JP6078581B2 - 一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法 - Google Patents
一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法 Download PDFInfo
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- JP6078581B2 JP6078581B2 JP2015093142A JP2015093142A JP6078581B2 JP 6078581 B2 JP6078581 B2 JP 6078581B2 JP 2015093142 A JP2015093142 A JP 2015093142A JP 2015093142 A JP2015093142 A JP 2015093142A JP 6078581 B2 JP6078581 B2 JP 6078581B2
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Description
(フィルム1)
図1および図2に示すように、フィルム1は、セパレータ13およびセパレータ13上に配置された裏面保護フィルム11を含む。より具体的には、フィルム1は、セパレータ13およびセパレータ13上に配置された一体型フィルム71a、71b、71c、……、71m(以下、「一体型フィルム71」と総称する。)を含む。一体型フィルム71aと一体型フィルム71bのあいだの距離、一体型フィルム71bと一体型フィルム71cのあいだの距離、……一体型フィルム71lと一体型フィルム71mのあいだの距離は一定である。フィルム1はロール状をなすことができる。
一体型フィルム71は、ダイシングテープ12およびダイシングテープ12上に配置された裏面保護フィルム11を含む。ダイシングテープ12は、基材121および基材121上に配置された粘着剤層122を含む。粘着剤層122は、裏面保護フィルム11と接する接触部122Aを含む。粘着剤層122は、接触部122Aの周辺に配置された周辺部122Bをさらに含む。接触部122Aは放射線により硬化されている。一方、周辺部122Bは放射線により硬化する性質を有する。放射線としては紫外線が好ましい。
裏面保護フィルム11における波長555nmの全光線透過率は3%以上、好ましくは5%以上、より好ましくは7%以上である。3%以上であることにより、裏面保護フィルム11と半導体ウエハを貼り合わせた後に半導体ウエハのノッチを検出できる。裏面保護フィルム11における波長555nmの全光線透過率の上限は、たとえば50%、30%、20%である。
ダイシングテープ12における波長555nmの全光線透過率は、好ましくは3%以上、より好ましくは10%以上、さらに好ましくは20%以上である。10%以上であることにより、一体型フィルム71と半導体ウエハを貼り合わせた後に半導体ウエハのノッチを検出できる。一方、ダイシングテープ12における波長555nmの全光線透過率の上限は、たとえば95%、90%である。
セパレータ13としては、ポリエチレンテレフタレート(PET)フィルムなどが挙げられる。セパレータ13は、好ましくは離型処理が施されたものである。セパレータ13の厚みは適宜設定できる。
図3に示すように、一体型フィルム71と半導体ウエハ4を貼り合わせる。具体的には、セパレータ13を剥離し、一体型フィルム71と半導体ウエハ4を貼り合わせる。これにより、半導体ウエハ4の裏面上に裏面保護フィルム11が設けられる。貼り合わせ方法は特に限定されないが、圧着が好ましい。圧着は、通常、圧着ロールなどの押圧手段により押圧しながら行われる。
図7に示すように、ダイシングテープ12における粘着面の全体が、裏面保護フィルム11と接する。粘着剤層122は、放射線により硬化する性質を有することが好ましい。
粘着剤層122の接触部122Aは放射線により硬化する性質を有する。粘着剤層122の周辺部122Bも放射線により硬化する性質を有する。
粘着剤層122の接触部122Aは放射線により硬化されている。粘着剤層122の周辺部122Bも放射線により硬化されている。
裏面保護フィルム11は、第1層および第1層上配置された第2層を含む複層形状をなす。
変形例1〜変形例4などは、任意に組み合わせることができる。
裏面保護フィルムを作製するために使用した成分について説明する。
エポキシ樹脂:DIC社製「HP−4700」
フェノール樹脂:明和化成社製「MEH−7851H」
アクリルゴム:ナガセケムテックス社製「テイサンレジンSG−P3」
シリカフィラー:アドマテックス社製「SE−2050−MCV」(平均一次粒径0.5μm)
着色剤1:オリエント化学工業社製「NUBIAN BLACK TN877」
着色剤2:オリエント化学工業社製「SOM−L−0543」
着色剤3:オリエント化学工業社製「ORIPACS B−35」
裏面保護フィルムについて、以下の評価を行った。結果を表1に示す。
裏面保護フィルムについて下記の条件にて波長555nmの全光線透過率(%)を測定した。
<光線透過率測定条件>
測定装置: 紫外可視近赤外分光光度計V−670DS(日本分光株式会社製)
速度: 2000nm/min
測定範囲: 400〜1600nm
積分球: ISN−723
スポット径: 1cm角
裏面保護フィルムと8inchミラーウエハを70℃で貼り合わせ、デジタルマイクロスコープ光量25%にてノッチが検出できた場合を○、できなかった場合を×と判定した。
裏面保護フィルムから約0.1gをサンプリングして精秤し(試料の重量)、サンプルをメッシュ状シートで包んだ後、約50mlのエタノール中に室温で1週間浸漬させた。その後、溶剤不溶分(メッシュ状シートの内容物)をエタノールから取り出し、130℃で約2時間乾燥させ、乾燥後の溶剤不溶分を秤量し(浸漬・乾燥後の重量)、下記式(a)よりゲル分率(%)を算出した。
ゲル分率(%)=[(浸漬・乾燥後の重量)/(試料の重量)]×100 (a)
レオメトリック社製の動的粘弾性測定装置「Solid Analyzer RS A2」を用いて、引張モードにて、サンプル幅:10mm、サンプル長さ:22.5mm、サンプル厚み:0.2mmで、周波数:1Hz、昇温速度:10℃/分、窒素雰囲気下、所定の温度(23℃)にて、引張貯蔵弾性率を測定した。
(実施例4)
実施例1で得られた裏面保護フィルムと日東電工社製「V−8AR」(ダイシングテープ)を貼り合わせ、一体型フィルムを得た。
(実施例5)
実施例2で得られた裏面保護フィルムと「V−8AR」を貼り合わせ、一体型フィルムを得た。
(実施例6)
実施例3で得られた裏面保護フィルムと「V−8AR」を貼り合わせ、一体型フィルムを得た。
(比較例2)
比較例1で得られた裏面保護フィルムと「V−8AR」を貼り合わせ、一体型フィルムを得た。
一体型フィルムについて、以下の評価を行った。結果を表2に示す。
一体型フィルムについて下記の条件にて波長555nmの全光線透過率(%)を測定した。
<光線透過率測定条件>
測定装置: 紫外可視近赤外分光光度計V−670DS(日本分光株式会社製)
速度: 2000nm/min
測定範囲: 400〜1600nm
積分球: ISN−723
スポット径: 1cm角
一体型フィルムと8inchミラーウエハを70℃で貼り合わせ、デジタルマイクロスコープ光量25%にてノッチが検出できた場合を○、できなかった場合を×と判定した。
11 裏面保護フィルム
12 ダイシングテープ
13 セパレータ
71 一体型フィルム
121 基材
122 粘着剤層
122A 接触部
122B 周辺部
44 ノッチ
5 保護チップ
6 被着体
8 吸着台
41 半導体素子
51 バンプ
61 導電材
Claims (8)
- 基材および前記基材上に配置された粘着剤層を含むダイシングテープと、
前記粘着剤層上に配置された、半導体素子の裏面を保護するための裏面保護フィルムと
を含み、
前記粘着剤層は、前記裏面保護フィルムと接する接触部を含み、前記接触部は、放射線により硬化する性質を有し、
前記裏面保護フィルムにおける波長555nmの全光線透過率が3%以上10%以下である、一体型フィルム。 - セパレータと、
前記セパレータ上に配置された請求項1に記載の一体型フィルムとを含むフィルム。 - 請求項1に記載の一体型フィルムと半導体ウエハを貼り合わせる工程を含む半導体装置の製造方法。
- 半導体素子および前記半導体素子の裏面上に配置された保護膜を含む保護チップの製造
方法であって、
請求項1に記載の一体型フィルムと半導体ウエハを貼り合わせる工程を含む保護チップの製造方法。 - 基材および前記基材上に配置された粘着剤層を含むダイシングテープと、
前記粘着剤層上に配置された、半導体素子の裏面を保護するための裏面保護フィルムと
を含み、
前記粘着剤層は、前記裏面保護フィルムと接する接触部を含み、前記接触部は、放射線により硬化する性質を有し、
波長555nmの全光線透過率が3%以上10%以下である一体型フィルム。 - セパレータと、
前記セパレータ上に配置された請求項5に記載の一体型フィルムとを含むフィルム。 - 請求項5に記載の一体型フィルムと半導体ウエハを貼り合わせる工程を含む半導体装置の製造方法。
- 半導体素子および前記半導体素子の裏面上に配置された保護膜を含む保護チップの製造
方法であって、
請求項5に記載の一体型フィルムと半導体ウエハを貼り合わせる工程を含む保護チップの製造方法。
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JP2015093142A JP6078581B2 (ja) | 2015-04-30 | 2015-04-30 | 一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法 |
US15/140,582 US20160322272A1 (en) | 2015-04-30 | 2016-04-28 | Integrated film, film, method for producing semiconductor device, and method for producing chip |
KR1020160052162A KR20160129757A (ko) | 2015-04-30 | 2016-04-28 | 일체형 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법 |
CN201610273600.4A CN106084598A (zh) | 2015-04-30 | 2016-04-28 | 一体型薄膜、薄膜、半导体装置的制造方法和保护芯片的制造方法 |
TW105113559A TW201700676A (zh) | 2015-04-30 | 2016-04-29 | 一體型薄膜、薄膜、半導體裝置之製造方法及保護晶片之製造方法 |
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JP4762959B2 (ja) | 2007-09-03 | 2011-08-31 | リンテック株式会社 | 半導体チップおよび半導体装置 |
JP5456440B2 (ja) * | 2009-01-30 | 2014-03-26 | 日東電工株式会社 | ダイシングテープ一体型ウエハ裏面保護フィルム |
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JP5501938B2 (ja) * | 2009-12-24 | 2014-05-28 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム |
JP4991024B1 (ja) * | 2010-12-06 | 2012-08-01 | 株式会社きもと | レーザーダイシング用補助シート |
JP5820170B2 (ja) * | 2011-07-13 | 2015-11-24 | 日東電工株式会社 | 半導体装置用の接着フィルム、フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム |
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