JP4044911B2 - Receiver - Google Patents

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JP4044911B2
JP4044911B2 JP2004142446A JP2004142446A JP4044911B2 JP 4044911 B2 JP4044911 B2 JP 4044911B2 JP 2004142446 A JP2004142446 A JP 2004142446A JP 2004142446 A JP2004142446 A JP 2004142446A JP 4044911 B2 JP4044911 B2 JP 4044911B2
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light
substrate
light receiving
electromagnetic shield
shield cover
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JP2005327800A (en
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進 吉川
成利 岡崎
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Toa Corp
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Toa Corp
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Priority to DE602005016092T priority patent/DE602005016092D1/en
Priority to PCT/JP2005/005496 priority patent/WO2005093974A1/en
Priority to EP05721473A priority patent/EP1732248B1/en
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Description

本発明は、赤外線等の光を受光し、これに対応する電気信号を発生する受光器に関する。   The present invention relates to a light receiver that receives light such as infrared rays and generates an electrical signal corresponding thereto.

このような受光器では、受光素子としてフォトダイオードやフォトトランジスタを使用することが多い。例えばフォトダイオードは、受光面となる半導体部が露出している構造であり、かつインピーダンスが高いので、光のみではなく、電磁波に対しても相当な感度を持つ。そのため、フォトダイオードを電磁シールドすることが行われている。フォトダイオードを電磁シールドする構成が、例えば特許文献１に開示されている。   In such a light receiver, a photodiode or a phototransistor is often used as a light receiving element. For example, a photodiode has a structure in which a semiconductor portion serving as a light receiving surface is exposed and has a high impedance, and thus has a considerable sensitivity to not only light but also electromagnetic waves. Therefore, electromagnetic shielding of the photodiode is performed. A configuration in which the photodiode is electromagnetically shielded is disclosed in Patent Document 1, for example.

この特許文献１では、基板上に基板に対して所定の角度をなす台座が設けられている。複数のフォトダイオードが、それぞれ光を受光しようとする方向から光を受けることができるように、この台座に取り付けられている。これら全てのフォトダイオードを覆うように１つの電磁シールドケースが基板に取り付けられている。   In Patent Document 1, a pedestal that forms a predetermined angle with respect to a substrate is provided on the substrate. A plurality of photodiodes are attached to the pedestal so that they can receive light from the direction in which light is received. One electromagnetic shielding case is attached to the substrate so as to cover all these photodiodes.

特開２００２−１９０６１７号公報JP 2002-190617 A

しかし、上記特許文献１の技術では、全てのフォトダイオードを覆うように電磁シールドケースを形成する必要がある。そのため、これら受光器を使用している機器が大型になる。   However, in the technique disclosed in Patent Document 1, it is necessary to form an electromagnetic shield case so as to cover all the photodiodes. Therefore, the apparatus using these light receivers becomes large.

本発明は、受光器が使用されている機器を小型化することが可能な受光器を提供することを目的とする。   An object of this invention is to provide the light receiver which can reduce in size the apparatus in which the light receiver is used.

本発明による受光装置は、受光部への受光に応じて電気信号を発生する１台の受光素子を有している。受光素子としては、例えばフォトダイオードやフォトトランジスタを使用することができる。電磁シールドカバーの枠状体が、この受光素子の前記受光部の両側及び上部を包囲すると共に、前記受光部に対応する位置に受光窓を有している。この枠状体の下部に連なる板状体の下端部が基板に接触している。この電磁シールドカバーの枠状体に、前記受光素子が取り付けられている。前記電磁シールドカバーは、前記枠状体の下部及び前記板状体の両側に連ねて前記枠状体の後方に伸びる基板固定部を有し、この基板固定部は、その下部が前記枠状体に対して予め定めた斜めの角度をなすように形成されている。前記基板固定部は、基板の固定部に係合し、この係合状態において前記基板固定部の下部は、前記基板に接触している。 The light receiving device according to the present invention has one light receiving element that generates an electrical signal in response to light received by the light receiving unit. For example, a photodiode or a phototransistor can be used as the light receiving element. A frame-like body of the electromagnetic shield cover surrounds both sides and the upper part of the light receiving part of the light receiving element, and has a light receiving window at a position corresponding to the light receiving part. The lower end of the plate-like body connected to the lower part of the frame-like body is in contact with the substrate. The light receiving element is attached to the frame of the electromagnetic shield cover. The electromagnetic shield cover has a substrate fixing portion that extends to the rear of the frame-like body and extends to the lower side of the frame-like body and both sides of the plate-like body, and the lower portion of the substrate fixing portion is the frame-like body. Is formed at a predetermined oblique angle. The substrate fixing portion is engaged with a fixing portion of the substrate, and the lower portion of the substrate fixing portion is in contact with the substrate in this engaged state.

このように構成すると、基板固定部を固定部に係合させることによって受光素子が所定の角度をなす。従って、基板固定部を固定部に係合させるというシールドケース及び受光素子の取り付け作業によって、受光素子の角度調整も同時に行うことができ、受光素子の角度調整が不要となる。しかも、受光素子に持たせようとする角度に対応した電磁シールドカバーを用意するだけで、基板等にはなんら変更を加えることなく、受光素子に所定の角度を持たせることができる。また、受光素子の角度精度が電磁シールドカバーの精度によって決まるので、従来のものと比較して格段に受光素子の角度精度が高い。また、基板固定部を基板の固定部に係合させるという簡単な作業だけで受光素子の角度精度を充分に確保することができ、受光素子の角度精度を確保するための特別な作業が不要であり、組み立て作業が簡単となり、組み立てコストが下がる。また、電磁シールドカバーのコストも低く、この受光器のコストを低減することができる。 If comprised in this way, a light receiving element makes a predetermined angle by engaging a board | substrate fixing | fixed part with a fixing | fixed part. Therefore, the angle adjustment of the light receiving element can be simultaneously performed by the attaching operation of the shield case and the light receiving element in which the substrate fixing part is engaged with the fixing part, and the angle adjustment of the light receiving element becomes unnecessary. In addition, it is possible to give the light receiving element a predetermined angle without making any changes to the substrate or the like simply by preparing an electromagnetic shield cover corresponding to the angle to be given to the light receiving element. Further, since the angle accuracy of the light receiving element is determined by the accuracy of the electromagnetic shield cover, the angle accuracy of the light receiving element is much higher than that of the conventional one. In addition, the angle accuracy of the light receiving element can be sufficiently secured only by a simple operation of engaging the substrate fixing portion with the fixing portion of the substrate, and a special operation for ensuring the angle accuracy of the light receiving element is unnecessary. Yes, the assembly work becomes easy and the assembly cost is reduced. In addition, the cost of the electromagnetic shield cover is low, and the cost of the light receiver can be reduced.

さらに、受光素子は、取付板に取り付けることができる。この取付板が電磁シールドカバーの枠状体に取り付けられている。取付板に受光素子を取り付けているので、取付板を介して基板上の電気回路に受光素子を接続することができる。 Furthermore, the light receiving element can be attached to a mounting plate. This attachment plate is attached to the frame of the electromagnetic shield cover . Since the light receiving element is attached to the mounting plate, the light receiving element can be connected to the electric circuit on the substrate via the mounting plate.

以上のように、本発明による受光器によれば、個々の受光器にそれぞれ電磁シールドカバーを設けているので、受光器を使用した機器を小型化することができる。   As described above, according to the light receiver according to the present invention, since the electromagnetic shield cover is provided for each light receiver, the device using the light receiver can be reduced in size.

本発明の第１実施形態の受光器は、例えば赤外線発受光装置に使用されている。この赤外線発受光装置は、例えば赤外線コードレスマイクロホンシステムにおいて使用される。赤外線コードレスマイクロホンシステムでは、例えば会議場の机上に配置された送受話セットと、例えば天井に設けられている赤外線発受光装置との間で、赤外線による双方向の光通信を行う。   The light receiver of the first embodiment of the present invention is used in, for example, an infrared light emitting / receiving device. This infrared light emitting / receiving device is used, for example, in an infrared cordless microphone system. In an infrared cordless microphone system, bidirectional optical communication using infrared rays is performed between, for example, a transmission / reception set arranged on a desk in a conference hall and an infrared light emitting / receiving device provided on a ceiling, for example.

赤外線発受光装置では、図１及び図２に示すように、基板２上に、複数の受光器４が環状に配置されている。基板２は、例えば円板状に形成され、受光器４の設置面とは反対側の面に所定の回路パターンが構成されているプリント基板である。各受光器４は、上述した送受話セットから送信された赤外線を受光し、電気信号を発生する。   In the infrared light emitting and receiving device, as shown in FIGS. 1 and 2, a plurality of light receivers 4 are annularly arranged on a substrate 2. The substrate 2 is a printed circuit board that is formed in a disk shape, for example, and has a predetermined circuit pattern on the surface opposite to the installation surface of the light receiver 4. Each light receiver 4 receives infrared rays transmitted from the above-described transmission / reception set and generates an electrical signal.

これら受光器４は、図３に示すように、受光素子、例えばフォトダイオード６を有している。このフォトダイオード６は、平面型であり、その正面側の面である受光面６ａに赤外線が入射する。フォトダイオード６の背面側には、複数のリード８が突出している。このフォトダイオード６は、その背面側を取付板、例えば小プリント基板１０の取付面に接触した状態に配置され、各リード８が、小プリント基板１０に形成されたパターンの所定位置に接続されている。従って、フォトダイオード６の受光面６ａと小プリント基板１０の取付面とは平行となっている。小プリント基板１０においてフォトダイオード６よりも下方には、基板２との接続用端子１２が配置されている。接続用端子１２の各ピン１２ａの一端が、小プリント基板１０の所定位置に挿通され、小プリント基板１０に形成されているパターンに接続される。これら各ピン１２ａの他端が基板２の所定位置に挿通され、フォトダイオード６は、基板２上の所定パターンに接続される。   As shown in FIG. 3, these light receivers 4 have light receiving elements, for example, photodiodes 6. The photodiode 6 is a flat type, and infrared rays are incident on a light receiving surface 6a which is a surface on the front side. A plurality of leads 8 protrude from the back side of the photodiode 6. The photodiode 6 is arranged with its back side in contact with a mounting plate, for example, a mounting surface of a small printed circuit board 10, and each lead 8 is connected to a predetermined position of a pattern formed on the small printed circuit board 10. Yes. Therefore, the light receiving surface 6a of the photodiode 6 and the mounting surface of the small printed circuit board 10 are parallel. In the small printed board 10, a terminal 12 for connection with the board 2 is arranged below the photodiode 6. One end of each pin 12 a of the connection terminal 12 is inserted into a predetermined position of the small printed circuit board 10 and connected to a pattern formed on the small printed circuit board 10. The other end of each pin 12 a is inserted into a predetermined position of the substrate 2, and the photodiode 6 is connected to a predetermined pattern on the substrate 2.

フォトダイオード６の受光面６ａ側に電磁シールドカバー１４が配置されている。このシールドカバー１４は、導電性材料、例えば鉄製やアルミニウム製であって、フォトダイオード６及び接続用端子１２の両側及び上部を覆うことができ、かつ小プリント基板１０よりも幾分小さい大きさの枠状体１４ａを有している。この枠状体１４ａの正面側にフォトダイオード６の受光面６ａと平行に、これに対応した大きさの窓１４ｂが形成されている。この窓１４ｂには、これを上下左右に４分割するように十字状の格子１４ｃが形成されている。枠状体１４の両側下部には、これらと一体にかつ後方に伸びるように直線状の基板固定部１４ｄが形成されている。図４に示すように、基板固定部１４ｄと枠状体１４ａとは、所定角度、例えば鋭角θをなすように配置されている。   An electromagnetic shield cover 14 is disposed on the light receiving surface 6 a side of the photodiode 6. The shield cover 14 is made of a conductive material, for example, iron or aluminum, can cover both sides and the top of the photodiode 6 and the connection terminal 12, and is slightly smaller than the small printed circuit board 10. It has a frame-like body 14a. A window 14b having a size corresponding to the light receiving surface 6a of the photodiode 6 is formed on the front side of the frame 14a. A cross-shaped lattice 14c is formed in the window 14b so as to divide the window 14b vertically and horizontally. A linear substrate fixing portion 14d is formed at the lower part on both sides of the frame-like body 14 so as to extend integrally therewith and backward. As shown in FIG. 4, the substrate fixing portion 14d and the frame-like body 14a are arranged so as to form a predetermined angle, for example, an acute angle θ.

枠状体１４ａの両側の後部中央及び上部の後部中央には、後方に直線状に伸びる舌片１４ｅが一体にそれぞれ形成されている。これら舌片１４ｅが、これらに対応して小プリント基板１０に形成した挿通孔１０ａに挿通され、小プリント基板１０側に半田付け等によって固定されている。これによって、図５に示すように、電磁シールドカバー１４の窓１４ｂがフォトダイオード６の受光面６ａと平行な状態で、電磁シールドカバー１４が小プリント基板１０に取り付けられ、フォトダイオード６の受光面６ａが電磁シールドカバー１４によって覆われている。即ち、個々のフォトダイオードに電磁シールドカバー１４がそれぞれ取り付けられている。しかも、フォトダイオード６が平板型であり、そのフォトダイオード６の受光面６ａ側をこれに接近して電磁シールドカバー１４によって覆っているので、受光器４の厚さ寸法を薄くすることができる。   At the rear center of both sides of the frame-shaped body 14a and the rear center of the upper part, tongue pieces 14e extending linearly rearward are integrally formed. The tongue pieces 14e are inserted through insertion holes 10a formed in the small printed circuit board 10 correspondingly, and are fixed to the small printed circuit board 10 side by soldering or the like. As a result, as shown in FIG. 5, the electromagnetic shield cover 14 is attached to the small printed circuit board 10 with the window 14b of the electromagnetic shield cover 14 parallel to the light receiving surface 6a of the photodiode 6, and the light receiving surface of the photodiode 6 6 a is covered with an electromagnetic shield cover 14. That is, the electromagnetic shield cover 14 is attached to each photodiode. In addition, since the photodiode 6 is a flat plate and the light receiving surface 6a side of the photodiode 6 is close to this and covered with the electromagnetic shield cover 14, the thickness of the light receiver 4 can be reduced.

さらに、基板固定部１４ｄの両下部中央には、これと一体にかつ基板固定部１４ｄに垂直に係合部、例えば舌片１４ｆがそれぞれ形成されている。この受光器をプリント基板２に取り付けるときには、図６に示すように、基板２に舌片１４ｆに対応して形成した固定部、例えば挿通孔（図示せず）に舌片１４ｆを係合し、例えば挿通し、舌片１４ｆを基板２に形成した基準電位パターン（図示せず）に半田付けする。この半田付け状態では、固定部１４ｄの下部が基板２に接触した状態であり、電磁シールドカバー１４及びフォトダイオード６が基板２に対して所定角度θをなした状態で取り付けられる。しかも、電磁シールドカバー１４は基準電位パターンに接続されているので、フォトダイオード６に対して電磁シールドが電磁シールドカバー１４によって行われる。   Further, engaging portions, for example, tongue pieces 14f, are formed at both lower centers of the substrate fixing portion 14d, integrally therewith and perpendicular to the substrate fixing portion 14d. When attaching the light receiver to the printed circuit board 2, as shown in FIG. 6, the tongue piece 14f is engaged with a fixing portion formed on the board 2 corresponding to the tongue piece 14f, for example, an insertion hole (not shown), For example, the tongue piece 14 f is soldered to a reference potential pattern (not shown) formed on the substrate 2. In this soldering state, the lower portion of the fixing portion 14 d is in contact with the substrate 2, and the electromagnetic shield cover 14 and the photodiode 6 are attached with a predetermined angle θ with respect to the substrate 2. In addition, since the electromagnetic shield cover 14 is connected to the reference potential pattern, the electromagnetic shield is performed on the photodiode 6 by the electromagnetic shield cover 14.

このように受光器を構成しているので、基板２に受光器の電磁シールドカバー１４を取り付けると、自動的にフォトダイオード６が所定の受光角度をなす。従って、取付後に一々フォトダイオード６の受光角度を調整する必要がない。しかも、この受光角度は変化することはないし、同じ構成の他の基板２に取り付けた場合でも、受光角度は同一であり、基板２ごとに受光角度にバラツキが生じることはない。基板２は、天井に各受光器４が下側に位置するように取り付けられる。従って、机上等の送受話セットから送信された赤外線を受信することができる。   Since the light receiver is configured as described above, when the electromagnetic shield cover 14 of the light receiver is attached to the substrate 2, the photodiode 6 automatically forms a predetermined light receiving angle. Therefore, it is not necessary to adjust the light receiving angle of the photodiode 6 after mounting. In addition, the light receiving angle does not change, and even when the light receiving angle is attached to another substrate 2 having the same configuration, the light receiving angle is the same, and the light receiving angle does not vary from one substrate 2 to another. The substrate 2 is attached to the ceiling so that each light receiver 4 is positioned on the lower side. Therefore, it is possible to receive infrared rays transmitted from a transmission / reception set on a desk or the like.

この赤外線発受光装置では、図１に示すように、各受光器４の内側に、複数の発光素子、例えば複数のＬＥＤ１６が環状にかつ基板２に対して予め定めた角度をなすように取り付けられている。これらＬＥＤ１６は、基板２が上述したように天井に取り付けられた状態において、机上の送受話セットに向かって赤外線を投光する。なお、図示していないが、基板２における各受光器４及びＬＥＤ１６を覆うように赤外線透過型のカバーが取り付けられている。   In this infrared light emitting / receiving device, as shown in FIG. 1, a plurality of light emitting elements, for example, a plurality of LEDs 16, are attached inside the respective light receivers 4 so as to form a predetermined angle with respect to the substrate 2. ing. These LEDs 16 project infrared rays toward the transmitting / receiving set on the desk in a state where the substrate 2 is attached to the ceiling as described above. Although not shown, an infrared transmission type cover is attached so as to cover each light receiver 4 and the LED 16 on the substrate 2.

上記の実施の形態では、各受光器１４とＬＥＤ１６とはそれぞれ別個に基板２に取り付けられている。しかし、例えば小プリント基板１０の先端をさらに延長し、この延長部分にＬＥＤ１６を取り付けるようにすることもできる。この場合、シールドカバー１４を基板２に取り付けることによって、受光器４とＬＥＤ１６との取付を同時に行えるだけでなく、なんら角度調整することなく受光器４とＬＥＤ１６を同時にそれぞれ所定の角度に設定することができる。   In the above embodiment, each light receiver 14 and LED 16 are separately attached to the substrate 2. However, for example, the tip of the small printed circuit board 10 can be further extended, and the LED 16 can be attached to the extended portion. In this case, by attaching the shield cover 14 to the substrate 2, not only the light receiver 4 and the LED 16 can be attached at the same time, but also the light receiver 4 and the LED 16 can be simultaneously set to predetermined angles without any angle adjustment. Can do.

上記の実施形態の受光器４は、フォトダイオード６とは別個に電磁シールドカバー１４を設けたものであるが、第２の実施形態の受光器４ａは、フォトダイオード６０と一体に電磁シールドカバー１４０を設けたものである。即ち、図７（ａ）、（ｂ）に示すようにフォトダイオード６０は、その全域が赤外線透過樹脂からなる筐体６２内に収容されている。フォトダイオード６０の受光面６０ａの前方に所定の間隔をあけて位置するように電磁シールドカバー１４０が、筐体６２内に配置されている。この電磁シールドカバー１４０は、導電性を有する材料によって格子状に形成され、フォトダイオード６０の受光面６０ａ全域を覆うように配置されている。この電磁シールドカバー１４０には、リード１４２が接続されており、このリード１４２は筐体６２の外部に導出され、基準電位に接続される。なお、同図（ａ）、（ｂ）ではフォトダイオード６に対するリードは省略してある。同図（ｃ）は、この受光器４ａの等価回路図である。   The light receiver 4 of the above embodiment is provided with the electromagnetic shield cover 14 separately from the photodiode 6, but the light receiver 4 a of the second embodiment is integrated with the photodiode 60 and the electromagnetic shield cover 140. Is provided. That is, as shown in FIGS. 7A and 7B, the entire region of the photodiode 60 is accommodated in a housing 62 made of an infrared transmitting resin. An electromagnetic shield cover 140 is disposed in the housing 62 so as to be positioned in front of the light receiving surface 60a of the photodiode 60 with a predetermined interval. The electromagnetic shield cover 140 is formed in a lattice shape from a conductive material, and is disposed so as to cover the entire light receiving surface 60 a of the photodiode 60. A lead 142 is connected to the electromagnetic shield cover 140. The lead 142 is led out of the casing 62 and connected to a reference potential. In FIGS. 2A and 2B, the lead to the photodiode 6 is omitted. FIG. 2C is an equivalent circuit diagram of the light receiver 4a.

この実施形態の受光器４ａにおいても、１つのフォトダイオード６０に対して１つの電磁シールドカバー１４０が設けられているので、受光器４ａを第１の実施形態の受光器４よりも更に小型化することができる。従って、この受光器４ａを使用した機器の一例である赤外線発受光装置もさらに小型化することができる。   Also in the light receiver 4a of this embodiment, since one electromagnetic shield cover 140 is provided for one photodiode 60, the light receiver 4a is further downsized than the light receiver 4 of the first embodiment. be able to. Therefore, an infrared light emitting / receiving device which is an example of a device using the light receiver 4a can be further downsized.

第２の実施の形態の受光器４ａでは、電磁シールドカバー１４０を基準電位に接続するためにリード１４２を設けている。しかし、フォトダイオード６０は、通常には逆バイアス状態で使用され、かつそのカソードは交流的に基準電位に接続される。そこで、図８に示すように電磁シールドカバー１４０を筐体６２内でカソードに接続する構成とすれば、リード１４２を設ける必要が無い。   In the light receiver 4a of the second embodiment, a lead 142 is provided to connect the electromagnetic shield cover 140 to a reference potential. However, the photodiode 60 is normally used in a reverse bias state, and its cathode is connected to the reference potential in an alternating manner. Therefore, if the electromagnetic shield cover 140 is connected to the cathode in the housing 62 as shown in FIG. 8, there is no need to provide the lead 142.

上記の実施形態では、受光素子としてフォトダイオードを使用したが、これに限ったものではなく、例えばフォトトランジスタを使用することもできる。   In the above embodiment, the photodiode is used as the light receiving element. However, the present invention is not limited to this. For example, a phototransistor can be used.

本発明の１実施形態の受光器を使用した赤外線発受光装置の斜視図である。1 is a perspective view of an infrared light emitting and receiving device using a light receiver according to an embodiment of the present invention. 図１の赤外線発受光装置の側面図である。FIG. 2 is a side view of the infrared light emitting / receiving device of FIG. 1. 図１の受光器の組み立て図である。FIG. 2 is an assembly diagram of the light receiver in FIG. 1. 図１の受光器の側面図である。It is a side view of the light receiver of FIG. 図１の受光器の斜視図である。It is a perspective view of the light receiver of FIG. 図１の受光器を基板に取り付けた状態の側面図である。It is a side view of the state which attached the light receiver of FIG. 1 to the board | substrate. 本発明の第２の実施形態の受光器の正面図、側面図及び等価回路図である。It is the front view of the light receiver of the 2nd Embodiment of this invention, a side view, and an equivalent circuit schematic. 図７の受光器の変形例の等価回路図である。FIG. 8 is an equivalent circuit diagram of a modification of the light receiver in FIG. 7.

符号の説明Explanation of symbols

２ 基板
４ 受光器
６ フォトダイオード（受光素子）
１０ 小プリント基板（取付板）
１４ 電磁シールドカバー
１４０ 電磁シールドカバー 2 Substrate 4 Receiver 6 Photodiode (light receiving element)
10 Small printed circuit board (mounting plate)
14 Electromagnetic shield cover 140 Electromagnetic shield cover

Claims (2)

受光部への受光に応じて電気信号を発生する１台の受光素子と、
この受光素子の前記受光部の両側及び上部を包囲すると共に、前記受光部に対応する位置に受光窓を有し、前記受光素子が取り付けられている枠状体を備え、この枠状体の下部に連なる板状体の下端部が基板に接触している電磁シールドカバーとを、
具備し、前記電磁シールドカバーは、前記枠状体の下部及び前記板状体の両側に連ねて前記枠状体の後方に伸びる基板固定部を有し、この基板固定部は、その下部が前記枠状体に対して予め定めた斜めの角度をなすように形成され、前記基板固定部は、前記基板の固定部に係合し、この係合状態において前記基板固定部の下部は、前記基板に接触している受光器。 One light receiving element that generates an electrical signal in response to light reception by the light receiving unit;
The frame includes a frame-like body that surrounds both sides and an upper portion of the light-receiving portion of the light-receiving element, has a light-receiving window at a position corresponding to the light-receiving portion, and has the light-receiving element attached thereto. An electromagnetic shield cover in which the lower end of the plate-like body connected to the substrate is in contact with the substrate ,
Comprising the electromagnetic shield cover has a substrate fixing portion lower and lined on either side of the plate-like member extending rearward of the frame-like member of the frame-like member, the substrate fixing portion, the lower portion is the The substrate fixing portion is formed to form a predetermined oblique angle with respect to the frame-like body, and the substrate fixing portion is engaged with the fixing portion of the substrate. In this engaged state, the lower portion of the substrate fixing portion is the substrate. Receiver in contact with 請求項１記載の受光装置において、前記受光素子の前記枠状体への取付は、前記受光素子を取付板に取り付け、この取付板を前記電磁シールドカバーに取り付けることによって行われている受光器。 The light receiving device according to claim 1, wherein the light receiving element is attached to the frame body by attaching the light receiving element to an attachment plate and attaching the attachment plate to the electromagnetic shield cover.
JP2004142446A 2004-03-25 2004-05-12 Receiver Expired - Lifetime JP4044911B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004142446A JP4044911B2 (en) 2004-05-12 2004-05-12 Receiver
DE602005016092T DE602005016092D1 (en) 2004-03-25 2005-03-25 INFRARED COMMUNICATION UNIT FOR TRANSMITTING TRANSMISSION BETWEEN A MAIN UNIT AND A TERMINAL
PCT/JP2005/005496 WO2005093974A1 (en) 2004-03-25 2005-03-25 Photodetector and infrared communication device
EP05721473A EP1732248B1 (en) 2004-03-25 2005-03-25 Infrared communication unit for relaying between a main unit and a terminal unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004142446A JP4044911B2 (en) 2004-05-12 2004-05-12 Receiver

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JP2005327800A JP2005327800A (en) 2005-11-24
JP4044911B2 true JP4044911B2 (en) 2008-02-06

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