007-03-29 | Disco Abrasive Syst Ltd | デバイスおよびその製造方法 |
JP4835830B2 (ja) * | 2005-12-22 | 2011-12-14 | 株式会社東京精密 | エキスパンド方法、装置及びダイシング装置 |
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