JP4237615B2 - ネットワーク装置用の静電放電装置 - Google Patents
ネットワーク装置用の静電放電装置 Download PDFInfo
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- JP4237615B2 JP4237615B2 JP2003513105A JP2003513105A JP4237615B2 JP 4237615 B2 JP4237615 B2 JP 4237615B2 JP 2003513105 A JP2003513105 A JP 2003513105A JP 2003513105 A JP2003513105 A JP 2003513105A JP 4237615 B2 JP4237615 B2 JP 4237615B2
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0066—Constructional details of transient suppressor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/6485—Electrostatic discharge protection
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M3/00—Automatic or semi-automatic exchanges
- H04M3/18—Automatic or semi-automatic exchanges with means for reducing interference or noise; with means for reducing effects due to line faults with means for protecting lines
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6666—Structural association with built-in electrical component with built-in electronic circuit with built-in overvoltage protection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/073—High voltage adaptations
- H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
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Description
本出願は、上記発明の名称と同一の名称を有し且つ代理人整理番号112690−073を有する2001年7月10日に出願された米国仮特許出願番号60/304374の利益を主張する非仮出願である。
一つの実施形態において、前記装置は、前記過剰ストレス保護装置と電気的に通じる信号線を具備する。
一つの実施形態において、前記信号線は、10BaseT、100BaseT、および1000BaseTのデータ線から構成されるグループの中から選択されたデータ線である。
一つの実施形態において、前記ESD装置は、前記信号線と電気的に通じるイーサネット(登録商標)ネットワーク装置を具備する。
一つの実施形態において、前記ESD装置は、前記信号線と電気的に通じるトランシーバ(transceiver)を具備する。
一つの実施形態において、前記ESD装置は、前記過剰ストレス保護装置と電気的に通じるアースグランド(earth ground)を具備する。
一つの実施形態において、前記キャパシタは、前記ESD装置が所定の定常状態または直流電流電圧の印加に耐えることができるようなサイズに形成される。
一つの実施形態において、前記キャパシタは、信号線からグランドに流れるDC電流を阻止する。
一つの実施形態において、前記キャパシタは、データ伝送コネクタの使用されないデータ線に結合する。
一つの実施形態において、前記ESD保護装置および前記キャパシタは、プリント回路基板(“PCB”)に設けられる。
一つの実施形態において、前記装置および前記キャパシタは、データ伝送コネクタに電気的に通じる少なくとも一つのPCBトレース(PCB trace)に電気的に通じる。
一つの実施形態において、前記ESD保護装置および前記キャパシタは、フレキシブル回路に設けられる。
一つの実施形態において、前記ESD装置および前記キャパシタは、前記フレキシブル回路に設けられたバネ接点(spring contact)に電気的に通じる。
一つの実施形態において、複数のEOS装置およびキャパシタは、前記フレキシブル回路に設けられた複数の接点に電気的に通じる。
一つの実施形態において、前記EOS装置およびキャパシタは、電気装置のコネクタピンに電気的に通じる。
一つの実施形態において、前記電圧可変材料は、10ミクロンよりも小さな平均粒子径を有する導電性および半導電性の粒子(particle)の基質(matrix)を具備する。一つの実施形態において、前記基質は、300オングストロームよりも大きな平均粒子径を有する絶縁性の粒子をさらに具備する。
一つの実施形態において、前記電圧可変材料は、基質に結合した絶縁性酸化表面コーティング(insulative oxide surface coating)を有する不規則に成形された導電性の粒子を具備する。
一つの実施形態において、前記電圧可変材料は、絶縁性酸化フィルムでコーティングされた表面を有する導電性および半導電性粒子の混合物を具備し、前記導電性および半導電性粒子は、絶縁性の結合剤(binder)で互いに結合される。
一つの実施形態において、前記電圧可変材料は、絶縁性酸化フィルムでコーティングされた導電性および半導電性粒子を具備し、それは相互に点接触で結合される。
一つの実施形態において、前記電圧可変材料は、10から20ミクロンに成形された導電性および半導電性粒子を具備する。
一つの実施形態において、前記電圧可変材料は、10から20ミクロンに成形され、且つ少なくとも1000オングストロームだけ間隔を空ける。
一つの実施形態において、前記VVMおよびキャパシタまたはキャパシタ材料は、共通の筐体内部に配置される。
一つの実施形態において、前記VVMは、自己付着(self-adhering)であり、且つPCB、poymide、フレックス回路(flex circuit)、または、キャパシタまたはキャパシタ材料を備える筐体内部に自己付着される。
一つの実施形態において、前記回路は、前記信号線に電気的と通じるイーサネット(登録商標)ネットワーク装置を具備する。
本発明の他の利点は、定常状態ブロッキング機能(steady state blocking function)を備えるESD装置を提供することである。
本発明の更なる利点は、IEEE802.3試験に耐えることができ、且つEOS過渡現象の適切な抑制を維持することができるESD装置を提供することである。
本発明の更なる他の利点は、上記ESD装置の一部を構成する電気的過剰ストレス保護装置のキャパシタンスよりも小さな集合キャパシタンス(aggregate capacitance)を横切って高速データが伝わるESD装置を提供することであり、且つ前記装置は、高速データの完全性を妥協しない。
本発明の付加的な特徴および利点は、次の望ましい実施形態の詳細な説明および図面において述べられて明らかになるであろう。
14 信号線
16 保護装置
18 トランシーバ
20 アースグランド
22 装置
24 キャパシタ
Claims (12)
- 静電放電(“ESD”)装置であって、
高分子複合電圧可変材料(“VVM”)を備える電気的過剰ストレス(“EOS”)保護装置と、
前記保護装置と直列に存在して電気的に通じるキャパシタと
を具備し、
前記高分子複合電圧可変材料(“VVM”)は、導電性粒子と、半導電性粒子と、ポリエステルを含む絶縁性結合剤とを含み、
前記絶縁性結合剤は、前記高分子複合電圧可変材料自身を基板に付着させる粘着性を有すると共に、追加的な処理を用いずに硬化するものであることを特徴とする静電放電装置。 - 前記EOS保護装置および前記キャパシタのうちの一つに電気的に結合する信号線を具備することを特徴とする請求項1記載のESD装置。
- 前記EOS保護装置および前記キャパシタのうちの一つと電気的に通じるグランドを備えることを特徴とする請求項1記載のESD装置。
- 前記EOS保護装置および前記キャパシタは、プリント回路基板(“PCB”)に設けられたことを特徴とする請求項1記載のESD装置。
- 静電放電(“ESD”)装置であって、
重合体複合可変電圧材料(“VVM”)と、
前記VVMと直列に存在して電気的に通じるキャパシタ材料とを具備し、
前記キャパシタ材料は、前記VVMが所定の直流電流電圧の印加に耐えることができるようなサイズに形成され、
前記重合体複合可変電圧材料(“VVM”)は、導電性粒子と、半導電性粒子と、ポリエステルを含む絶縁性結合剤とを含み、
前記絶縁性結合剤は、前記重合体複合可変電圧材料自身を基板に付着させる粘着性を有すると共に、追加的な処理を用いずに硬化するものであることを特徴とする静電放電装置。 - 前記VVMは、基質に結合した絶縁性酸化表面コーティングを有して不規則な形状に形成された導体粒子を備えたことを特徴とする請求項5記載のESD装置。
- 前記VVMは、絶縁性酸化フィルムで覆われた表面を有する導電性および半導電性の粒子の混合物を備え、前記導電性および半導電性粒子は絶縁性の結合剤で互いに結合されたことを特徴とする請求項5記載のESD装置。
- 前記VVMは、絶縁性酸化フィルムで覆われ且つ他のものと点接触で互いに結合された導電性および半導電性の粒子を備えたことを特徴とする請求項5記載のESD装置。
- 前記VVMは、10〜20ミクロンのサイズに形成された導電性および半導電性の粒子を備えたことを特徴とする請求項5記載のESD装置。
- 前記VVMは、基板に直接的に自己付着したことを特徴とする請求項5記載のESD装置。
- 静電放電(ESD)抑制用の電気回路であって、
信号線と、
前記信号線と電気的に通じた高分子複合電圧可変材料(“VVM”)と、
前記VVMと直列に存在して電気的に通じるキャパシタと、
前記キャパシタと電気的に通じるグランドと
を備え、
前記高分子複合電圧可変材料(“VVM”)は、導電性粒子と、半導電性粒子と、ポリエステルを含む絶縁性結合剤とを含み、
前記絶縁性結合剤は、前記高分子複合電圧可変材料自身を基板に付着させる粘着性を有すると共に、追加的な処理を用いずに硬化するものであることを特徴とする電気回路。 - 前記高分子複合電圧可変材料(“VVM”)は、当該電気回路に適用された場合に適所で硬化されると共に要望どおりに加工されるものであることを特徴とする請求項11記載の電気回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US30437401P | 2001-07-10 | 2001-07-10 | |
PCT/US2002/021743 WO2003007452A1 (en) | 2001-07-10 | 2002-07-10 | Electrostatic discharge apparatus for network devices |
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JP2004535749A JP2004535749A (ja) | 2004-11-25 |
JP4237615B2 true JP4237615B2 (ja) | 2009-03-11 |
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US (1) | US7035072B2 (ja) |
JP (1) | JP4237615B2 (ja) |
CN (1) | CN1541437A (ja) |
DE (1) | DE10297040T5 (ja) |
WO (1) | WO2003007452A1 (ja) |
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US7874854B2 (en) * | 2009-02-24 | 2011-01-25 | Commscope, Inc. Of North Carolina | Communications patching devices that include integrated electronic static discharge circuits and related methods |
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-
2002
- 2002-07-10 DE DE10297040T patent/DE10297040T5/de not_active Withdrawn
- 2002-07-10 WO PCT/US2002/021743 patent/WO2003007452A1/en active Application Filing
- 2002-07-10 JP JP2003513105A patent/JP4237615B2/ja not_active Expired - Fee Related
- 2002-07-10 US US10/192,314 patent/US7035072B2/en not_active Expired - Fee Related
- 2002-07-10 CN CNA02815858XA patent/CN1541437A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US7035072B2 (en) | 2006-04-25 |
US20030011026A1 (en) | 2003-01-16 |
WO2003007452A1 (en) | 2003-01-23 |
CN1541437A (zh) | 2004-10-27 |
JP2004535749A (ja) | 2004-11-25 |
DE10297040T5 (de) | 2004-08-05 |
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