JP5456989B2 - 電子部品の製造方法 - Google Patents
電子部品の製造方法 Download PDFInfo
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- JP5456989B2 JP5456989B2 JP2008144812A JP2008144812A JP5456989B2 JP 5456989 B2 JP5456989 B2 JP 5456989B2 JP 2008144812 A JP2008144812 A JP 2008144812A JP 2008144812 A JP2008144812 A JP 2008144812A JP 5456989 B2 JP5456989 B2 JP 5456989B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 claims description 107
- 239000000919 ceramic Substances 0.000 claims description 99
- 239000004020 conductor Substances 0.000 claims description 80
- 230000001681 protective effect Effects 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000010304 firing Methods 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 45
- 238000000034 method Methods 0.000 description 22
- 238000007747 plating Methods 0.000 description 14
- 239000003990 capacitor Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 238000013508 migration Methods 0.000 description 5
- 230000005012 migration Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000992 sputter etching Methods 0.000 description 4
- 238000010897 surface acoustic wave method Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- -1 alumina (Al 2 O 3 ) Chemical class 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920002577 polybenzoxazole Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/19041—Component type being a capacitor
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- H01L2924/19042—Component type being an inductor
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- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- Y10T428/00—Stock material or miscellaneous articles
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- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
12 部品形成区画
19 キャビティー
22 内部配線
24 導体パターン
26 保護膜
30 グリーンシート
40 セラミック基板
50 キャパシタ
60 インダクタ
90 接続端子
Claims (7)
- 積層されたグリーンシートの第1の主面に、内部配線と電気的に接続された導体パターンを印刷する工程と、
前記導体パターンに対応する領域に開口部が形成された開口グリーンシートを前記第1の主面に重ねる工程と、
前記開口グリーンシートが重ねられた積層グリーンシートを積層方向に加圧する工程と、
前記積層グリーンシートと前記導体パターンとを一括して焼成することにより、多層セラミック基板を形成する工程と、
前記多層セラミック基板における前記第1の主面の反対側の第2の主面に、前記内部配線と電気的に接続された電子素子を設ける工程と、を有し、
前記積層グリーンシートと前記導体パターンとを一括して焼成する工程は、前記積層グリーンシートを加圧する工程において前記導体パターンの表面が前記開口グリーンシートの表面と同一平面または前記開口部の内側に窪んだ形状となるようにすることで、焼成後の前記多層セラミック基板及び前記導体パターンの表面が同一平面または表面の凹凸が5μm以下となるように焼成を行うことを特徴とする電子部品の製造方法。 - 前記多層セラミック基板を形成する工程の後に、前記導体パターンの表面に保護膜を形成する工程をさらに有することを特徴とする請求項1に記載の電子部品の製造方法。
- 前記電子素子を設ける工程は、前記多層セラミック基板の前記第2の主面に金属層を形成することにより、前記電子素子を形成する工程を含むことを特徴とする請求項1または2に記載の電子部品の製造方法
- 前記第1の主面における、前記導体パターンが印刷されていない領域にキャビティーを形成する工程と、
前記キャビティーの底面に、前記積層グリーンシートの前記内部配線と電気的に接続された導体パターンを形成する工程と、
をさらに有することを特徴とする請求項1から3のうちいずれか1項に記載の電子部品の製造方法。 - 前記キャビティーの底面に、前記内部配線と電気的に接続された、前記電子素子とは別の電子素子を設ける工程をさらに有することを特徴とする請求項4に記載の電子部品の製造方法。
- 前記導体パターンは、Ag、Cu、またはNiを主成分とする導体からなることを特徴とする請求項1から5のうちいずれか1項に記載の電子部品の製造方法。
- 前記多層セラミック基板を、所定の区画ごとに切断する工程をさらに有することを特徴とする請求項1から6のうちいずれか1項に記載の電子部品の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008144812A JP5456989B2 (ja) | 2008-06-02 | 2008-06-02 | 電子部品の製造方法 |
US12/474,919 US20090297785A1 (en) | 2008-06-02 | 2009-05-29 | Electronic device and method of manufacturing the same |
CN2009101427357A CN101599446B (zh) | 2008-06-02 | 2009-06-02 | 电子部件及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008144812A JP5456989B2 (ja) | 2008-06-02 | 2008-06-02 | 電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2009295624A JP2009295624A (ja) | 2009-12-17 |
JP5456989B2 true JP5456989B2 (ja) | 2014-04-02 |
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ID=41380201
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Application Number | Title | Priority Date | Filing Date |
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JP2008144812A Active JP5456989B2 (ja) | 2008-06-02 | 2008-06-02 | 電子部品の製造方法 |
Country Status (3)
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US (1) | US20090297785A1 (ja) |
JP (1) | JP5456989B2 (ja) |
CN (1) | CN101599446B (ja) |
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DE102011016554B4 (de) * | 2011-04-08 | 2018-11-22 | Snaptrack, Inc. | Waferlevel-Package und Verfahren zur Herstellung |
JP7266996B2 (ja) | 2018-11-20 | 2023-05-01 | 太陽誘電株式会社 | インダクタ、フィルタおよびマルチプレクサ |
KR102257930B1 (ko) * | 2019-08-13 | 2021-05-28 | 삼성전기주식회사 | 칩 안테나 |
US11289835B2 (en) * | 2020-02-27 | 2022-03-29 | Motorola Solutions, Inc. | Printed circuit board (PCB) connector interface module with heat and scratch resistant coverlay and accessory system |
CN113517200B (zh) | 2020-05-27 | 2024-06-07 | 台湾积体电路制造股份有限公司 | 半导体器件及其形成方法 |
DE102021201361A1 (de) | 2021-02-12 | 2022-08-18 | Volkswagen Aktiengesellschaft | Elektrisches Bauteil sowie Verfahren zur Herstellung eines in einer Multilayer-Leiterplatte eingebetteten elektrischen Bauteils |
CN114158206B (zh) * | 2021-11-02 | 2022-06-21 | 深圳市方泰设备技术有限公司 | 一种叠合机 |
CN116456609B (zh) * | 2023-03-29 | 2024-03-26 | 南通威斯派尔半导体技术有限公司 | 预填充陶瓷覆铜陶瓷绝缘体线路板、功率器件及制备方法 |
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JP2783751B2 (ja) * | 1993-12-21 | 1998-08-06 | 富士通株式会社 | 多層セラミック基板の製造方法 |
JPH10200015A (ja) * | 1997-01-10 | 1998-07-31 | Sumitomo Metal Ind Ltd | セラミックス基板とその製造方法 |
JPH10303566A (ja) * | 1997-04-28 | 1998-11-13 | Ngk Spark Plug Co Ltd | コンデンサの製造方法 |
JP2000232178A (ja) * | 1999-02-09 | 2000-08-22 | Sumitomo Metal Mining Co Ltd | セラミックキャリアとその製造方法 |
TWI345938B (en) * | 2003-10-17 | 2011-07-21 | Hitachi Metals Ltd | Multi-layered ceramic substrate and its production method, and electronic device comprising same |
JP2006032442A (ja) * | 2004-07-13 | 2006-02-02 | Murata Mfg Co Ltd | 多層基板及びその製造方法 |
JP2007318173A (ja) * | 2004-11-04 | 2007-12-06 | Hitachi Metals Ltd | 多層セラミック基板および多層セラミック基板の製造方法 |
JP2006173389A (ja) * | 2004-12-16 | 2006-06-29 | Murata Mfg Co Ltd | 表面実装部品を搭載した回路基板の製造方法 |
TWI311451B (en) * | 2005-11-30 | 2009-06-21 | Murata Manufacturing Co | Ceramic substrate, electronic device, and manufacturing method of ceramic substrate |
JP4507012B2 (ja) * | 2006-01-23 | 2010-07-21 | 日立金属株式会社 | 多層セラミック基板 |
JP2007201165A (ja) * | 2006-01-26 | 2007-08-09 | Ngk Spark Plug Co Ltd | 配線基板 |
JP5066830B2 (ja) * | 2006-04-10 | 2012-11-07 | 株式会社村田製作所 | セラミック多層基板 |
KR100762006B1 (ko) * | 2006-06-13 | 2007-09-28 | 삼성전기주식회사 | 무수축 세라믹 기판의 제조방법 |
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US20090297785A1 (en) | 2009-12-03 |
CN101599446B (zh) | 2011-07-27 |
JP2009295624A (ja) | 2009-12-17 |
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