JP5001619B2 - 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド - Google Patents
窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド Download PDFInfo
- Publication number
- JP5001619B2 JP5001619B2 JP2006277897A JP2006277897A JP5001619B2 JP 5001619 B2 JP5001619 B2 JP 5001619B2 JP 2006277897 A JP2006277897 A JP 2006277897A JP 2006277897 A JP2006277897 A JP 2006277897A JP 5001619 B2 JP5001619 B2 JP 5001619B2
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- JP
- Japan
- Prior art keywords
- polishing
- layer
- transparent sheet
- polishing pad
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S451/00—Abrading
- Y10S451/921—Pad for lens shaping tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
Claims (12)
- ケミカルメカニカルポリシング装置用のポリシングパッドであって、
研磨面および底面を有し、ポリウレタンを含む研磨層と、
前記研磨層に形成され、前記研磨面から前記底面まで前記研磨層を貫通して延びる開口と、
前記開口をシールして前記研磨層の前記底面からの流体漏れを防ぐように前記研磨層の下方に配置され、ポリエチレンテレフタレートを含む透明シートと、
を備え、
前記透明シートは前記研磨層より薄いことを特徴とするポリシングパッド。 - 前記研磨面と前記底面が実質的に平坦で相互に平行であり、前記透明シートが前記研磨面および前記底面に平行な面内にある、請求項1記載のポリシングパッド。
- ケミカルメカニカルポリシング装置用のポリシングパッドであって、
研磨面および底面を有する研磨層と、
前記研磨層に形成され、前記研磨面から前記底面まで前記研磨層を貫通して延びる開口と、
前記開口をシールして前記研磨層の前記底面からの流体漏れを防ぐように前記研磨層の下方に配置され、前記研磨層より薄い透明シートと、
を備え、
前記透明シートの上方において前記開口内に配置され、前記透明シートから前記研磨面に向かって延在する窓を更に備え、前記窓が透明なブロック材料を備えている、ポリシングパッド。 - ケミカルメカニカルポリシング装置用のポリシングパッドであって、
研磨面および底面を有する研磨層と、
前記研磨層に形成され、前記研磨面から前記底面まで前記研磨層を貫通して延びる開口と、
前記開口をシールして前記研磨層の前記底面からの流体漏れを防ぐように前記研磨層の下方に配置された透明シートと、
を備え、
前記透明シートは前記研磨層より薄く、
前記透明シートの厚さは、0.005インチ(0.127mm)以下である、ポリシングパッド。 - 前記透明シートがポリエチレンテレフタラートを含む、請求項4記載のポリシングパッド。
- 前記透明シートの下方に位置されたバッキング層を更に備える、請求項4に記載のポリシングパッド。
- 前記バッキング層内に形成され、前記研磨層内の前記透明窓と位置合わせされた開口を更に備える、請求項6に記載のポリシングパッド。
- 研磨面および底面を有する不透明であってポリウレタンを含む研磨材と、
前記不透明研磨材内に形成され、前記研磨面から前記底面に至る透明窓と、
前記底面の下方に配置され、前記透明窓を覆い、ポリエチレンテレフタレートを含む透明シートと、
を備え、
前記透明シートが前記不透明研磨材よりも薄いことを特徴とするポリシングパッド。 - 前記透明シートの下方に配置されたバッキング層を更に備える請求項8記載のポリシングパッド。
- 前記バッキング層内に形成され、前記研磨層内の前記透明窓と位置合わせされた開口を更に備える請求項9記載のポリシングパッド。
- 研磨面および底面を有する不透明な研磨材と、
前記不透明研磨材内に形成され、前記研磨面から前記底面に至る透明窓と、
前記底面の下方に配置され、前記透明窓を覆う透明シートと、
を備え、
前記透明シートが前記不透明研磨材よりも薄く、
前記透明シートの厚さは、0.005インチ(0.127mm)以下である、ポリシングパッド。 - 前記透明シートがポリエチレンテレフタラートを含む、請求項11記載のポリシングパッド。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15366599P | 1999-09-14 | 1999-09-14 | |
US60/153665 | 1999-09-14 |
Related Parent Applications (1)
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JP2000280082A Division JP3913969B2 (ja) | 1999-09-14 | 2000-09-14 | 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド |
Publications (2)
Publication Number | Publication Date |
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JP2007044872A JP2007044872A (ja) | 2007-02-22 |
JP5001619B2 true JP5001619B2 (ja) | 2012-08-15 |
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JP2000280082A Expired - Lifetime JP3913969B2 (ja) | 1999-09-14 | 2000-09-14 | 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド |
JP2006277897A Expired - Lifetime JP5001619B2 (ja) | 1999-09-14 | 2006-10-11 | 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド |
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JP2000280082A Expired - Lifetime JP3913969B2 (ja) | 1999-09-14 | 2000-09-14 | 窓漏れの少ない透明窓を有するケミカルメカニカルポリシング装置用ポリシングパッド |
Country Status (2)
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US (4) | US6524164B1 (ja) |
JP (2) | JP3913969B2 (ja) |
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-
2000
- 2000-08-29 US US09/651,345 patent/US6524164B1/en not_active Expired - Lifetime
- 2000-09-14 JP JP2000280082A patent/JP3913969B2/ja not_active Expired - Lifetime
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2003
- 2003-01-16 US US10/346,430 patent/US6896585B2/en not_active Expired - Lifetime
- 2003-03-18 US US10/391,095 patent/US7189141B2/en not_active Expired - Lifetime
-
2006
- 2006-03-13 US US11/375,480 patent/US7677959B2/en not_active Expired - Fee Related
- 2006-10-11 JP JP2006277897A patent/JP5001619B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6896585B2 (en) | 2005-05-24 |
JP3913969B2 (ja) | 2007-05-09 |
US7189141B2 (en) | 2007-03-13 |
JP2007044872A (ja) | 2007-02-22 |
US7677959B2 (en) | 2010-03-16 |
US20060154568A1 (en) | 2006-07-13 |
US20030109197A1 (en) | 2003-06-12 |
US6524164B1 (en) | 2003-02-25 |
JP2001291686A (ja) | 2001-10-19 |
US20030171070A1 (en) | 2003-09-11 |
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