JP4693861B2 - 放熱印刷回路基板及びその製造方法 - Google Patents
放熱印刷回路基板及びその製造方法 Download PDFInfo
- Publication number
- JP4693861B2 JP4693861B2 JP2008095412A JP2008095412A JP4693861B2 JP 4693861 B2 JP4693861 B2 JP 4693861B2 JP 2008095412 A JP2008095412 A JP 2008095412A JP 2008095412 A JP2008095412 A JP 2008095412A JP 4693861 B2 JP4693861 B2 JP 4693861B2
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- Prior art keywords
- coating layer
- copper foil
- printed circuit
- circuit board
- carbon nanotubes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
- H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
21 銅張積層板
211 絶縁層
212 銅箔
22 コーティング層
23 メッキ層
24 貫通孔
25 ドライフィルム
26 回路パターン
Claims (4)
- (d)第1銅箔に炭素ナノチューブを主成分とするペーストで第1コーティング層を形成する段階と、
(e)前記第1コーティング層の表面に炭素ナノチューブを主成分とするバンプを形成する段階と、
(f)前記バンプに貫通されるように絶縁層を積層し、前記絶縁層に第2銅箔を積層する段階と、
(g)前記第1銅箔の一部、前記第1コーティング層の一部、及び、前記第2銅箔の一部を除去して回路パターンを形成する段階と、
を含む放熱印刷回路基板の製造方法。 - 前記(d)段階と前記(e)段階との間に、
(d1)前記第1コーティング層を乾燥する段階をさらに含む請求項1に記載の放熱印刷回路基板の製造方法。 - 前記第2銅箔には炭素ナノチューブを主成分とする第2コーティング層が形成されており、
前記(f)段階は、第2コーティング層が前記絶縁層を向くように前記第2銅箔を前記絶縁層に積層し、
前記(g)段階は、前記第2コーティング層を一部除去する段階をさらに行って、前記回路パターンを形成することを特徴とする請求項1または請求項2に記載の放熱印刷回路基板の製造方法。 - 絶縁層に回路パターンが交互に積層された多層の放熱印刷回路基板において、
前記回路パターンが、銅箔パターンと、
前記銅箔パターンの表面に積層された炭素ナノチューブを主成分とするコーティング層と、
ナノチューブを含んでおり、前記絶縁層を貫通して前記絶縁層の両面に隣り合った回路パターンを接続させるバンプと、
を備えることを特徴とする放熱印刷回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0068523 | 2007-07-09 | ||
KR1020070068523A KR100925189B1 (ko) | 2007-07-09 | 2007-07-09 | 방열 인쇄회로기판 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009016795A JP2009016795A (ja) | 2009-01-22 |
JP4693861B2 true JP4693861B2 (ja) | 2011-06-01 |
Family
ID=40253410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008095412A Expired - Fee Related JP4693861B2 (ja) | 2007-07-09 | 2008-04-01 | 放熱印刷回路基板及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090017275A1 (ja) |
JP (1) | JP4693861B2 (ja) |
KR (1) | KR100925189B1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102171770B (zh) * | 2008-08-08 | 2014-07-09 | Pp-梅德有限公司 | 聚合物成型体和电路板装备以及它们的制造方法 |
US9460887B2 (en) * | 2009-05-18 | 2016-10-04 | Hermes Microvision, Inc. | Discharging method for charged particle beam imaging |
KR101094642B1 (ko) | 2010-08-23 | 2011-12-20 | (주)매직테크 | 다층 방열 인쇄회로기판의 제조방법 |
KR101226246B1 (ko) * | 2010-10-01 | 2013-02-01 | 주식회사 휘닉스소재 | 복합재 조성물, 및 이를 포함하는 전자 장치용 도막 및 전자 장치 |
US20140138129A1 (en) * | 2012-11-16 | 2014-05-22 | Qualcomm Incorporated | Substrate having a low coefficient of thermal expansion (cte) copper composite material |
CA2987830C (en) * | 2015-09-14 | 2023-10-17 | Appleton Grp Llc | An arrangement for maintaining desired temperature conditions in an encapsulated transformer |
KR102149794B1 (ko) | 2018-11-26 | 2020-08-31 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR102536636B1 (ko) * | 2021-10-27 | 2023-05-26 | 임홍재 | 세라믹화 산화알루미늄 분말과 탄소나노튜브를 이용한 동박적층판의 제조방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001358264A (ja) * | 2000-04-14 | 2001-12-26 | Suzuki Sogyo Co Ltd | 熱伝導性シート及びその製造方法 |
JP2004303962A (ja) * | 2003-03-31 | 2004-10-28 | Yokohama Rubber Co Ltd:The | 高周波回路基板及びその製造方法 |
JP2005277096A (ja) * | 2004-03-24 | 2005-10-06 | Japan Science & Technology Agency | カーボンナノチューブ含有金属膜を用いてなる半導体配線とその製造方法、およびカーボンナノチューブ含有金属膜の製造方法 |
JP2006001232A (ja) * | 2004-06-21 | 2006-01-05 | Hitachi Metals Ltd | 高熱伝導・低熱膨脹複合体およびその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0623350B2 (ja) * | 1988-01-20 | 1994-03-30 | 信越ポリマー株式会社 | 異方導電性接着剤 |
US5545679A (en) * | 1993-11-29 | 1996-08-13 | Eaton Corporation | Positive temperature coefficient conductive polymer made from thermosetting polyester resin and conductive fillers |
JP2002151811A (ja) | 2000-11-13 | 2002-05-24 | Suzuki Sogyo Co Ltd | 配線板用基板 |
AU2002229042A1 (en) | 2000-12-12 | 2002-06-24 | Shri Diksha Corporation | Lightweight circuit board with conductive constraining cores |
KR101047711B1 (ko) * | 2002-08-07 | 2011-07-08 | 호야 가부시키가이샤 | 콘택 부품과 그 제조방법 및 콘택 부품을 구비한 검사 기구 |
JP4008402B2 (ja) * | 2003-09-30 | 2007-11-14 | 日本圧着端子製造株式会社 | 異方導電シートケーブル及びその製造方法 |
JP2005108625A (ja) * | 2003-09-30 | 2005-04-21 | Jst Mfg Co Ltd | 多層異方導電シート |
US7354532B2 (en) * | 2004-04-13 | 2008-04-08 | E.I. Du Pont De Nemours And Company | Compositions of electrically conductive polymers and non-polymeric fluorinated organic acids |
KR100581221B1 (ko) * | 2004-06-30 | 2006-05-22 | 삼성전자주식회사 | 테이프 배선 기판 제조 방법 |
US7129097B2 (en) * | 2004-07-29 | 2006-10-31 | International Business Machines Corporation | Integrated circuit chip utilizing oriented carbon nanotube conductive layers |
US7235745B2 (en) * | 2005-01-10 | 2007-06-26 | Endicott Interconnect Technologies, Inc. | Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate |
KR100757901B1 (ko) | 2006-04-07 | 2007-09-11 | 전자부품연구원 | 인쇄회로기판 및 그 제조방법 |
JP4744360B2 (ja) * | 2006-05-22 | 2011-08-10 | 富士通株式会社 | 半導体装置 |
-
2007
- 2007-07-09 KR KR1020070068523A patent/KR100925189B1/ko not_active IP Right Cessation
-
2008
- 2008-03-18 US US12/076,428 patent/US20090017275A1/en not_active Abandoned
- 2008-04-01 JP JP2008095412A patent/JP4693861B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001358264A (ja) * | 2000-04-14 | 2001-12-26 | Suzuki Sogyo Co Ltd | 熱伝導性シート及びその製造方法 |
JP2004303962A (ja) * | 2003-03-31 | 2004-10-28 | Yokohama Rubber Co Ltd:The | 高周波回路基板及びその製造方法 |
JP2005277096A (ja) * | 2004-03-24 | 2005-10-06 | Japan Science & Technology Agency | カーボンナノチューブ含有金属膜を用いてなる半導体配線とその製造方法、およびカーボンナノチューブ含有金属膜の製造方法 |
JP2006001232A (ja) * | 2004-06-21 | 2006-01-05 | Hitachi Metals Ltd | 高熱伝導・低熱膨脹複合体およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100925189B1 (ko) | 2009-11-06 |
US20090017275A1 (en) | 2009-01-15 |
JP2009016795A (ja) | 2009-01-22 |
KR20090005471A (ko) | 2009-01-14 |
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