JP4315293B2 - Manufacturing method of aggregate substrate - Google Patents
Manufacturing method of aggregate substrate Download PDFInfo
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Description
本発明は、集合基板の分割方法に関する。 The present invention relates to a method for dividing an aggregate substrate.
大量の個別部品を効率的に製造するための方法として、集合基板の状態で製造プロセスを進め、必要な工程が済んだ後、個別部品に分割する方法が知られている。集合基板に関する公知文献としては、特許文献１がある。この特許文献１は、中央部に個別部品領域が縦横に配列形成されるとともに外周部にダミー領域が形成された集合基板を開示している。
しかし、特許文献１の開示技術では、分割溝の形成工程を、集合基板の焼成工程の前に行うので、焼成による基板収縮や反りなどに伴い、分割溝が変形やゆがみを受ける可能性がある。このため、集合基板を分割溝で分割して得られる個別部品について、寸法精度を確保するのが難しくなる。 However, in the disclosed technique of Patent Document 1, since the dividing groove forming step is performed before the aggregate substrate baking step, the dividing groove may be deformed or distorted due to substrate shrinkage or warpage due to baking. . For this reason, it becomes difficult to ensure the dimensional accuracy of the individual parts obtained by dividing the collective substrate with the dividing grooves.
また、特許文献１の開示技術では、集合基板外周部のダミー領域に分割溝が形成されないため、集合基板を分割溝に沿って折る際、ダミー領域では上手く折ることができない。このため、簡単に個別部品を得ることができず、分割能率が悪い。 Further, in the disclosed technique of Patent Document 1, since the dividing groove is not formed in the dummy region on the outer periphery of the collective substrate, when the collective substrate is folded along the dividing groove, the dummy region cannot be folded well. For this reason, an individual part cannot be obtained easily and division efficiency is bad.
本発明は、上記問題点に鑑みてなされたものであり、集合基板を分割して得られる個別部品の寸法精度を確保し、尚且つ、分割能率を改善し得る集合基板の分割方法を提供することを目的とする。 The present invention has been made in view of the above problems, and provides a method for dividing a collective substrate that can ensure the dimensional accuracy of individual parts obtained by dividing the collective substrate and can improve the division efficiency. For the purpose.
＜第１の態様＞
上述した課題を解決するため、第１の態様に係る集合基板の分割方法では、一面に、複数の個別部品形成領域を含む部品形成領域と、前記部品形成領域の周囲に設定されるダミー領域とを有する集合基板を用意する。更に、前記集合基板を焼成する。
<First aspect>
In order to solve the above-described problem, in the collective substrate dividing method according to the first aspect, a component forming region including a plurality of individual component forming regions on one side, and a dummy region set around the component forming region, A collective substrate having is prepared. Further, the aggregate substrate is fired.
前記焼成の後、前記集合基板の前記一面に第１の分割溝を、前記部品形成領域を通らずに前記ダミー領域上を延びる態様で形成する。更に、前記集合基板の前記一面に第２の分割溝を、前記部品形成領域で前記個別部品形成領域間の境界上を延び、前記ダミー領域で前記第１の分割溝に交わり、かつ、前記ダミー領域内で止まる態様で形成する。 After the firing, a first dividing groove is formed on the one surface of the aggregate substrate so as to extend on the dummy region without passing through the component formation region. Further, a second division groove is formed on the one surface of the collective substrate, extends on the boundary between the individual component formation regions in the component formation region, intersects the first division groove in the dummy region, and the dummy It is formed in a manner that stops in the region.
そして、前記集合基板を、前記第１の分割溝に従って分割して、前記部品形成領域を含む集合基板片を得る。更に、前記集合基板片を、前記第２の分割溝に従って分割する。 Then, the collective substrate is divided according to the first dividing groove to obtain a collective substrate piece including the component forming region. Further, the aggregate substrate piece is divided according to the second dividing groove.
上述した第１の態様に係る集合基板の分割方法では、集合基板を焼成した後、第１の分割溝を、部品形成領域を通らずにダミー領域上を延びる態様で形成する。更に、第２の分割溝を、部品形成領域で個別部品形成領域間の境界上を延び、ダミー領域で第１の分割溝に交わり、かつ、ダミー領域内で止まる態様で形成する。 In the aggregate substrate dividing method according to the first aspect described above, after firing the aggregate substrate, the first divided grooves are formed in such a manner as to extend over the dummy region without passing through the component formation region. Further, the second division groove is formed in such a manner that it extends on the boundary between the individual component formation regions in the component formation region, intersects with the first division groove in the dummy region, and stops in the dummy region.
そして、集合基板を、第１の分割溝に従って分割して、部品形成領域を含む集合基板片を得る。このとき初めて、集合基板片の分割端面に第２の分割溝が露出することになる。その後、第２の分割溝に従って集合基板片を分割すればよい。従って、集合基板の取り扱い中に、意図しない割れが生じる恐れを回避することができ、分割工程を能率良く進めることができる。 Then, the collective substrate is divided according to the first dividing groove to obtain a collective substrate piece including a component forming region. For the first time, the second dividing groove is exposed on the dividing end face of the aggregate substrate piece. Thereafter, the aggregate substrate piece may be divided according to the second dividing groove. Therefore, it is possible to avoid the risk of unintentional cracking during handling of the aggregate substrate, and the dividing process can be efficiently performed.
しかも、集合基板の焼成工程の後、第２の分割溝の形成工程を行う時間的順序となっているから、第２の分割溝が変形やゆがみを受ける可能性を低減することができる。よって、第２の分割溝に沿った分割で得られる個別部品の寸法精度を確保することが可能となる。 In addition, since the second divided groove is formed in a time sequence after the aggregate substrate firing step, the possibility that the second divided groove is subjected to deformation or distortion can be reduced. Therefore, it becomes possible to ensure the dimensional accuracy of the individual parts obtained by the division along the second division groove.
一つの実施形態では、第２の分割溝は、第１の分割溝の溝深さよりも大きい溝深さを有する。かかる構成の場合、第１の分割溝によるダミー領域の分割の後、第２の分割溝による部品形成領域の分割を容易に行うことができる。従って、部品形成領域に必要以上の圧力がかからずに済むようになり、部品形成領域から得られる個別部品へのダメージを低減することができる。典型的には、第１の分割溝の溝深さは、集合基板の厚さの５％から５０％までの範囲に設定され、第２の分割溝の溝深さは、集合基板の厚さの１０％から９０％までの範囲に設定される。 In one embodiment, the second dividing groove has a groove depth larger than the groove depth of the first dividing groove. In such a configuration, after the dummy area is divided by the first dividing groove, the component forming area can be easily divided by the second dividing groove. Therefore, it becomes unnecessary to apply more pressure than necessary to the component forming region, and damage to individual components obtained from the component forming region can be reduced. Typically, the groove depth of the first divided groove is set in a range of 5% to 50% of the thickness of the aggregate substrate, and the groove depth of the second divided groove is the thickness of the aggregate substrate. Of 10% to 90%.
もう一つの実施形態では、集合基板の一面に第１の分割溝を、両端が集合基板の外周まで達する態様で形成する。かかる態様によれば、第１の分割溝に沿った集合基板の分割を簡単に行うことができる。 In another embodiment, the first dividing groove is formed on one surface of the collective substrate in such a manner that both ends reach the outer periphery of the collective substrate. According to this aspect, it is possible to easily divide the aggregate substrate along the first dividing groove.
更にもう一つの実施形態では、部品形成領域は、集合基板の一面において長さ方向及び幅方向を有する形状に設定されており、集合基板の一面に第１の分割溝を、部品形成領域の幅方向の両側に２つ備えられる態様で形成する。 In yet another embodiment, the component formation region is set to have a shape having a length direction and a width direction on one surface of the collective substrate, and the first division groove is formed on one surface of the collective substrate, and the width of the component formation region. It is formed in such a manner that two are provided on both sides of the direction.
＜第２の態様＞
第２の態様に係る集合基板の分割方法では、一面に、複数の個別部品形成領域を含む部品形成領域と、前記部品形成領域の周囲に設定されるダミー領域とを有する集合基板を用意する。更に、前記集合基板を焼成する。
<Second aspect>
In the collective substrate dividing method according to the second aspect, a collective substrate having a component forming region including a plurality of individual component forming regions and a dummy region set around the component forming region is prepared on one surface. Further, the aggregate substrate is fired.
前記焼成の後、前記集合基板の前記一面に第２の分割溝を、前記部品形成領域で前記個別部品形成領域間の境界上を延び、かつ、前記ダミー領域内で止まる態様で形成する。更に、前記集合基板の前記一面に第１の分割溝を、前記部品形成領域を通らずに前記ダミー領域上を延び、かつ、前記ダミー領域で第２の分割溝に交わる態様で形成する。 After the firing, a second dividing groove is formed on the one surface of the collective substrate in such a manner that it extends on the boundary between the individual component forming regions in the component forming region and stops in the dummy region. Furthermore, a first dividing groove is formed on the one surface of the collective substrate in such a manner that the first dividing groove extends on the dummy area without passing through the component forming area and intersects the second dividing groove in the dummy area.
そして、前記集合基板を、前記第１の分割溝に従って分割して、前記部品形成領域を含む集合基板片を得る。更に、前記集合基板片を、前記第２の分割溝に従って分割する。 Then, the collective substrate is divided according to the first dividing groove to obtain a collective substrate piece including the component forming region. Further, the aggregate substrate piece is divided according to the second dividing groove.
上述した第２の態様に係る集合基板の分割方法では、集合基板を焼成した後、第２の分割溝を、部品形成領域で個別部品形成領域間の境界上を延び、かつ、ダミー領域内で止まる態様で形成する。更に、第１の分割溝を、部品形成領域を通らずにダミー領域上を延び、かつ、ダミー領域で第２の分割溝に交わる態様で形成する。 In the collective substrate dividing method according to the second aspect described above, after firing the collective substrate, the second divided groove extends on the boundary between the individual component forming regions in the component forming region, and in the dummy region. It is formed in a manner that stops. Further, the first dividing groove is formed in such a manner that it extends over the dummy area without passing through the component forming area and intersects the second dividing groove in the dummy area.
そして、集合基板を、第１の分割溝に従って分割して、部品形成領域を含む集合基板片を得る。このとき初めて、集合基板片の分割端面に第２の分割溝が露出することになる。その後、第２の分割溝に従って集合基板片を分割すればよい。従って、集合基板の取り扱い中に、意図しない割れが生じる恐れを回避することができ、分割工程を能率良く進めることができる。 Then, the collective substrate is divided according to the first dividing groove to obtain a collective substrate piece including a component forming region. For the first time, the second dividing groove is exposed on the dividing end face of the aggregate substrate piece. Thereafter, the aggregate substrate piece may be divided according to the second dividing groove. Therefore, it is possible to avoid the risk of unintentional cracking during handling of the aggregate substrate, and the dividing process can be efficiently performed.
しかも、集合基板の焼成工程の後、第２の分割溝の形成工程を行う時間的順序となっているから、第２の分割溝が変形やゆがみを受ける可能性を低減することができる。よって、第２の分割溝に沿った分割で得られる個別部品の寸法精度を確保することが可能となる。 In addition, since the second divided groove is formed in a time sequence after the aggregate substrate firing step, the possibility that the second divided groove is subjected to deformation or distortion can be reduced. Therefore, it becomes possible to ensure the dimensional accuracy of the individual parts obtained by the division along the second division groove.
好ましい実施形態については、第１の態様に係る集合基板の分割方法と同様であり、重複説明を省略する。 The preferred embodiment is the same as the collective substrate dividing method according to the first aspect, and a duplicate description is omitted.
以上述べたように、本発明によれば、集合基板を分割して得られる個別部品の寸法精度を確保し、尚且つ、分割能率を改善し得る集合基板の分割方法を提供することができる。 As described above, according to the present invention, it is possible to provide a method for dividing an aggregate board that can ensure the dimensional accuracy of individual parts obtained by dividing the aggregate board and can improve the division efficiency.
図１は、本発明に係る集合基板の分割方法を適用し得る集合基板の一例を示す平面図である。集合基板５は、その面上に、部品形成領域Ｕと、ダミー領域Ｓとを有する。集合基板５の構成としては、ガラスセラミック基板、セラミック基板、ＬＴＣＣ基板（低温同時焼成セラミック基板）、樹脂基板または複合積層基板などの構成が挙げられる。 FIG. 1 is a plan view showing an example of an aggregate substrate to which the aggregate substrate dividing method according to the present invention can be applied. The collective substrate 5 has a component formation region U and a dummy region S on its surface. Examples of the configuration of the collective substrate 5 include a glass ceramic substrate, a ceramic substrate, an LTCC substrate (low temperature co-fired ceramic substrate), a resin substrate, a composite laminated substrate, and the like.
部品形成領域Ｕは、集合基板５の中央部に、長さ方向Ｘ及び幅方向Ｙを有する形状で設定される。図示実施形態の場合、部品形成領域Ｕは、長さ方向Ｘ及び幅方向Ｙで定義される長方形状に設定されている。部品形成領域Ｕは、複数（ｍ×ｎ個）の個別部品形成領域Ｕ１１〜Ｕｍｎを含む。これらの個別部品形成領域Ｕ１１〜Ｕｍｎは、それぞれ、個別部品を形成するための領域である。個別部品形成領域Ｕ１１〜Ｕｍｎは、長さ方向Ｘ及び幅方向Ｙに沿って、ｍ行ｎ列の行列状に配置されている。 The component formation region U is set in a shape having a length direction X and a width direction Y in the central portion of the collective substrate 5. In the case of the illustrated embodiment, the component forming region U is set in a rectangular shape defined by the length direction X and the width direction Y. The component formation region U includes a plurality (m × n) of individual component formation regions U11 to Umn. These individual component forming regions U11 to Umn are regions for forming individual components, respectively. The individual component formation regions U11 to Umn are arranged in a matrix of m rows and n columns along the length direction X and the width direction Y.
ダミー領域Ｓは、集合基板５の周辺部に、部品形成領域Ｕを取り囲む形状で設定される。ダミー領域Ｓは、集合基板５の取り扱い中、良好なハンドリング性を確保するための領域として機能する。 The dummy area S is set in a shape surrounding the component forming area U in the peripheral portion of the collective substrate 5. The dummy area S functions as an area for ensuring good handling properties during handling of the collective substrate 5.
次に、集合基板５を焼成する。例えば、ガラスセラミック基板の場合、ガラス粉末とセラミック粉末との混合物を低温焼成して得られる。ガラスセラミックは誘電率が低く、高周波用絶縁基板として好適であり、またガラスセラミックは800〜1000℃程度の低温で焼成することができることから、銅、銀、金等の低抵抗金属を配線層として使用できる。 Next, the aggregate substrate 5 is fired. For example, in the case of a glass ceramic substrate, it can be obtained by low-temperature firing a mixture of glass powder and ceramic powder. Glass ceramic has a low dielectric constant and is suitable as an insulating substrate for high frequencies. Since glass ceramic can be fired at a low temperature of about 800 to 1000 ° C., a low resistance metal such as copper, silver, or gold is used as a wiring layer. Can be used.
次に、図２に示すように、集合基板５の面上に第１の分割溝１１を形成する。第１の分割溝１１は、部品形成領域Ｕを通らずにダミー領域Ｓ上を延びる態様で形成される。具体的には、第１の分割溝１１は、ダミー領域Ｓにおいて、部品形成領域Ｕから間隔を隔てた位置に設けられる。図示実施形態の場合、部品形成領域Ｕは、長さ方向Ｘ及び幅方向Ｙで定義される長方形状となっており、第１の分割溝１１は、部品形成領域Ｕの幅方向Ｙの両側に２つ設けられる。図示された第１の分割溝１１は、長さ方向Ｘに沿った直線となっているが、必要に応じ、曲線または折れ線を含んでいてもよい。分割溝１１は、両端が集合基板５の外周まで達する態様で設けられる。 Next, as shown in FIG. 2, first division grooves 11 are formed on the surface of the collective substrate 5. The first dividing groove 11 is formed in such a manner that it extends over the dummy region S without passing through the component formation region U. Specifically, the first dividing groove 11 is provided in the dummy region S at a position spaced from the component formation region U. In the case of the illustrated embodiment, the component forming region U has a rectangular shape defined by the length direction X and the width direction Y, and the first dividing grooves 11 are formed on both sides of the component forming region U in the width direction Y. Two are provided. The illustrated first dividing groove 11 is a straight line along the length direction X, but may include a curved line or a broken line as necessary. The dividing groove 11 is provided in such a manner that both ends reach the outer periphery of the collective substrate 5.
次に、図３に示すように、集合基板５の面上に第２の分割溝１２を形成する。第２の分割溝１２は、部品形成領域Ｕで幅方向Ｙに、個別部品形成領域間の境界上を延びる態様で形成される。例えば、第２の分割溝１２の１つは、第１列に属する個別部品形成領域Ｕ１１〜Ｕｍ１と、第２列に属する個別部品形成領域Ｕ１２〜Ｕｍ２との境界上を延びる態様で形成される。 Next, as shown in FIG. 3, second divided grooves 12 are formed on the surface of the collective substrate 5. The second dividing groove 12 is formed in the component forming region U in the width direction Y so as to extend on the boundary between the individual component forming regions. For example, one of the second dividing grooves 12 is formed in such a manner as to extend on the boundary between the individual component forming regions U11 to Um1 belonging to the first row and the individual component forming regions U12 to Um2 belonging to the second row. .
更に、第２の分割溝１２は、ダミー領域Ｓで第１の分割溝１１に交わり、かつ、ダミー領域Ｓ内で止まる態様で形成される。具体的には、第２の分割溝１２は、ダミー領域Ｓ内において、集合基板５の外周から間隔を隔てた位置で止まる。図示された第２の分割溝１２は、幅方向Ｙに沿った直線となっているが、必要に応じ、曲線または折れ線を含んでいてもよい。 Further, the second dividing groove 12 is formed in such a manner that it intersects with the first dividing groove 11 in the dummy region S and stops in the dummy region S. Specifically, the second dividing groove 12 stops in the dummy region S at a position spaced from the outer periphery of the collective substrate 5. The illustrated second dividing groove 12 is a straight line along the width direction Y, but may include a curved line or a broken line as necessary.
次に、図４に示すように、集合基板５の面上に第３の分割溝１３を形成する。第３の分割溝１３は、部品形成領域Ｕで長さ方向Ｘに、個別部品形成領域間の境界上を延びる態様で形成される。例えば、第３の分割溝１３の１つは、第１行に属する個別部品形成領域Ｕ１１〜Ｕ１ｎと、第２行に属する個別部品形成領域Ｕ２１〜Ｕ２ｎとの境界上を延びる態様で形成される。第２の分割溝１２と同様、第３の分割溝１３も、長さ方向Ｘに沿った直線となっているが、必要に応じ、曲線または折れ線を含んでいてもよい。 Next, as shown in FIG. 4, third divided grooves 13 are formed on the surface of the collective substrate 5. The third dividing groove 13 is formed in the component forming region U in the length direction X so as to extend on the boundary between the individual component forming regions. For example, one of the third dividing grooves 13 is formed in such a manner as to extend on the boundary between the individual component forming regions U11 to U1n belonging to the first row and the individual component forming regions U21 to U2n belonging to the second row. . Similar to the second dividing groove 12, the third dividing groove 13 is also a straight line along the length direction X, but may include a curved line or a broken line as necessary.
第１〜第３の分割溝１１〜１３を形成するための具体的手法としては、集合基板上で円盤状の切断刃を回転させ、集合基板に微細なクラックを入れながら円盤状切断刃を進行させる方法を挙げることができる。 As a specific method for forming the first to third dividing grooves 11 to 13, the disk-shaped cutting blade is rotated on the collective substrate, and the disc-shaped cutting blade is advanced while making a fine crack in the collective substrate. Can be mentioned.
また、第２の分割溝１２は、第１の分割溝１１の溝深さよりも大きい溝深さとなるように形成される。典型的には、第１の分割溝１１の溝深さは、集合基板５の厚さの５％から５０％までの範囲に設定され、第２の分割溝１２の溝深さは、集合基板５の厚さの１０％から９０％までの範囲に設定される。これらの溝深さは、円盤状切断刃の切断荷重を調整することにより制御することができる。 The second dividing groove 12 is formed to have a groove depth larger than the groove depth of the first dividing groove 11. Typically, the groove depth of the first divided groove 11 is set in a range of 5% to 50% of the thickness of the collective substrate 5, and the groove depth of the second divided groove 12 is set to be the collective substrate. 5 is set to a range of 10% to 90% of the thickness. These groove depths can be controlled by adjusting the cutting load of the disk-shaped cutting blade.
また、第１〜第３の分割溝１１〜１３の形成について、時間的な順序関係は任意である。例えば、第２の分割溝１２の形成の後に第１の分割溝１１の形成を行ってもよいし、第１の分割溝１１の形成と、第２の分割溝１２の形成とを同時に行ってもよい。第２の分割溝１２の形成の後に第１の分割溝１１の形成を行う場合を採りあげ、具体的に説明すると、まず、第２の分割溝１２を、部品形成領域Ｕで個別部品形成領域間の境界上を延び、かつ、ダミー領域Ｓ内で止まる態様で形成する。次に、第１の分割溝１１を、部品形成領域Ｕを通らずにダミー領域Ｓ上を延び、かつ、ダミー領域Ｓで第２の分割溝１２に交わる態様で形成する。 Further, the temporal order relation is arbitrary for the formation of the first to third dividing grooves 11 to 13. For example, the first divided groove 11 may be formed after the second divided groove 12 is formed, or the first divided groove 11 and the second divided groove 12 may be formed simultaneously. Also good. Taking the case where the first divided groove 11 is formed after the formation of the second divided groove 12 as a specific example, the second divided groove 12 is first separated into the individual component forming region U in the component forming region U. It is formed in such a manner that it extends on the boundary between them and stops in the dummy region S. Next, the first dividing groove 11 is formed in such a manner that it extends over the dummy area S without passing through the component forming area U and intersects the second dividing groove 12 in the dummy area S.
このようにして第１〜第３の分割溝１１〜１３の形成を行った後、集合基板５の状態で製造プロセスを進める。例えば、個別部品形成領域１１〜Ｕｍｎのそれぞれに、キャパシタまたはインダクタなどのチップ部品を搭載する。図５には、個別部品形成領域１１〜Ｕｍｎの１つ（個別部品形成領域Ｕ２２）についてチップ部品８を搭載した状態が示されている。更に、集合基板５の状態で検査プロセスを進めることもできる。 After the first to third dividing grooves 11 to 13 are formed in this manner, the manufacturing process proceeds in the state of the collective substrate 5. For example, a chip component such as a capacitor or an inductor is mounted on each of the individual component formation regions 11 to Umn. FIG. 5 shows a state in which the chip component 8 is mounted on one of the individual component formation regions 11 to Umn (individual component formation region U22). Furthermore, the inspection process can be performed in the state of the collective substrate 5.
次に、集合基板５を、第１の分割溝１１（図４参照）に従って分割する。具体的手法としては、第１の分割溝１１に沿って集合基板５に破断力を加えればよい。かような分割工程により、図６に示すように、ダミー領域Ｓの他に部品形成領域Ｕを含む第１の集合基板片５１が得られる。また、このとき初めて、第１の集合基板片５１の分割端面５１１に、第２の分割溝１２が露出することになる。第１の集合基板片５１は、行列状に配置された個別部品形成領域Ｕ１１〜Ｕｍｎを含んでいる。 Next, the collective substrate 5 is divided according to the first dividing groove 11 (see FIG. 4). As a specific method, a breaking force may be applied to the collective substrate 5 along the first divided grooves 11. By such a dividing step, as shown in FIG. 6, the first collective board piece 51 including the component forming region U in addition to the dummy region S is obtained. Also, for the first time, the second divided groove 12 is exposed on the divided end face 511 of the first collective substrate piece 51. The first collective substrate piece 51 includes individual component forming regions U11 to Umn arranged in a matrix.
次に、第１の集合基板片５１を、第２の分割溝１２（図６参照）に従って分割する。具体的手法としては、先の分割工程と同様、第２の分割溝１２に沿って第１の集合基板片５１に破断力を加えればよい。かような分割工程により、図７に示すように、第２の集合基板片５２が得られる。第２の集合基板片５２は、それぞれ、一列に配置された個別部品形成領域（例えば個別部品形成領域Ｕ１１〜Ｕｍ１）を含んでいる。 Next, the first collective substrate piece 51 is divided according to the second dividing groove 12 (see FIG. 6). As a specific method, a breaking force may be applied to the first aggregate substrate piece 51 along the second dividing groove 12 as in the previous dividing step. By such a dividing step, as shown in FIG. 7, a second aggregate substrate piece 52 is obtained. Each of the second aggregate substrate pieces 52 includes individual component forming regions (for example, individual component forming regions U11 to Um1) arranged in a line.
次に、第２の集合基板片５２を、第３の分割溝１３（図７参照）に従って分割する。具体的手法としては、先の分割工程と同様、第３の分割溝１３に沿って第２の集合基板片５２に破断力を加えればよい。かような分割工程により、図８に示すように、個別部品５３が得られる。個別部品５３は、それぞれ、１つの個別部品形成領域（例えば個別部品形成領域Ｕ１１）からなる。 Next, the second aggregate substrate piece 52 is divided according to the third dividing groove 13 (see FIG. 7). As a specific method, a breaking force may be applied to the second aggregate substrate piece 52 along the third dividing groove 13 as in the previous dividing step. By such a dividing step, individual parts 53 are obtained as shown in FIG. Each of the individual parts 53 includes one individual part forming area (for example, an individual part forming area U11).
上述した集合基板５の分割方法では、集合基板５を焼成した後、図２に示すように、第１の分割溝１１を、部品形成領域Ｕを通らずにダミー領域Ｓ上を延びる態様で形成する。更に、図３に示すように、第２の分割溝１２を、部品形成領域Ｕで個別部品形成領域Ｕ１１〜Ｕｍｎ間の境界上を延び、ダミー領域Ｓで第１の分割溝１１に交わり、かつ、ダミー領域Ｓ内で止まる態様で形成する。 In the method for dividing the collective substrate 5 described above, after the collective substrate 5 is fired, as shown in FIG. 2, the first divided grooves 11 are formed in such a manner as to extend on the dummy region S without passing through the component forming region U. To do. Furthermore, as shown in FIG. 3, the second dividing groove 12 extends on the boundary between the individual component forming areas U11 to Umn in the component forming area U, intersects the first dividing groove 11 in the dummy area S, and Then, it is formed so as to stop in the dummy region S.
そして、集合基板５を、第１の分割溝１１に従って分割し、図６に示すように、部品形成領域Ｕを含む集合基板片５１を得る。このとき初めて、集合基板片５１の分割端面５１１に第２の分割溝１２が露出することになる。その後、図７に示すように、第２の分割溝１２に従って集合基板片５１を分割すればよい。従って、集合基板の取り扱い中に、意図しない割れが生じる恐れを回避することができ、分割工程を能率良く進めることができる。 Then, the collective substrate 5 is divided according to the first dividing grooves 11 to obtain the collective substrate piece 51 including the component forming region U as shown in FIG. For the first time, the second dividing groove 12 is exposed on the dividing end surface 511 of the collective substrate piece 51. Thereafter, as shown in FIG. 7, the aggregate substrate piece 51 may be divided according to the second dividing groove 12. Therefore, it is possible to avoid the risk of unintentional cracking during handling of the aggregate substrate, and the dividing process can be efficiently performed.
しかも、集合基板５の焼成工程の後、第２、第３の分割溝１２、１３の形成工程（図３、図４参照）を行う時間的順序となっているから、第２、第３の分割溝１２、１３が変形やゆがみを受ける可能性を低減することができる。よって、第２、第３の分割溝１２、１３に沿った分割で得られる個別部品５３（図８参照）の寸法精度を確保することが可能となる。 Moreover, since the second and third divided grooves 12 and 13 are formed in a time sequence (see FIG. 3 and FIG. 4) after the collective substrate 5 firing step, the second and third steps are performed. The possibility that the dividing grooves 12 and 13 are subjected to deformation and distortion can be reduced. Therefore, it is possible to ensure the dimensional accuracy of the individual component 53 (see FIG. 8) obtained by the division along the second and third division grooves 12 and 13.
第１の分割溝１１については、その溝深さを、集合基板の厚さや材質等の条件から最適化することにより、集合基板５の取り扱い中に、意図しない割れを回避するとともに、第１の分割溝１１に沿って集合基板５に破断力を加えたとき、第１の分割溝１１による集合基板５の分割を簡単に行うことができる（図６参照）。 About the 1st division | segmentation groove | channel 11, while optimizing the groove depth from conditions, such as the thickness of a collective board, a material, etc., while handling the collective board 5, while avoiding an unintentional crack, 1st When a breaking force is applied to the collective substrate 5 along the divided grooves 11, the collective substrate 5 can be easily divided by the first divided grooves 11 (see FIG. 6).
図示実施形態では、第１の分割溝１１を、両端が集合基板５の外周まで達する態様で形成する（図２参照）。かかる態様によれば、第１の分割溝１１に沿った集合基板５の分割（図６参照）を簡単に行うことができる。但し、本発明は、かような態様に限定されることはない。この点については、第１の分割溝１１を、集合基板５の外周から間隔を隔てた位置で止まる態様で形成しても、第１の分割溝１１に沿った集合基板５の分割が可能なことから明らかであろう。 In the illustrated embodiment, the first dividing groove 11 is formed in such a manner that both ends reach the outer periphery of the collective substrate 5 (see FIG. 2). According to this aspect, it is possible to easily divide the aggregate substrate 5 along the first dividing groove 11 (see FIG. 6). However, the present invention is not limited to such an embodiment. In this regard, even if the first divided groove 11 is formed in a manner that stops at a position spaced from the outer periphery of the collective substrate 5, the collective substrate 5 can be divided along the first divided groove 11. It will be clear from this.
更に図示実施形態では、第２の分割溝１２は、第１の分割溝１１の溝深さよりも大きい溝深さとなっている。かかる構成の場合、第１の分割溝１１によるダミー領域Ｓの分割（図６参照）の後、第２の分割溝１２による部品形成領域Ｕの分割（図７参照）を容易に行うことができる。従って、部品形成領域Ｕに必要以上の圧力がかからずに済むようになり、部品形成領域Ｕから得られる個別部品へのダメージを低減することができる。 Further, in the illustrated embodiment, the second dividing groove 12 has a groove depth larger than the groove depth of the first dividing groove 11. In the case of this configuration, after the division of the dummy region S by the first dividing groove 11 (see FIG. 6), the component forming region U can be easily divided by the second dividing groove 12 (see FIG. 7). . Therefore, it becomes unnecessary to apply more pressure than necessary to the component forming region U, and damage to the individual components obtained from the component forming region U can be reduced.
以上、好ましい実施形態を参照して本発明の内容を具体的に説明したが、本発明の基本的技術思想及び教示に基づいて、当業者であれば、種々の変形態様を採り得ることは自明である。 Although the contents of the present invention have been specifically described with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.
５ 集合基板
Ｕ 部品形成領域
Ｕ１１〜Ｕｍｎ 個別部品形成領域
Ｓ ダミー領域
１１ 第１の分割溝
１２ 第２の分割溝
DESCRIPTION OF SYMBOLS 5 Collective substrate U Component formation area U11-Umn Individual component formation area S Dummy area 11 1st division groove 12 2nd division groove
Claims (4)
前記集合基板を焼成する工程と、
前記焼成の後、前記集合基板の前記一面に、相互に深さの異なる２種類の分割溝として、第１の分割溝及び第２の分割溝を形成する工程とを備え、
前記分割溝の形成工程は、前記集合基板の前記一面に少なくとも一対の第１の分割溝を、前記部品形成領域を通らずに前記ダミー領域上における該部品形成領域から間隔を隔てた位置にそれぞれ延び、かつ、溝両端が前記集合基板の外周まで達する態様で形成し、且つ、
前記集合基板の前記一面において、前記第１の分割溝の溝深さよりも大きい溝深さを有する複数の第２の分割溝をそれぞれ、前記部品形成領域で前記個別部品形成領域間の境界上を延び、前記ダミー領域で前記第１の分割溝に交わり、かつ、前記ダミー領域内で止まる態様で形成することを含み、
前記第１の分割溝は、前記第２の分割溝に直交に形成されており、
さらに、前記集合基板を、前記第１の分割溝に従って分割して、前記第２の分割溝の両端が外縁に露呈している前記部品形成領域を含む集合基板片を得る工程と、
前記集合基板片を、前記第２の分割溝に従って分割する工程とを備える
集合基板の分割方法。 Preparing a collective substrate having a component forming region including a plurality of individual component forming regions on one surface and a dummy region set around the component forming region;
Firing the aggregate substrate;
A step of forming a first divided groove and a second divided groove on the one surface of the collective substrate after the firing as two types of divided grooves having different depths;
The dividing groove forming step includes at least a pair of first dividing grooves on the one surface of the collective substrate at positions spaced apart from the component forming region on the dummy region without passing through the component forming region. Extending in a manner that both ends of the groove reach the outer periphery of the collective substrate, and
A plurality of second division grooves having a groove depth larger than the groove depth of the first division groove on the one surface of the collective substrate, respectively, on the boundary between the individual component formation areas in the component formation area. Extending, intersecting the first dividing groove in the dummy region, and forming in a manner to stop in the dummy region,
The first dividing groove is formed orthogonal to the second dividing groove,
Further, the step of dividing the collective substrate according to the first divided groove to obtain a collective substrate piece including the component forming region in which both ends of the second divided groove are exposed to the outer edge;
Dividing the aggregate substrate piece according to the second division groove.
前記集合基板を焼成する工程と、
前記焼成の後、前記集合基板の前記一面に、相互に深さの異なる２種類の分割溝として、第１の分割溝及び第２の分割溝を形成する工程とを備え、
前記分割溝の形成工程は、前記第１の分割溝の溝深さよりも大きい溝深さを有する複数の前記第２の分割溝をそれぞれ、前記部品形成領域で前記個別部品形成領域間の境界上を延び、かつ、前記ダミー領域内で止まる態様で形成し、且つ、
前記集合基板の前記一面に少なくとも一対の第１の分割溝を、前記部品形成領域を通らずに前記ダミー領域上における該部品形成領域から間隔を隔てた位置にそれぞれ延び、かつ、前記ダミー領域で第２の分割溝に交わり、さらに、溝両端が前記集合基板の外周まで達する態様で形成することを含み、
前記第１の分割溝は、前記第２の分割溝に直交に形成されており、
さらに、前記集合基板を、前記第１の分割溝に従って分割して、前記第２の分割溝の両端が外縁に露呈している前記部品形成領域を含む集合基板片を得る工程と、
前記集合基板片を、前記第２の分割溝に従って分割する工程とを備える
集合基板の分割方法。 Preparing a collective substrate having a component forming region including a plurality of individual component forming regions on one surface and a dummy region set around the component forming region;
Firing the aggregate substrate;
A step of forming a first divided groove and a second divided groove on the one surface of the collective substrate after the firing as two types of divided grooves having different depths;
In the step of forming the dividing groove, a plurality of the second dividing grooves having a groove depth larger than the groove depth of the first dividing groove are respectively arranged on the boundary between the individual component forming regions in the component forming region. And extending in a manner that stops within the dummy region, and
At least a pair of first division grooves on the one surface of the collective substrate respectively extend to a position spaced from the component formation region on the dummy region without passing through the component formation region, and in the dummy region Intersecting the second divided groove, and further comprising forming both ends of the groove to reach the outer periphery of the collective substrate,
The first dividing groove is formed orthogonal to the second dividing groove,
Further, the step of dividing the collective substrate according to the first divided groove to obtain a collective substrate piece including the component forming region in which both ends of the second divided groove are exposed to the outer edge;
Dividing the aggregate substrate piece according to the second division groove.
前記第１の分割溝の溝深さは、前記集合基板の厚さの５％から５０％までの範囲にあり、
前記第２の分割溝の溝深さは、前記集合基板の厚さの１０％から９０％までの範囲にある、
集合基板の分割方法。 A method for dividing a collective substrate according to claim 1 or 2,
The groove depth of the first division groove is in the range of 5% to 50% of the thickness of the aggregate substrate,
The groove depth of the second divided groove is in the range of 10% to 90% of the thickness of the aggregate substrate.
A method for dividing an aggregate substrate.
前記第１の分割溝に従って分割する前に、第３の分割溝が形成されており、
前記第３の分割溝は、前記部品形成領域で前記個別部品形成領域間の境界上を延び、前記第２の分割溝と交わり、かつ、前記第１の分割溝とは交わることなく前記ダミー領域内で止まる態様で形成されており、
前記集合基板片を、前記第２の分割溝に従って分割して、第２の集合基板片を得た後、該第２の集合基板片を、前記第３の分割溝に従って分割する
集合基板の分割方法。 A method for dividing a collective substrate according to any one of claims 1 to 3,
Before dividing according to the first dividing groove, a third dividing groove is formed,
The third division groove extends on the boundary between the individual component formation regions in the component formation region, intersects with the second division groove, and does not intersect with the first division groove. Formed in a manner that stops inside,
Dividing the aggregate substrate piece according to the second dividing groove to obtain a second aggregate substrate piece, and then dividing the second aggregate substrate piece according to the third dividing groove Method.
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