JP5531524B2 - 無線通信装置 - Google Patents
無線通信装置 Download PDFInfo
- Publication number
- JP5531524B2 JP5531524B2 JP2009212809A JP2009212809A JP5531524B2 JP 5531524 B2 JP5531524 B2 JP 5531524B2 JP 2009212809 A JP2009212809 A JP 2009212809A JP 2009212809 A JP2009212809 A JP 2009212809A JP 5531524 B2 JP5531524 B2 JP 5531524B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wireless communication
- substrate
- shield
- wireless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
20 メイン基板
23 ICチップ
25 コネクタ部
26 冷却ファン
27 サーマルインターフェース材
30 WiFi基板(無線基板)
40 シールド兼用放熱板金
401 下プレート
402 上プレート
403 連結プレート
Claims (3)
- メイン基板と、
前記メイン基板上に搭載されるICチップと、
前記ICチップの上方に配置され、無線通信の信号処理を行う電子回路を形成する無線基板と、
連結プレートと前記連結プレートから延在する上プレート及び下プレートとを有するシールド兼用放熱板金と、
を備え、
前記下プレートが前記ICチップと前記無線基板との間に配置され、
前記無線基板が前記下プレートと前記上プレートとの間に配置されることを特徴とする無線通信装置。 - 前記メイン基板上には、前記メイン基板と前記無線基板とを電気的に接続するコネクタ部が設けられ、
前記連結プレートが前記コネクタ部に対向するように配置されていることを特徴とする請求項1に記載の無線通信装置。 - 前記ICチップと前記シールド兼用放熱板金との間には、サーマルインターフェース材が介在していることを特徴とする請求項1又は請求項2に記載の無線通信装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009212809A JP5531524B2 (ja) | 2009-09-15 | 2009-09-15 | 無線通信装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009212809A JP5531524B2 (ja) | 2009-09-15 | 2009-09-15 | 無線通信装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011066039A JP2011066039A (ja) | 2011-03-31 |
JP5531524B2 true JP5531524B2 (ja) | 2014-06-25 |
Family
ID=43952033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009212809A Expired - Fee Related JP5531524B2 (ja) | 2009-09-15 | 2009-09-15 | 無線通信装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5531524B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5966623B2 (ja) | 2012-05-29 | 2016-08-10 | ブラザー工業株式会社 | 画像形成装置 |
JP6551299B2 (ja) * | 2016-05-18 | 2019-07-31 | 京セラドキュメントソリューションズ株式会社 | 画像形成装置 |
FR3055767B1 (fr) * | 2016-09-08 | 2018-09-21 | Sagemcom Broadband Sas | Capot monobloc pour dispositif electronique |
JP2020120376A (ja) * | 2019-01-25 | 2020-08-06 | 株式会社デンソー | 無線通信装置 |
CN116319177B (zh) * | 2023-05-12 | 2023-07-18 | 合肥岭雁科技有限公司 | 易于布线的家庭网关 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6343112B1 (en) * | 2000-12-14 | 2002-01-29 | Ge Medical Systems Global Technology Company, Llc | Method and apparatus for reducing photoconductive effects in dual energy applications of solid state digital X-ray detectors |
JP3096261U (ja) * | 2003-03-04 | 2003-09-12 | アボコム システムズ インコーポレイテッド | 無線伝送装置用プリント配線板の構造 |
-
2009
- 2009-09-15 JP JP2009212809A patent/JP5531524B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011066039A (ja) | 2011-03-31 |
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