JP5148810B2 - 受光モジュール及びそれを備えた電気機器 - Google Patents
受光モジュール及びそれを備えた電気機器 Download PDFInfo
- Publication number
- JP5148810B2 JP5148810B2 JP2004174917A JP2004174917A JP5148810B2 JP 5148810 B2 JP5148810 B2 JP 5148810B2 JP 2004174917 A JP2004174917 A JP 2004174917A JP 2004174917 A JP2004174917 A JP 2004174917A JP 5148810 B2 JP5148810 B2 JP 5148810B2
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving module
- condenser lens
- light
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Light Receiving Elements (AREA)
Description
2a、2b フォトダイオード
3 信号処理LSI
4 ペースト
5 基板
6a、6b ボンディングワイヤ
7 封止部材
7a〜7j 集光レンズ
8a〜8c 電極
Claims (6)
- 第1の集光レンズと、
第2の集光レンズと、
前記第1の集光レンズによって集光された光を受光する第1の受光素子と、
前記第2の集光レンズによって集光された光を受光する、前記第1の受光素子と同一平面上に設けられた第2の受光素子と、
前記第1の受光素子及び前記第2の受光素子と同一平面上で前記第1の受光素子と前記第2の受光素子との間に設けられ、前記第1の受光素子から出力される電流信号及び前記第2の受光素子から出力される電流信号を入力する信号処理LSIとを備え、
前記第1の集光レンズと前記第2の集光レンズと前記信号処理LSIとを封止する封止部材の平坦部を、前記第1の集光レンズと前記第2の集光レンズとの間であって且つ前記信号処理LSIの上方に設け、
前記第1の集光レンズと前記第2の集光レンズとが互いに異なる形状であることを特徴とする受光モジュール。 - 前記第1の集光レンズと前記第2の集光レンズの少なくとも一つが、非半球形状であって半球形状に比べて指向角が狭く特定方向からの光の集光率が高くなる形状である請求項1に記載の受光モジュール。
- 請求項1または請求項2に記載の受光モジュールと、前記受光モジュールの信号処理部から出力される信号に基づいて機器全体を制御する制御部とを備えることを特徴とする電気機器。
- 前記第1の受光素子と前記第2の受光素子は、同一の光信号を受信することを特徴とする請求項1または請求項2に記載の受光モジュール。
- 前記受光モジュールが凹部に設けられていることを特徴とする請求項3に記載の電気機器。
- 前記第1の受光素子と前記第2の受光素子は同一方向を向いて設けられていることを特徴とする請求項1または請求項2に記載の受光モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004174917A JP5148810B2 (ja) | 2004-06-14 | 2004-06-14 | 受光モジュール及びそれを備えた電気機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004174917A JP5148810B2 (ja) | 2004-06-14 | 2004-06-14 | 受光モジュール及びそれを備えた電気機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005353928A JP2005353928A (ja) | 2005-12-22 |
JP5148810B2 true JP5148810B2 (ja) | 2013-02-20 |
Family
ID=35588118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004174917A Expired - Fee Related JP5148810B2 (ja) | 2004-06-14 | 2004-06-14 | 受光モジュール及びそれを備えた電気機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5148810B2 (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6294990A (ja) * | 1985-10-21 | 1987-05-01 | Nec Corp | 受光素子 |
JPH0582810A (ja) * | 1991-09-19 | 1993-04-02 | Fujitsu Ltd | 光電変換装置 |
JPH05206487A (ja) * | 1992-01-24 | 1993-08-13 | Matsushita Electric Ind Co Ltd | 受光部品 |
JP3601076B2 (ja) * | 1994-06-14 | 2004-12-15 | ソニー株式会社 | 受光装置 |
JP2000082829A (ja) * | 1998-09-04 | 2000-03-21 | Dowa Mining Co Ltd | 受光方法及び受光装置並びに受発光装置 |
JP2000115081A (ja) * | 1998-10-09 | 2000-04-21 | Victor Co Of Japan Ltd | 光通信装置 |
JP3144634B2 (ja) * | 1998-10-09 | 2001-03-12 | 日本電気株式会社 | 赤外線通信用発光受光デバイス及びその製造方法 |
JP3397757B2 (ja) * | 1999-06-30 | 2003-04-21 | キヤノン株式会社 | 撮像装置 |
JP2001177118A (ja) * | 1999-12-17 | 2001-06-29 | Sharp Corp | 赤外線データ通信モジュール |
JP3885552B2 (ja) * | 2000-10-27 | 2007-02-21 | 富士電機デバイステクノロジー株式会社 | 測距装置 |
JP2002198572A (ja) * | 2000-12-27 | 2002-07-12 | Rohm Co Ltd | 赤外線データ通信モジュール、およびその製造方法 |
JP2004335942A (ja) * | 2003-05-12 | 2004-11-25 | Matsushita Electric Ind Co Ltd | 光半導体装置 |
-
2004
- 2004-06-14 JP JP2004174917A patent/JP5148810B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005353928A (ja) | 2005-12-22 |
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