JP6503518B2 - イメージセンシングチップのパッケージ化方法及びパッケージ構造 - Google Patents
イメージセンシングチップのパッケージ化方法及びパッケージ構造 Download PDFInfo
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- JP6503518B2 JP6503518B2 JP2018537708A JP2018537708A JP6503518B2 JP 6503518 B2 JP6503518 B2 JP 6503518B2 JP 2018537708 A JP2018537708 A JP 2018537708A JP 2018537708 A JP2018537708 A JP 2018537708A JP 6503518 B2 JP6503518 B2 JP 6503518B2
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Description
第1の面と、前記第1の面の反対側の第2の面とを含むウエハであって、前記ウエハはグリッド状に配置された複数のイメージセンシングチップを有し、前記イメージセンシングチップのそれぞれは、前記第1の面の側上に配置されたイメージセンシング領域及び接触パッドを有するウエハを提供することと、
前記接触パッドのそれぞれに対応する開口部であって前記接触パッドは前記開口部を通して露出される開口部、及び切断溝を、前記ウエハの前記第2の面の側上に形成することと、
前記切断溝を第1の感光性インクで充填することと、
第2の感光性インクを前記ウエハの前記第2の面上に塗布して、前記開口部を前記第2の感光性インクで覆い、中空のキャビティを前記開口部内に形成することと、
を含む。
前記第1の感光性インクを前記ウエハの前記第2の面上に塗布して、前記切断溝を前記第1の感光性インクで充填することと、
前記切断溝のエリア外の前記第1の感光性インクを、露光及び現像プロセスによって除去することと、
を含んでもよい。
保護基板であって前記保護基板はグリッド状に配置された支持ユニットを有し、前記支持ユニットのそれぞれは前記イメージセンシングチップのうちの1つに対応する保護基板を提供することと、
前記支持ユニットは前記ウエハと前記保護基板との間にあるように前記ウエハの前記第1の面を前記保護基板と位置合わせし積層することと、
前記ウエハを前記第2の面上で研削し薄くすることと、
をさらに含んでもよい。
プレ切断溝(pre−cutting trenches)及び前記開口部を、前記ウエハの前記第2の面上に、同じエッチングプロセスにおいて形成することと、
前記プレ切断溝に沿って、カッターを用いて、前記ウエハの前記第1の面を通して切断して、前記切断溝を形成することと、
を含んでもよい。
絶縁層を前記開口部の側壁上に形成することと、
前記接触パッドに電気的に接続される再配線層を前記絶縁層上に、及び前記開口部の底において形成することと、
前記第2の感光性インクを前記ウエハの前記第2の面上に、スクリーン印刷プロセスによって塗布して、複数の貫通孔であって前記再配線層は前記貫通孔を通して露出される貫通孔を前記第2の感光性インク上に形成することと、
前記再配線層に電気的に接続されるソルダーボールを前記貫通孔のそれぞれの中に形成することと、
をさらに含んでもよい。
絶縁層を前記開口部の側壁上に形成することと、
前記接触パッドに電気的に接続される再配線層を前記絶縁層上に、及び前記開口部の底において形成することと、
前記第2の感光性インクを前記ウエハの第2の面全体の上に、スピンコーティングプロセスによって塗布することと、
複数の貫通孔であって前記再配線層が前記貫通孔を通して露出される貫通孔を前記第2の感光性インク上に、露光及び現像プロセスによって形成することと、
前記再配線層に電気的に接続されるソルダーボールを前記貫通孔のそれぞれの中に形成することと、
をさらに含んでもよい。
第1の面と、前記第1の面の反対側の第2の面とを含む基板と、
前記基板の前記第1の面の側上に配置されたイメージセンシング領域及び接触パッドと、
前記第2の面の側上に配置された、且つ前記第1の面に向けて延在する開口部であって、前記接触パッドのそれぞれは前記開口部のうちの1つに対応し前記開口部を通して露出される、開口部と、
前記基板の側壁を覆う第1の感光性インクと、
前記開口部を覆う、且つ中空のキャビティを前記開口部のそれぞれの中に形成する第2の感光性インクと、
を含む。
前記基板の前記第1の面と位置合わせされ積層された保護基板と、
前記保護基板と前記基板との間に配置された、且つ前記イメージセンシング領域を囲む支持ユニットと、
をさらに含んでもよく、ここで、
前記第1の感光性インクは前記支持ユニットの側壁の一部を覆う。
前記開口部のそれぞれの側壁上に配置された絶縁層と、
前記絶縁層上の、及び前記開口部の底における再配線層であって、前記再配線層は前記接触パッドに電気的に接続された、再配線層と、
をさらに含んでもよく、ここで、
前記第2の感光性インクは前記再配線層を覆い且つ貫通孔を備え、前記貫通孔を通して前記再配線層が露出され、
ソルダーボールが前記貫通孔のそれぞれの中に配置され且つ前記再配線層に電気的に接続される。
Claims (14)
- 第1の面と、前記第1の面の反対側の第2の面とを含むウエハであって、前記ウエハはグリッド状に配置された複数のイメージセンシングチップを有し、前記イメージセンシングチップのそれぞれはイメージセンシング領域及び接触パッドを有し、前記イメージセンシング領域及び前記接触パッドは前記第1の面の側上に配置されているウエハを提供することと、
前記接触パッドのそれぞれに対応する開口部であって前記接触パッドが前記開口部を通して露出される開口部、及び切断溝を、前記ウエハの前記第2の面の側上に形成することと、
前記切断溝を第1の感光性インクで充填することと、
第2の感光性インクを前記ウエハの前記第2の面上に塗布して、前記開口部を前記第2の感光性インクで覆い、中空のキャビティを前記開口部内に形成することと、
を含む、イメージセンシングチップパッケージ化方法。 - 前記切断溝を第1の感光性インクで充填することは、
前記第1の感光性インクを前記ウエハの前記第2の面上に塗布して、前記切断溝を前記第1の感光性インクで充填することと、
前記切断溝のエリア外の前記第1の感光性インクを、露光及び現像プロセスによって除去することと、
を含む、請求項1に記載のイメージセンシングチップパッケージ化方法。 - 前記切断溝はスピンコーティングプロセスによって前記第1の感光性インクで充填され、
前記第2の面はスピンコーティングによって前記第2の感光性インクを用いてコーティングされ、
前記第1の感光性インクについてのスピンコーティング速度は、前記第2の感光性インクについてのスピンコーティング速度より小さい、
請求項1に記載のイメージセンシングチップパッケージ化方法。 - 前記第1の感光性インクの粘度は、前記第2の感光性インクの粘度より小さい、請求項1に記載のイメージセンシングチップパッケージ化方法。
- 前記第1の感光性インクの前記粘度は8Kcps(8Pa・s)より小さく、前記第2の感光性インクの前記粘度は12Kcps(12Pa・s)より大きい、請求項4に記載のイメージセンシングチップパッケージ化方法。
- 前記切断溝及び前記開口部を前記ウエハの前記第2の面上に形成することの前に、前記イメージセンシングチップパッケージ化方法は、
保護基板であって、前記保護基板はグリッド状に配置された支持ユニットを有し、前記支持ユニットのそれぞれは前記イメージセンシングチップのうちの1つに対応する保護基板を提供することと、
前記支持ユニットが前記ウエハと前記保護基板との間にあるように前記ウエハの前記第1の面を前記保護基板と位置合わせし積層することと、
前記ウエハを前記第2の面上で研削し薄くすることと、
をさらに含む、請求項1に記載のイメージセンシングチップパッケージ化方法。 - 前記切断溝及び前記開口部を前記ウエハの前記第2の面上に形成することは、
プレ切断溝及び前記開口部を、前記ウエハの前記第2の面上に、同じエッチングプロセスにおいて形成することと、
前記プレ切断溝に沿って、カッターを用いて、前記ウエハの前記第1の面を通して切断して、前記切断溝を形成することと、
を含む、請求項1〜請求項6のいずれか一項に記載のイメージセンシングチップパッケージ化方法。 - 前記第2の感光性インクを塗布することの前に、前記イメージセンシングチップパッケージ化方法は、
絶縁層を前記開口部の側壁上に形成することと、
前記接触パッドに電気的に接続される再配線層を前記絶縁層上に、及び前記開口部の底において形成することと、
前記第2の感光性インクを前記ウエハの前記第2の面上に、スクリーン印刷プロセスによって塗布して、複数の貫通孔を前記再配線層が前記貫通孔を通して露出されるように前記第2の感光性インク上に形成することと、
前記再配線層に電気的に接続されるソルダーボールを前記貫通孔のそれぞれの中に形成することと、
をさらに含む、請求項1に記載のイメージセンシングチップパッケージ化方法。 - 前記第2の感光性インクを塗布することの前に、前記イメージセンシングチップパッケージ化方法は、
絶縁層を前記開口部の側壁上に形成することと、
前記接触パッドに電気的に接続される再配線層を前記絶縁層上に、及び前記開口部の底において形成することと、
前記第2の感光性インクを前記ウエハの第2の面全体の上に、スピンコーティングプロセスによって塗布することと、
複数の貫通孔であって前記再配線層は前記貫通孔を通して露出される貫通孔を前記第2の感光性インク上に、露光及び現像プロセスによって形成することと、
前記再配線層に電気的に接続されるソルダーボールを前記貫通孔のそれぞれの中に形成することと、
をさらに含む、請求項1に記載のイメージセンシングチップパッケージ化方法。 - 第1の面と、前記第1の面の反対側の第2の面とを含む基板と、
前記基板の前記第1の面上に配置されたイメージセンシング領域及び接触パッドと、
前記第2の面上に配置された、且つ前記第1の面に向けて延在する開口部であって、前記接触パッドのそれぞれは前記開口部のうちの1つに対応し前記開口部を通して露出される、開口部と、
前記基板の側壁を覆う第1の感光性インクと、
前記開口部を覆う、且つ中空のキャビティを前記開口部のそれぞれの中に形成する第2の感光性インクと、
を含む、イメージセンシングチップパッケージ。 - 前記基板の前記第1の面と位置合わせされ積層された保護基板と、
前記保護基板と前記基板との間に配置された、且つ前記イメージセンシング領域を囲む支持ユニットと、
をさらに含み、
前記第1の感光性インクは前記支持ユニットの側壁の一部を覆う、
請求項10に記載のイメージセンシングチップパッケージ。 - 前記第1の感光性インクの粘度は、前記第2の感光性インクの粘度より小さい、請求項10に記載のイメージセンシングチップパッケージ。
- 前記第1の感光性インクの前記粘度は8Kcps(8Pa・s)より小さく、前記第2の感光性インクの前記粘度は12Kcps(12Pa・s)より大きい、請求項12に記載のイメージセンシングチップパッケージ。
- 前記開口部のそれぞれの側壁上に配置された絶縁層と、
前記絶縁層上の、及び前記開口部の底における再配線層であって、前記再配線層は前記接触パッドに電気的に接続された、再配線層と、
をさらに含み、
前記第2の感光性インクは前記再配線層を覆い且つ貫通孔を備え、前記貫通孔を通して前記再配線層が露出され、
ソルダーボールが前記貫通孔のそれぞれの中に配置され且つ前記再配線層に電気的に接続される、
請求項10に記載のイメージセンシングチップパッケージ。
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