JP6041565B2 - 検査治具 - Google Patents
検査治具 Download PDFInfo
- Publication number
- JP6041565B2 JP6041565B2 JP2012165790A JP2012165790A JP6041565B2 JP 6041565 B2 JP6041565 B2 JP 6041565B2 JP 2012165790 A JP2012165790 A JP 2012165790A JP 2012165790 A JP2012165790 A JP 2012165790A JP 6041565 B2 JP6041565 B2 JP 6041565B2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- contact
- end side
- inspection jig
- insulating support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012165790A JP6041565B2 (ja) | 2012-07-26 | 2012-07-26 | 検査治具 |
PCT/JP2013/069665 WO2014017402A1 (ja) | 2012-07-26 | 2013-07-19 | 検査治具及びその製造方法 |
TW102126397A TWI596345B (zh) | 2012-07-26 | 2013-07-24 | Inspection fixture and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012165790A JP6041565B2 (ja) | 2012-07-26 | 2012-07-26 | 検査治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014025789A JP2014025789A (ja) | 2014-02-06 |
JP6041565B2 true JP6041565B2 (ja) | 2016-12-07 |
Family
ID=49997215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012165790A Active JP6041565B2 (ja) | 2012-07-26 | 2012-07-26 | 検査治具 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6041565B2 (zh) |
TW (1) | TWI596345B (zh) |
WO (1) | WO2014017402A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6637742B2 (ja) * | 2015-11-25 | 2020-01-29 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
US10877085B2 (en) * | 2016-06-09 | 2020-12-29 | Nidec Read Corporation | Inspection jig and inspection device |
JP6717687B2 (ja) | 2016-06-28 | 2020-07-01 | 株式会社エンプラス | コンタクトピンおよび電気部品用ソケット |
KR101843472B1 (ko) * | 2016-09-01 | 2018-03-29 | 주식회사 파인디앤씨 | 반도체용 미세 프로브핀 |
KR101910063B1 (ko) | 2017-05-18 | 2018-10-19 | 최귀환 | 검사장치용 프로브 |
JP7098886B2 (ja) | 2017-07-04 | 2022-07-12 | 日本電産リード株式会社 | 接触端子、検査治具、及び検査装置 |
KR101969771B1 (ko) * | 2017-07-25 | 2019-04-18 | 리노공업주식회사 | 검사프로브 |
JP7220524B2 (ja) * | 2018-06-08 | 2023-02-10 | 株式会社エンプラス | Icソケット |
JP2020012685A (ja) * | 2018-07-13 | 2020-01-23 | 日本電産リード株式会社 | プローブ、検査治具、及び検査装置 |
CN215866830U (zh) * | 2018-11-13 | 2022-02-18 | 株式会社村田制作所 | 探针 |
US20220200178A1 (en) * | 2020-12-22 | 2022-06-23 | Intel Corporation | Coaxial transmission line sli socket designs for 224gbs and beyond |
JP2022138224A (ja) * | 2021-03-10 | 2022-09-26 | 株式会社村田製作所 | 検査用コネクタ |
TWI839053B (zh) * | 2022-12-29 | 2024-04-11 | 韓商奧金斯電子有限公司 | 伸縮探針 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5131766B2 (ja) * | 2008-08-07 | 2013-01-30 | 株式会社ヨコオ | 誤挿入防止型ケルビン検査用治具 |
JP2010127852A (ja) * | 2008-11-28 | 2010-06-10 | Yamaichi Electronics Co Ltd | プローブピン、および、それを備えるテストヘッド |
JP2012112709A (ja) * | 2010-11-22 | 2012-06-14 | Unitechno Inc | ケルビンコンタクトプローブおよびそれを備えたケルビン検査治具 |
JP5597108B2 (ja) * | 2010-11-29 | 2014-10-01 | 株式会社精研 | 接触検査用治具 |
-
2012
- 2012-07-26 JP JP2012165790A patent/JP6041565B2/ja active Active
-
2013
- 2013-07-19 WO PCT/JP2013/069665 patent/WO2014017402A1/ja active Application Filing
- 2013-07-24 TW TW102126397A patent/TWI596345B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI596345B (zh) | 2017-08-21 |
WO2014017402A1 (ja) | 2014-01-30 |
TW201411141A (zh) | 2014-03-16 |
JP2014025789A (ja) | 2014-02-06 |
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