JP5362624B2 - パワー半導体モジュール - Google Patents
パワー半導体モジュール Download PDFInfo
- Publication number
- JP5362624B2 JP5362624B2 JP2010051831A JP2010051831A JP5362624B2 JP 5362624 B2 JP5362624 B2 JP 5362624B2 JP 2010051831 A JP2010051831 A JP 2010051831A JP 2010051831 A JP2010051831 A JP 2010051831A JP 5362624 B2 JP5362624 B2 JP 5362624B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- power semiconductor
- semiconductor module
- case
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 227
- 239000000463 material Substances 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 112
- 230000005855 radiation Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 35
- 229910052802 copper Inorganic materials 0.000 description 35
- 239000010949 copper Substances 0.000 description 35
- 239000000853 adhesive Substances 0.000 description 26
- 230000001070 adhesive effect Effects 0.000 description 26
- 239000004020 conductor Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000000945 filler Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
図3(A)は、パワー半導体モジュールのケースの外観図である。図3(B)は、ケースの正面透過図である。図3(C)は、基板の断面図である。図3(D)は、サイズが異なる基板の断面図である。図4(A)は、薄いセラミックス基板に変更したパワー半導体モジュールの正面透過図である。図4(B)は、厚いセラミックス基板に変更したパワー半導体モジュールの正面透過図である。第1実施形態及び第2実施形態では、セラミックス基板の絶縁板の厚みを変更する例を述べるが、銅板の厚みを変えることにより、セラミックス基板の厚みを変更することもできる。また、以下の説明では、基板のサイズとは、基板の長さ、幅、及び厚さのことであり、基板の大きさとは、基板の長さと幅のことである。
図5(A)は、ケースの正面透過図である。図5(B)は、基板取り付け面の階段状の部分の拡大図である。図5(C)、図6(A)、図6(B)、図6(C)は、それぞれ厚みが異なるセラミックス基板を取り付けたケースの拡大図である。
図7(A)は、基板取り付け面の階段状の部分の拡大図である。図7(B)、図7(C)、図7(D)、図7(E)は、それぞれ厚みが異なるセラミックス基板を取り付けたケースの拡大図である。
2,12,22,102…ケース
2B,12B,22B,102B…底面
3,13…凹部
4A,4B,14A,14B,14C,14D,24A,24B…基板取り付け面
5A,5B,15A,15B,15C,15D,25,25A,25B,25C,105,105A,105B…セラミックス基板
6A,6B,16A,16B,16C,16D,106…絶縁板
7A,7B,17A,17B,17C,17D,27,27A,27B,27C,107,107A…銅板
8A,8B,108…導体配線
10A,20A,30,110…接着剤
20,120…ヒートシンク
31B,31C…厚み調整材
Claims (3)
- 底面に凹部が設けられた筐体と、
電子部品が実装される実装面と電子部品が実装されない非実装面とを備え、前記非実装面を前記底面側に向けて、前記凹部に取り付けられた基板と、
を備えたパワー半導体モジュールにおいて、
前記凹部は、その周縁に沿って階段状に形成された複数の基板取り付け面を備え、
前記基板は、前記複数の基板取り付け面のいずれかに取り付けたときに、前記非実装面と前記筐体の底面とが同じ高さになるように、前記基板取り付け面に応じたサイズで作成されたパワー半導体モジュール。 - 前記基板は、N種類(Nは2以上の整数)の厚みのいずれかで作成され、
前記凹部は、その周縁に沿って、前記N種類の厚みの基板に対応する深さのN個の基板取り付け面が形成された請求項1に記載のパワー半導体モジュール。 - 前記基板と前記基板取り付け面の間に、厚み調整材が取り付けられた請求項1または2に記載のパワー半導体モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010051831A JP5362624B2 (ja) | 2010-03-09 | 2010-03-09 | パワー半導体モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010051831A JP5362624B2 (ja) | 2010-03-09 | 2010-03-09 | パワー半導体モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011187711A JP2011187711A (ja) | 2011-09-22 |
JP5362624B2 true JP5362624B2 (ja) | 2013-12-11 |
Family
ID=44793641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010051831A Expired - Fee Related JP5362624B2 (ja) | 2010-03-09 | 2010-03-09 | パワー半導体モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5362624B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5986488B2 (ja) * | 2012-11-21 | 2016-09-06 | 日本インター株式会社 | パワー半導体モジュールおよびその製造方法 |
JP2015035906A (ja) * | 2013-08-09 | 2015-02-19 | 古河電気工業株式会社 | 電気接続箱 |
JP6673803B2 (ja) * | 2016-10-31 | 2020-03-25 | ルネサスエレクトロニクス株式会社 | 電子装置 |
DE112017003669B4 (de) * | 2017-02-13 | 2022-08-25 | Fuji Electric Co., Ltd. | Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung |
CN107978530B (zh) * | 2017-11-28 | 2024-03-26 | 西安中车永电电气有限公司 | 一种减少ipm模块注塑溢料的方法和dbc基板 |
JP7016245B2 (ja) * | 2017-11-29 | 2022-02-04 | 三菱電機株式会社 | 基板固定構造、照明装置及び基板固定方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2705369B2 (ja) * | 1991-05-31 | 1998-01-28 | 株式会社デンソー | 電子装置 |
JP3758383B2 (ja) * | 1998-10-23 | 2006-03-22 | 富士電機デバイステクノロジー株式会社 | パワー半導体装置およびその組立方法 |
JP2009081325A (ja) * | 2007-09-27 | 2009-04-16 | Sanyo Electric Co Ltd | 回路装置 |
-
2010
- 2010-03-09 JP JP2010051831A patent/JP5362624B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2011187711A (ja) | 2011-09-22 |
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